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Low-temperature sintered microwave ceramic material and preparation method thereof

A microwave ceramic and low-temperature sintering technology, applied in the field of materials, can solve the problems of poor loss characteristics, difficult to zero-adjust the frequency temperature coefficient, and reduce the sintering temperature, and achieve the effects of high Q value, low price and low loss

Inactive Publication Date: 2013-12-04
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to overcome the defects of poor loss characteristics and difficult zero adjustment of the frequency temperature coefficient of the previous intermediary low-temperature sintered microwave dielectric materials, through the BaO-ZnO-TiO 2 The first, second, and third additives are introduced into the main material as modifiers to significantly reduce the sintering temperature and at the same time reduce the loss deterioration factors caused by sintering aids, and prepare low-loss, near-zero series frequency Microwave ceramic materials suitable for low temperature sintering with temperature coefficient, low cost and good process stability

Method used

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  • Low-temperature sintered microwave ceramic material and preparation method thereof
  • Low-temperature sintered microwave ceramic material and preparation method thereof
  • Low-temperature sintered microwave ceramic material and preparation method thereof

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preparation example Construction

[0039] A preparation method of low-temperature sintered microwave ceramic material, such as figure 1 shown, including the following steps:

[0040] Step 1: BaO-ZnO-TiO 2 Synthesis of main ingredients. Include the following steps:

[0041] Step 1-1: Take BaCO 3 , ZnO and TiO 2 As raw material, according to BaO:ZnO:TiO 2 =1:(0.1~0.7):4 The molar ratio is used to prepare the material, and the prepared material is ball-milled with deionized water as the ball-milling medium, after ball-milling, it is dried at 100°C and passed through a 40-mesh sieve;

[0042] Step 1-2: pre-calcine the mixture treated in step 1-1 at a temperature of 1000°C to 1100°C for 3 to 5 hours to obtain the main crystal phase as BaTi 4 o 9 and BaZn 2 Ti 4 o 11 BaO-ZnO-TiO 2 Ingredients.

[0043] Step 2: First additive synthesis. Include the following steps:

[0044] Step 2-:1: Take BaCO 3 , CuO and B 2 o 3 As a raw material, the material is prepared according to the molar ratio of Ba:Cu:B=1:1:...

Embodiment 1

[0053] Example 1: BaO-ZnO-TiO 2 Comparison of changes in the ratio of main ingredients.

[0054] According to BaO-ZnO-TiO 2 Main ingredient is fixed as 100g, the first additive BaCu (B 2 o 5 ) is fixed at 13g, the second additive composite oxide is fixed at 0.1g, the third additive MnO 2 It is fixed at 0.3g proportioning and weighing. In this process, mainly in BaO-ZnO-TiO 2 Changing BaO-ZnO-TiO in the synthesis of main materials 2 Ratio of main ingredients. Wet milling, adding polyvinyl alcohol aqueous solution to the dried material for granulation, pressing under 25Mpa pressure to obtain a cylindrical green body with a diameter of 15mm and a thickness of 8mm, and then sintering in the air, depending on the ratio of main materials The sintering conditions are slightly changed, the heating rate is 3°C / min, and the low-temperature sintered microwave dielectric ceramics can be prepared with the furnace cooling. The main formula changes, sintering process and dielectric pe...

Embodiment 2

[0055] Embodiment 2: the first additive BaCu (B 2 o 5 ) comparison of doping amount changes.

[0056] According to BaO:ZnO:TiO 2 =1:0.2:4 Synthesis of BaO-ZnO-TiO 2 The main material, the porcelain material formula according to BaO-ZnO-TiO 2 Main ingredient is fixed as 100g, the first additive BaCu (B 2 o 5 ) are 3g, 5g, 7g, 9g, 11g, 13g respectively, the second additive composite oxide is fixed at 0.3g, the third additive MnO 2 It is fixed at 0.3g proportioning and weighing. Wet milling, adding polyvinyl alcohol aqueous solution to the dried material for granulation, pressing under 25Mpa pressure to obtain a cylindrical green body with a diameter of 15mm and a thickness of 8mm, and then sintering in the air, depending on the ratio of main materials The sintering conditions are slightly changed, the heating rate is 3°C / min, and the low-temperature sintered microwave dielectric ceramics can be prepared with the furnace cooling. The main formula changes, sintering process...

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Abstract

The invention discloses a low-temperature sintered microwave ceramic material and a preparation method thereof, and belongs to the technical field of materials. The low-temperature sintered microwave ceramic material comprises a main material-BaO-ZnO-TiO2, a first additive-BaCu(B2O5), a second additive-composite oxide and a third additive-MnO2. The preparation method comprises the following steps: taking BaCO3, ZnO and TiO2 as raw materials for synthesizing the main material-BaO-ZnO-TiO2, taking BaCO3, CuO and B2O3 as raw materials for synthesizing the first additive, taking BaCO3, ZnO, TiO2, SiO2 and B2O3 as raw materials for synthesizing the second additive, adding the first to third additives into the main material, performing ball-milling, drying, sieving, pelletizing, forming and rubber removing, and sintering in air at the temperature of 850-940 DEG C. The low-temperature sintered microwave ceramic material has the characteristics of high Q value, near-zero and serialized frequency temperature coefficient, moderate dielectric constant and good process stability through detection.

Description

technical field [0001] The invention belongs to the technical field of materials, and relates to a microwave ceramic material and a preparation method thereof, in particular to a low-temperature sintered microwave ceramic material and a preparation method thereof. Background technique [0002] The rapid development of microelectronic devices and integrated devices has put forward high requirements for the miniaturization and light weight of electronic equipment. The integration of a single active device can no longer meet the production application. It has become a trend that passive devices must be miniaturized. However, the traditional large volume The metal resonant cavity makes the integration of microstrip circuits difficult. Microwave multi-chip module (MMCM) modules are widely used because of their technical characteristics of light weight, small size, low cost and high reliability. An effective way to realize this technology is to develop multi-layer chip components....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/468C04B35/622
Inventor 唐斌李恩竹余盛全周晓华钟朝位张树人
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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