Activating agent for preparation of embedded film resistor, preparation method of embedded film resistor and embedded film resistor

A thin film resistor, embedded technology, applied in resistors, non-adjustable metal resistors, circuits, etc., can solve the problems of unstable plating solution, increased production cost, steam pollution, etc.

Active Publication Date: 2014-01-01
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This not only increases the production cost, but also may bring chloride ions into the plating solution, resulting in the instability of the plating solution
In addition, at higher temperatures, the generated steam will pollute the surrounding environment

Method used

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  • Activating agent for preparation of embedded film resistor, preparation method of embedded film resistor and embedded film resistor
  • Activating agent for preparation of embedded film resistor, preparation method of embedded film resistor and embedded film resistor
  • Activating agent for preparation of embedded film resistor, preparation method of embedded film resistor and embedded film resistor

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Effect test

preparation example Construction

[0041] see figure 1 , the preparation method of the embedded thin film resistor of an embodiment, comprises the following steps:

[0042] Step S110: providing a substrate.

[0043] Please also see figure 2 , the substrate 10 can be copper foil, aluminum foil or aluminum-magnesium alloy, etc., preferably copper foil. Copper foil has relatively smooth and rough sides. If the surface of other substrates is relatively smooth, one of the surfaces of the substrate needs to be roughened to improve the adhesion of the subsequent electroless plating.

[0044] Firstly, the substrate 10 is cut to a required size, and then a photosensitive film (not shown) is pasted on the smooth surface of the substrate 10 and exposed to light to protect the substrate in the subsequent chemical coating step.

[0045] The substrate 10 is further washed. Washing includes washing with a detergent, and then pickling with a sulfuric acid solution with a mass concentration of 5%.

[0046] Dissolving alk...

Embodiment 1

[0084] Fabrication of Embedded Thin Film Resistors

[0085] 1. Provide 8cm×4cm copper foil. The copper foil has a relatively smooth surface and a rough surface. Paste a photosensitive film on the smooth surface of the copper foil and expose it;

[0086] 2. Weigh 10g of washing powder, add 400ml of deionized water, and prepare detergent for degreasing. Put the copper foil in step 1 into the detergent, ultrasonically treat it for 10 minutes, then take it out and wash it with deionized water;

[0087] 3. Take 20ml of concentrated sulfuric acid and prepare it as dilute sulfuric acid with a mass fraction of 5%. Put the copper foil treated in step 2 into the dilute sulfuric acid, pickle it for 10 minutes, and then take it out and wash it with deionized water;

[0088] 4. Weigh 35g of zinc sulfate, 3.5g of DL-sodium malate and 5g of zinc powder into deionized water to prepare 200mL of activator for the preparation of embedded thin film resistors, heat the activator to 40°C, and then...

Embodiment 2

[0102] Fabrication of Embedded Thin Film Resistors

[0103] 1. Provide 8cm×4cm copper foil. The copper foil has a relatively smooth surface and a rough surface. Paste a photosensitive film on the smooth surface of the copper foil and expose it;

[0104] 2. Weigh 10g of washing powder, add 400ml of deionized water, and prepare detergent for degreasing. Put the copper foil in step 1 into the detergent, ultrasonically treat it for 10 minutes, then take it out and wash it with deionized water;

[0105] 3. Take 20ml of concentrated sulfuric acid and prepare it as dilute sulfuric acid with a mass fraction of 5%. Put the copper foil treated in step 2 into the dilute sulfuric acid, pickle it for 10 minutes, and then take it out and wash it with deionized water;

[0106] 4. Weigh 35g of zinc sulfate, 3.5g of DL-sodium malate and 5g of zinc powder into deionized water to prepare 200mL of activator for the preparation of embedded thin film resistors, heat the activator to 40°C, and then...

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Abstract

The invention relates to an activating agent for preparation of an embedded film resistor, a preparation method of the embedded film resistor and the embedded film resistor. The activating agent for preparation of an embedded film resistor comprises water, zinc sulfate, DL-sodium malate and zinc powder, wherein the concentration of the zinc sulfate is 20-200 g/L; the concentration of the DL-sodium malate is 10-50 g/L; and the concentration of the zinc powder is 5-30 g/L. The activating agent is free of chlorine and palladium. Experiments prove that after a substrate is activated by using the activating agent, a nickel-phosphorus film can be formed on the substrate at a low temperature through chemical plating, the energy consumption is low, and no chlorine is introduced into the chemical plating solution, thereby ensuring the stability of the plating solution. The activation performed by using the activating agent is beneficial to lower the preparation cost of the embedded film resistor; and ensuring the stability of the plating solution is beneficial to ensure the quality of the nickel-phosphorus film, thereby ensuring that the embedded film resistor has favorable property.

Description

technical field [0001] The invention relates to the technical field of electronic materials and components, in particular to an activator for preparing embedded thin-film resistors, a preparation method for embedded thin-film resistors, and embedded thin-film resistors. Background technique [0002] With the development of high integration and high density of integrated circuits, as well as the high frequency and high speed of digital signal transmission, the printed circuit board (PCB) is required to develop in the direction of miniaturization and portability. Embedded resistor technology can save a large amount of PCB mounting surface area, which can increase the freedom of wiring and integration density of PCB. Therefore, embedded resistor technology will become the mainstream packaging technology in the future, and embedded thin-film resistors have become a current research hotspot. [0003] At present, alloys such as nickel-chromium (Ni-Cr) or nickel-phosphorus (Ni-P) ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/30C23C18/34H01C7/00
Inventor 孙蓉苏星松符显珠郭慧子
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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