Copper bar structure for electrode connection in electrical etching liquid

Abstract

The invention discloses a copper bar structure for electrode connection in an electrical etching liquid. The copper bar structure comprises an L-shaped copper bar, wherein a fixing hole is formed in one end of the copper bar, a copper clamp is arranged at the other end of the copper bar and comprises a base plate fixed on the copper bar, a trough plate bent into an inverted U-shaped structure is arranged on the base plate, and two ends of the trough plate are respectively connected with the base plate. The copper bar structure has the advantages of a simple structure and low manufacturing cost; due to adoption of a bending design of the copper clamp, a negative plate is stably clamped by using the bending-resistant force of the copper clamp, and connecting and conducting functions can be achieved without other stabilizing materials; and the serial design (copper is generated on cathodes) of one anode and two cathodes is realized and the copper can be electrolyzed to a maximum extent.

Description

technical field [0001] The invention relates to a copper bar structure, in particular to a copper bar structure used for electrode connection in an electrolytic etching solution, and belongs to the field of environmental protection equipment. Background technique [0002] The typical process of printed circuit board (PCB) processing adopts the "pattern plating method". That is to pre-plate a layer of lead-tin corrosion layer on the copper foil part that needs to be reserved on the outer layer of the board (the graphic part of the circuit), and then chemically corrode the rest of the copper foil, which is called etching. PCB etching is divided into two types: alkaline and acidic, one is hydrochloric acid hydrogen peroxide system (acidic); the other is ammonium chloride ammonia water system (alkaline). Alkaline etching solution is mainly suitable for the etching of graphic electroplating metal resist layers, such as printed boards plated with gold, nickel, tin-lead alloy, tin...

AI Technical Summary

Problems solved by technology

It has the selectivity to ion penetration, so that chloride ions basically do not enter the cathode chamber, so that alkali solution with extremely low sodium chloride content can be produced. At present, alkaline etching solution is recycled by hazardous waste recyclers to recover copper. , the production of copper sulfate products requires a large amount of reagents to be consumed during the treatment process, resulting in a large amount of washing wastewater, or the purity of the obtained product is not enough, and the etching solution cannot be directly regenerated, the economic benefit is low, and the invalid etching solution cannot be recovered, which has a certain impact on the environment. impact, and lead to increased energy consumption and cost in the transportation process. In the production equipment of etching solution regeneration cycle, electrolysis is used for treatment, and a structure specially connected to the electrolytic cell needs to be designed.

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