Method for preparing er-doped silicon carbide optical waveguide through ion implantation
A silicon carbide optical and ion implantation technology, applied in the direction of light guides, optics, optical components, etc., can solve the problems of low activation efficiency, secondary defects, and restrictions on erbium-doped silicon carbide optical waveguides, so as to avoid low waveguide gain and improve Effects of light gain and enhancement of fluorescence luminous efficiency
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[0027] 1. Example one:
[0028] (1) The silicon carbide sample 1 that has been cut and optically polished is cleaned with acetone and ultrasound, and then the cleaned silicon carbide sample 1 is applied.
[0029] (2) Put the cleaned sample in (1) in the target chamber of the accelerator and vacuumize to 1×10 Pa, perform the oxygen ion implantation process. Implant energy 0.5MeV, implant dose 1×10 ions / cm , The whole process is carried out at a temperature of 600°C.
[0030] (3) Place the sample obtained in (2) in an annealing furnace, and perform high-temperature annealing treatment on the sample in an argon atmosphere. The annealing temperature is controlled at 1200°C and the annealing time is 0.5h. Through this process, a buried silicon dioxide layer 2 with a thickness of approximately 600 nm and a near-stoichiometric ratio can be obtained on the silicon carbide sample.
[0031] (4) Place the sample obtained in (3) in the target chamber of the accelerator and evacuate to 1×10 ...
Example Embodiment
[0035] 2. Embodiment two:
[0036] (1) The silicon carbide sample 1 that has been cut and optically polished is cleaned with acetone and ultrasound, and then the cleaned silicon carbide sample 1 is applied.
[0037] (2) Put the cleaned sample in (1) in the target chamber of the accelerator and vacuumize to 1×10 Pa, perform the oxygen ion implantation process. Injection energy 1MeV, injection dose 2.5×10 ions / cm , The whole process is carried out at a temperature of 650°C.
[0038] (3) Place the sample obtained in (2) in an annealing furnace, and perform high-temperature annealing treatment on the sample in an argon atmosphere. The annealing temperature is controlled at 1200°C and the annealing time is 1h. Through this process, a buried silicon dioxide layer 2 with a thickness of approximately 970 nm with a near-stoichiometric ratio can be obtained on the silicon carbide sample.
[0039] (4) Place the sample obtained in (3) in the target chamber of the accelerator and evacuate to...
Example Embodiment
[0042] 3. Embodiment three:
[0043] (1) The silicon carbide sample 1 that has been cut and optically polished is cleaned with acetone and ultrasound, and then the cleaned silicon carbide sample 1 is applied.
[0044] (2) Put the cleaned sample in (1) in the target chamber of the accelerator and vacuumize to 1×10 Pa, perform the oxygen ion implantation process. Injection energy 2.0MeV, injection dose 2.5×10 ions / cm , The whole process is carried out at a temperature of 650°C.
[0045] (3) Place the sample obtained in (2) in an annealing furnace, and perform high-temperature annealing treatment on the sample in an argon atmosphere. The annealing temperature is controlled at 1200°C and the annealing time is 1h. Through this process, a buried silicon dioxide layer 2 with a thickness of approximately 600 nm and a near-stoichiometric ratio can be obtained on the silicon carbide sample.
[0046] (4) Place the sample obtained in (3) in the target chamber of the accelerator and evacuate...
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