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Polyamide-imide solution and polyamide-imide film

A polyamide-imide film, polyamide-imide technology, applied in synthetic resin layered products, transportation and packaging, coating and other directions, can solve the problems of surface deterioration, high problem, easy moisture absorption, etc. Effects of low coefficient of linear thermal expansion and excellent coatability

Active Publication Date: 2014-01-08
KANEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Amide-based solvents have high solubility, but on the other hand, due to their high polarity, they are easy to absorb moisture, absorb moisture in the air during coating, and cause phase separation, resulting in whitening of the coating film surface.
In particular, when a batch process is used, it is expected that there will be a waiting time after coating until the next process, so there is a high possibility that whitening will become a problem
Whitening may lead to deterioration of surface properties, which may cause problems in subsequent processing

Method used

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  • Polyamide-imide solution and polyamide-imide film
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  • Polyamide-imide solution and polyamide-imide film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0106] (Evaluation method)

[0107] The material property values ​​and the like described in this specification were obtained by the following evaluation methods.

[0108] (1) Molecular weight of polyamideimide

[0109] The weight average molecular weight (Mw) was calculated|required under the conditions of Table 1. The evaluation results are shown in Table 3.

[0110] [Table 1]

[0111]

[0112] (2) Solubility test of polyamideimide in organic solvent and odor evaluation of organic solvent

[0113] For 0.5 g of polyamideimide obtained in Synthesis Examples 1, 2 and 3, 9.5 g of organic solvents (solid content concentration 5%) recorded in Table 2 were mixed in a sample tube, and the mixture was stirred at room temperature with a magnetic stirrer. Stir at 23 °C. The case of complete dissolution was marked as ◯, the case of partially dissolved and remained was marked as △, and the case of insoluble was marked as ×. Table 2 shows the solvents used, their boiling points, ...

Synthetic example 1）

[0127]

[0128] 2,2'-bis(tri Fluoromethylmethyl)benzidine (hereinafter sometimes referred to as TFMB.) 12.1g, as a polymerization solvent, added 46.6g of dehydrated N,N-dimethylacetamide (DMAC) and stirred, then added 3.0g of pyridine, And stir until uniform, and cool with an ice bath at 5°C. While stirring this solution, 7.9 g of chlorinated trimellitic anhydride was slowly added in a powder state, and stirred in an ice bath at 5°C for 3 hours. In addition, the feed concentration of diamine compound and chlorinated trimellitic anhydride, which are solutes in this solution, was 30% by weight relative to the entire reaction liquid.

[0129] After stirring for 3 hours, 33.4 g of DMAC was added to the above solution to dilute, and after stirring for another 20 hours in a water bath at 25°C, 33.3 g of DMAC was added and stirred until uniform, and then 6.0 g of pyridine was added as an imidization catalyst. Make it completely dispersed. After adding and stirring 9.2 g of aceti...

Embodiment 1）

[0131]

[0132] The polyamideimide obtained in Synthesis Example 1 was dissolved in a mixed solvent with a weight ratio: DMAC / cyclopentanone (hereinafter referred to as CPN) = 70 / 30, and a polyamideimide containing 7% by weight of polyamideimide was produced. The amidoimide solution was applied on a glass plate as a support, and then dried at 60° C. for 10 minutes, then at 150° C. for 60 minutes, and at 300° C. for 60 minutes. The film was then peeled off from the glass plate to obtain a film. Table 3 shows the evaluation results of the obtained films.

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Abstract

A purpose of the present invention is to obtain a polyamide-imide solution which has excellently low linear thermal expansion coefficient and excellent coatability. Another purpose of the present invention is to provide a product or member, which requires high heat resistance and very low linear thermal expansion coefficient, using the polyamide-imide solution. Another purpose of the present invention is to provide a product or member which is specifically suitable for uses wherein a polyamide-imide film that is obtained from the polyamide-imide solution of the present invention is formed on the surface of an inorganic material such as glass, a metal, a metal oxide or a single crystal silicon. The purposes are achieved by a polyamide-imide solution which contains a specific polyamide-imide and an organic solvent and which is characterized in that the organic solvent is a mixed solvent of an amide solvent and a solvent other than an amide solvent and that the solvent other than an amide solvent is composed of at least one solvent that is selected from the group consisting of ether solvents, ketone solvents, ester solvents, glycol ether solvents and glycol ester solvents.

Description

technical field [0001] The present invention relates to a polyamideimide solution and a polyamideimide film obtained from the polyamideimide solution. Furthermore, it relates to a laminate including a polyamide-imide film, a flexible display substrate, a TFT substrate, a color filter, electronic paper, and organic EL. Background technique [0002] In recent years, with the rapid development of displays such as liquid crystal displays, organic EL displays, and electronic paper, as well as electronic products such as solar cells and touch screens, devices are required to be thinner, lighter, and more flexible. In these devices, various electronic components such as thin-film transistors and transparent electrodes are formed on a glass plate. By replacing the glass material with a thin-film material, the panel itself can be made thinner and lighter. However, high temperature processes are required in the formation of these electronic components. [0003] In addition, when the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/14B32B17/10B32B27/34C08L79/08H01L29/786H01L51/50H05B33/02
CPCB32B17/064H01L29/78603C08L79/08B32B2379/08C08G73/14C09D7/20Y10T428/31623B32B17/10H10K77/10B32B27/34H01L29/786H05B33/02G02B5/20H10K77/111H10K50/00
Inventor 藤井真理岩本友典长谷川匡俊
Owner KANEKA CORP
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