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Improved Manufacturing Method of Solid Electrolytic Capacitor

A solid-state electrolysis and capacitor technology, applied in the direction of solid electrolytic capacitors, electrolytic capacitors, capacitors, etc., can solve the problems of difficult manufacturing process and assembly, complex process, high short-circuit rate, etc., to improve yield, reduce process time, and simplify complexity. Effect

Active Publication Date: 2016-04-20
钰邦电子(无锡)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this structure has more disadvantages such as complex manufacturing process, high cost, high short circuit rate, difficult manufacturing process and assembly.

Method used

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  • Improved Manufacturing Method of Solid Electrolytic Capacitor
  • Improved Manufacturing Method of Solid Electrolytic Capacitor
  • Improved Manufacturing Method of Solid Electrolytic Capacitor

Examples

Experimental program
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Effect test

no. 1 example 〕

[0048] see figure 1 , which shows the schematic flow chart of the improved manufacturing method of the solid electrolytic capacitor of the first embodiment of the present invention; and refer to figure 2 and 3 , the specific features of each step will be described in detail below.

[0049] Step 1: providing an insulating substrate 10 . The insulating substrate 10 is made of aluminum oxide (Al 2 o 3 ) substrate is most suitable.

[0050] Step 2: forming a conductive colloid containing aluminum powder (not shown). The conductive gel contains 0 to 50 weight percent of thermosetting resin, 30 to 100 weight percent of aluminum powder and 0 to 50 weight percent of curing agent. Specifically, epoxy resin is the most suitable thermosetting resin, but it is not limited thereto; moreover, in order to have better conductivity, the particle size of aluminum powder should be between 0.05 and 5 microns, and the surface of aluminum powder should It can be pre-treated to form a concav...

no. 2 example

[0063] see Figure 4 , which shows a schematic flow chart of the improved manufacturing method of the solid electrolytic capacitor according to the second embodiment of the present invention; and please cooperate Figure 5 , the specific features of each step will be described in detail below.

[0064] Step 1: Provide aluminum powder. A binder, such as camphor, stearic acid, polyvinyl alcohol, naphthalene, etc., can also be added to the aluminum powder, and the amount of the binder is roughly 3 to 5 wt%.

[0065] Step 2, forming an aluminum ingot; specifically, after fully mixing the above-mentioned aluminum powder and a binder, a cold pressing process is performed, and the aluminum powder is pressed into a rectangular aluminum ingot 21 by using a die; preferably Ground, the load during cold pressing is 3 to 15MN (MegaNewton) / m 2 , so that the cold-pressed aluminum ingot 21 has a better bulk density. Moreover, in the above-mentioned cold pressing process, it further includ...

no. 3 example

[0073] see Figure 6 , which shows the schematic flow chart of the improved manufacturing method of the solid electrolytic capacitor of the third embodiment of the present invention; and please cooperate Figure 7 , the specific features of each step will be described in detail below.

[0074] Step 1: making anode foil 31 and cathode foil 32 . Specifically, the anode foil 31 is made by first spraying aluminum powder on the sheet-shaped aluminum foil, and then performing a high-temperature sintering procedure after drying to form an aluminum porous high-temperature sintered body, and then forming an oxide film on the surface of the high-temperature sintered body ; The temperature range and time of the high-temperature sintering process can refer to the first embodiment, so it will not be repeated here; in a variation embodiment, titanium and / or hydrides can also be selectively added to the aluminum powder for sintering additives to become aluminum mixed raw material powder. ...

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Abstract

An improved manufacturing method of a solid electrolytic capacitor, comprising the following steps: firstly, an insulating substrate is provided; then, a plurality of conductive colloids containing aluminum powder are formed on the insulating substrate; afterward, a high-temperature sintering procedure is carried out to make the conductive colloids Metallization to form a plurality of aluminum substrates; after that, a dielectric layer is formed on the surface of each aluminum substrate; after that, an isolation layer is formed on each dielectric layer to define an anode area isolated from each other and a cathode area; finally, a conductive layer is formed on the surface of the dielectric layer of each cathode area to form a solid electrolytic capacitor unit.

Description

technical field [0001] The present invention relates to a manufacturing method of a solid electrolytic capacitor, especially an improved manufacturing method of a solid electrolytic capacitor with simple manufacturing process. Background technique [0002] Due to the continuous evolution of semiconductor technology, semiconductor packaged products are constantly developing into more advanced and sophisticated electronic components under the high demand of the market. As far as the current semiconductor technology is concerned, such as the technology of flip-chip assembly, the design of laminated substrates and the design of passive components, etc., all occupy an indispensable position in the semiconductor industry. [0003] Taking the flip chip / ball array package structure as an example, the chips are arranged on the surface of the package substrate and are electrically connected to each other; The patterned circuit layer can be defined by lithographic etching, and the ins...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G9/00H01G9/052H01G9/15
Inventor 林清封陈明宗林书伃
Owner 钰邦电子(无锡)有限公司
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