A method capable of improving the conversion efficiency of crystalline silicon solar cells
A solar cell and conversion efficiency technology, which is applied in circuits, photovoltaic power generation, electrical components, etc., can solve problems such as complex process and difficult feasibility, and achieve the effect of simple process, good feasibility, and improved battery conversion efficiency
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0023] Select 156 single crystal silicon wafers, through texturing of silicon wafers (existing process), diffusion PN junction (existing process), etching and cleaning (existing process), PECVD Si plating 3 N 4 Anti-reflection coating (existing technology), film thickness 75nm, refractive index 2.0. Subsequent rare earth Eu 3+ Ion implantation, implantation parameters: implantation energy 70KeV, implantation dose 2×10 15 cm -2 . After the implantation is completed, the silicon wafer is annealed in a high-temperature furnace at 800° C. for 60 minutes in a nitrogen atmosphere, and then taken out and cooled to room temperature. Fluorescence spectrum test is carried out on the sample, and the attached figure 1 excitation and emission spectra. Finally, the samples are made of electrodes by screen printing (existing process) and sintered (existing process) to form a finished crystalline silicon battery with light wave conversion characteristics, and the electrical performance ...
Embodiment 2
[0024] Example 2: Select 156 polycrystalline silicon wafers, through texturing the silicon wafers, diffusing to make PN junctions, etching and cleaning, and PECVD Si plating 3 N 4 Anti-reflection coating, film thickness 80nm, refractive index 2.05. Subsequent rare earth Eu 3+ Ion implantation, implantation parameters: implantation energy 80KeV, implantation dose 1×10 15 cm -2 . After the implantation is completed, the silicon wafer is annealed in a high-temperature furnace at 800° C. for 30 minutes in a nitrogen atmosphere, and then taken out and cooled to room temperature. Fluorescence spectrum test is carried out on the sample, and the attached figure 1 excitation and emission spectra. Finally, the samples were screen-printed to form electrodes and sintered to form a finished crystalline silicon cell with light-wave conversion characteristics, and the electrical performance characteristics of the battery were tested. Compared with the existing ordinary crystalline sili...
Embodiment 3
[0025] Example 3: Select 156 single crystal silicon wafers, through texturing the silicon wafers, making PN junctions by diffusion, etching and cleaning, and Si plating by PECVD 3 N 4 Anti-reflection coating, film thickness 90nm, refractive index 2.1. Subsequent rare earth Tb in the anti-reflection coating 3+ Ion implantation, implantation parameters: implantation energy 100KeV, implantation dose 1×10 15 cm -2 . After the implantation is completed, the silicon wafer is annealed in a high-temperature furnace at 1000° C. for 30 minutes in a nitrogen atmosphere, and then taken out and cooled to room temperature. Fluorescence spectrum test is carried out on the sample, and the attached figure 2 excitation and emission spectra. Finally, the samples were screen-printed to form electrodes and sintered to form a finished crystalline silicon cell with light-wave conversion characteristics, and the electrical performance characteristics of the battery were tested. Compared with t...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com