Activating agent for preparation of embedded film resistor, preparation method of embedded film resistor and embedded film resistor

A thin film resistor, embedded technology, applied in resistors, non-adjustable metal resistors, circuits, etc., can solve the problems of unstable plating solution, increased production cost, steam pollution, etc.
CN103484840AActive Publication Date: 2014-01-01SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
Publication Date
2014-01-01

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Abstract

The invention relates to an activating agent for preparation of an embedded film resistor, a preparation method of the embedded film resistor and the embedded film resistor. The activating agent for preparation of an embedded film resistor comprises water, zinc sulfate, DL-sodium malate and zinc powder, wherein the concentration of the zinc sulfate is 20-200 g / L; the concentration of the DL-sodium malate is 10-50 g / L; and the concentration of the zinc powder is 5-30 g / L. The activating agent is free of chlorine and palladium. Experiments prove that after a substrate is activated by using the activating agent, a nickel-phosphorus film can be formed on the substrate at a low temperature through chemical plating, the energy consumption is low, and no chlorine is introduced into the chemical plating solution, thereby ensuring the stability of the plating solution. The activation performed by using the activating agent is beneficial to lower the preparation cost of the embedded film resistor; and ensuring the stability of the plating solution is beneficial to ensure the quality of the nickel-phosphorus film, thereby ensuring that the embedded film resistor has favorable property.
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Description

technical field

[0001] The invention relates to the technical field of electronic materials and components, in particular to an activator for preparing embedded thin-film resistors, a preparation method for embedded thin-film resistors, and embedded thin-film resistors. Background technique

[0002] With the development of high integration and high density of integrated circuits, as well as the high frequency and high speed of digital signal transmission, the printed circuit board (PCB) is required to develop in the direction of miniaturization and portability. Embedded resistor technology can save a large amount of PCB mounting surface area, which can increase the freedom of wiring and integration density of PCB. Therefore, embedded resistor technology will become the mainstream packaging technology in the future, and embedded thin-film resistors have become a current research hotspot.

[0003] At present, alloys such as nickel-chromium (Ni-Cr) or nickel-phosphorus (Ni-P) ...

Claims

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