Method for preparing photosensitive resin for solder mask ink

A technology of photosensitive resin and solder resist ink, which is applied in the direction of ink, photosensitive materials used in optomechanical equipment, applications, etc. It can solve the problems of easy yellowing of photosensitive resin, reduce the reflectivity of light source, and high product scrap rate, so as to improve the hardness Good weather resistance, UV resistance, and the effect of reducing the content of benzene rings

Active Publication Date: 2014-02-05
ZHUHAI CHANGXIAN CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are following defects in existing photosensitive resin preparation technology: the first, prepare photosensitive resin generally adopt triethylamine as the catalyzer of reaction now, catalytic efficiency is low, and reaction speed is slow, and synthesis time generally will be about 24 hours, because reaction If the time is too long, the side reactions will increase, resulting in the molecular weight distribution of the resin is too wide, the structure of the resin is irregular, and the viscosity of the resin is too high
Even if a polymerization inhibitor is added to prevent side reactions and reduce the reaction time, the polymerization inhibitor cannot absolutely prevent it, and the effect of the polymerization inhibitor can only be effective at a certain temperature and time. fail
Second, due to the low softening point of the raw material o-cresol novolac epox

Method used

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  • Method for preparing photosensitive resin for solder mask ink

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A preparation method of photosensitive resin for solder resist ink, comprising the following steps:

[0024] 1) Take 210 grams of o-cresol novolac epoxy resin (Tg=50-60) and 62.5 grams of DBE solvent into the reaction kettle, and dissolve at a temperature of 90-100 °C. Then take 74 grams of acrylic acid, 0.1 grams of hydroquinone, and 0.1 grams of tetraethylammonium bromide, mix them evenly, and add them dropwise into the reaction kettle at a temperature of 90-100°C, drop them in 2.5-3 hours, and then react After 2 hours, when the acid value was less than 5, the reaction was terminated to obtain prepolymer A.

[0025] 2) Take IPDI444g, PEG200196g. React at 80° until the NCO group content is less than 14.5%, to obtain prepolymer B.

[0026] 3) Take 200 grams of prepolymer B, add it to A, add 77.5 grams of tetramethylbenzene, 100 grams of DBE, and 0.2 grams of dibutyltin laurate as a catalyst. React at 90-100° until the NCO group content is less than 1%. After the rea...

Embodiment 2

[0028] 1) Take 210 grams of o-cresol novolac epoxy resin (Tg=50-60) and 62.5 grams of DBE solvent into the reaction kettle, and dissolve at a temperature of 95-100 °C. Then take 63 grams of acrylic acid, 0.1 grams of hydroquinone, and 0.1 grams of tetraethylammonium bromide, mix them evenly, and add them dropwise into the reaction kettle at a temperature of 90-100°C, drop them in 2.5-3 hours, and then react React for 2 hours, when the acid value is less than 5, the reaction ends and prepolymer A is obtained.

[0029] 2) Take HDI336.16 grams, PEG-1000390 grams. React at 80° until the NCO content is less than 12.4%, to obtain prepolymer B.

[0030] 3) Take 240 grams of prepolymer B, add it to A, add 94.7 grams of tetramethylbenzene, 100 grams of DBE, and 0.2 grams of dibutyltin laurate as a catalyst. React at 90-100° until NCO% is less than 1%. After the reaction, take 76 grams of hexahydrophthalic anhydride and keep it warm at 100-105° until the acid value is 50mgKOH / g-54mgK...

Embodiment 3

[0032] 1) Take 210 grams of o-cresol novolac epoxy resin (Tg=50-60) and 62.5 grams of DBE solvent into the reaction kettle, and dissolve at a temperature of 90-100 °C. Take 105 grams of acrylic acid, 0.1 grams of hydroquinone, and 0.1 grams of tetraethylammonium bromide, mix them evenly, and add them dropwise into the reaction kettle at a temperature of 90-100 ° C. After 2.5-3 hours, the reaction is continued. React for 2 hours, when the acid value is less than 5, the reaction ends and prepolymer A is obtained.

[0033] 2) Take 444 grams of IPDI and 196 grams of PEG-200. React at 80° until the NCO content is less than 14.5%, to obtain prepolymer B.

[0034] 3) Take 200 grams of prepolymer B, add it to A, add 77.5 grams of tetramethylbenzene, 102.6 grams of DBE, and 0.2 grams of dibutyltin laurate as a catalyst. React at 90-100° until NCO% is less than 1%. After the reaction, take 76 grams of hexahydrophthalic anhydride and keep it warm at 100-105° until the acid value is be...

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PUM

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Abstract

The invention discloses a method for preparing photosensitive resin for solder mask ink. The method comprises the following steps: (1) carrying out a ring-opening reaction by taking acrylic acid and o-cresol formaldehyde epoxy resin as raw materials, and adding a polymerization inhibitor hydroquinone and a catalyst tetraethylammonium bromide into the reaction process, thus obtaining a prepolymer A; (2) performing chain extension by using a small molecular weight polyurethane prepolymer of which a polyether or polyester opposite terminal group is an NCO group, thus obtaining a prepolymer B; and (3) enabling the prepolymer A and the prepolymer B to react, and adding tetramethylbenzene and a catalyst dibutyl tin dialurate into the reaction process. Compared with the prior art, the method has the advantages that the production period is short, and the obtained photosensitive resin has the advantages of high-temperature resistance, yellowing resistance, high adhesive force and good insulating performance.

Description

technical field [0001] The invention relates to a preparation method of a photosensitive resin. The photosensitive resin is used for solder resist ink and has the advantages of not being easily yellowed at high temperature and capable of rapid development. Background technique [0002] With the continuous advancement and development of the modern electronics industry, circuit boards have developed rapidly. In the process of making circuit boards, solder resist ink must be used to cover the lines that do not need to be soldered on the surface of the circuit board to prevent short circuit and oxidation during soldering. Therefore, photosensitive resin is a very important component of solder resist ink. However, the solder resist process of circuit boards is usually carried out under high temperature conditions, which requires that the photosensitive resin used in the solder resist ink must be able to withstand high temperatures. [0003] The existing photosensitive resin is ...

Claims

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Application Information

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IPC IPC(8): C08G18/67C08G18/24C08G18/08C08G18/75C08G18/73C08G18/48C08G59/17C09D11/102
CPCC08G18/10C08G18/581C08G59/1466C09D11/101C09D11/102G03F7/004C08G18/58
Inventor 杨伟明强伟锋
Owner ZHUHAI CHANGXIAN CHEM TECH
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