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Reparative conductive adhesive and preparation method thereof

A conductive adhesive and restorative technology, which is applied in the field of conductive adhesive, can solve the problems of low repair rate, poor conductivity of microcapsules, and difficult preparation of microcapsules, and achieve the effect of simple process and easy control of parameters

Active Publication Date: 2014-03-19
JIANGSU RUIDE NEW ENERGY TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Its main disadvantage is that the repair rate is low
There are two main reasons: first, the liquid in the microcapsules shrinks in volume after curing, so there is stress concentration after the crack is repaired; second, the preparation of microcapsules is difficult, and the encapsulation rate of epoxy resin is low
In addition, the poor conductivity of microcapsules is not conducive to the electrical properties of conductive adhesives.

Method used

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  • Reparative conductive adhesive and preparation method thereof
  • Reparative conductive adhesive and preparation method thereof
  • Reparative conductive adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～6

[0039] The present invention is a kind of restorative conductive adhesive, and its composition comprises: Epoxy resin I, flaky silver powder, curing agent I, epoxy diluent I, coupling agent, and composite mesoporous particle, each parts by weight is shown in Table 1 shown. Wherein, the curing temperature of the epoxy resin composition I composed of the curing agent I, the epoxy resin I and the epoxy diluent I is 60-80°C. The coupling agent can be an organosilane coupling agent; the curing agent I can be dicyandiamide or a modified amine curing agent; the epoxy diluent I can be propylene oxide butyl ether or polypropylene glycol diglycidyl ether. Of course, the selection of the curing agent I and the epoxy diluent I only needs to satisfy the curing of the epoxy resin composition I at a temperature range of 60-80°C.

[0040] Table 1: The contents of each raw material component of the repairable conductive adhesive

[0041]

[0042] Wherein, the composite mesoporous particle...

Embodiment 1

[0054] In Example 1, what is added in step S3 is the pre-polymerized solution of melamine and formaldehyde copolymer obtained by the ratio of melamine, 37% formaldehyde and deionized water in a ratio of 1:1.5:1.6. In Example 2, what is added in step S3 is the pre-polymerization liquid of polyurea-formaldehyde resin obtained by the ratio of 1:1.5 between urea and 37% formaldehyde solution. In embodiment 3~6, what add in step S3 is methacrylic acid monomer, polyvinyl alcohol dispersant, ammonium persulfate initiator, compound emulsifier (OP-10 and sodium dodecylbenzene sulfonate by weight ratio 1:1 mixture), the weight ratio of deionized water, emulsifier, dispersant, initiator and monomer is 600~1800:8~12:0.5~1.5:0.1~0.3:100. Wherein, the selection of specific process parameters in steps S1-S3 is shown in Table 4.

[0055] Table 4: Specific process parameter table

[0056]

[0057]

[0058] The restorative conductive adhesive obtained in Examples 1-6 was cured at 60-80°...

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Abstract

The invention relates to a reparative conductive adhesive. The reparative conductive adhesive consists of the following components in parts by weight: 100 parts of epoxy resin I, 250-900 parts of sheet silver powder, 10-50 parts of a curing agent I, 0-40 parts of an epoxy diluent I, 3-20 parts of a coupling agent and 8-60 parts of composite mesoporous particles, wherein a curing temperature of an epoxy resin composition I consisting of the curing agent I, the epoxy resin I and the epoxy diluent I is 60 DEG C-80 DEG C; the composite mesoporous particles adopt mesoporous silicon dioxide loaded with nano sliver as a carrier, a wall capsule material layer is arranged on the outer surface of the carrier, an epoxy resin composition II is contained in a mesopore, the curing temperature of the epoxy resin composition II is not lower than 150 DEG C, an epoxy diluent II in the epoxy resin composition II is not dissolved or difficultly dissolved in water with a boiling point not lower than 150 DEG C. The invention further relates to a preparation method of the reparative conductive adhesive. The conductive adhesive is high in repair efficiency and can avoid generating stress concentration at repaired cracks.

Description

technical field [0001] The invention relates to conductive glue, in particular to a repairable conductive glue and a preparation method thereof. Background technique [0002] As a development trend of conductive adhesives, repairable conductive adhesives are of great significance because they can improve the reliability and service life of electrical conduction and expand the application fields of conductive adhesives. [0003] At present, the repairable conductive adhesive is mainly by adding microcapsule powder in the conductive adhesive. The repair mechanism of this conductive silver adhesive is: when the cured conductive adhesive is subjected to external force or micro-cracks are generated inside due to fatigue, the inside of the microcapsule powder Contains nano-silver, latent curing agent, epoxy resin, etc. to release and fill into the cracks to cure the bonding cracks, to achieve double repair of cracks and conductive networks. Its main disadvantage is that the repai...

Claims

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Application Information

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IPC IPC(8): C09J9/02C09J163/00C09J11/04C09J11/06
Inventor 戈士勇
Owner JIANGSU RUIDE NEW ENERGY TECH
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