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Preparation method of flexible thermal interface material of epoxy resin compounded carbon nanotube array

A technology of carbon nanotube arrays and thermal interface materials, which is applied in the field of preparation of thermal interface materials, can solve the problems of poor mechanical properties of carbon nanotube arrays, affecting the thermal conductivity of composite materials, and small array volume ratios, achieving good thermal conductivity, Effects of improving tensile toughness and improving thermal conductivity

Inactive Publication Date: 2014-03-26
NANJING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In 2004, Sample.et first proposed that the orderly arrangement of carbon nanotubes on the interface can effectively reduce the thermal resistance of the interface. Tong.et measured the thermal conductivity of carbon nanotube arrays to ~265 W / mK. Carbon nanotube arrays were once considered the most There are potential thermal interface materials, but the pure carbon nanotube arrays have poor mechanical properties and must be combined with polymers. Among them, reference 1 (M. Amy Marconnet, Thermal Conduction in Aligned Carbon Nanotube Polymer Nanocomposites with High Packing Density , ACS NANO, 2011) When the volume share of carbon nanotube arrays in epoxy resin increases to 16.7%, its thermal conductivity reaches 4.36W / mK, which is 18.5 times that of pure epoxy resin; comparative literature 2 (H. Huang , Aligned Carbon Nanotube Composite Films for Thermal Management, Advanced Materials, 2005) embedded CNT arrays in the polymer matrix TIM, and designed an in-situ (in-situ) TIM measurement system to find a thermal conductivity of 0.4vol% CNT / S160 It is 1.21 W / mK, which is based on polymer and embedded in the array. Due to the small volume ratio of the array and it is difficult to increase it, the carbon nanotube growth method leads to differences in density and tube diameter, which affects the thermal conductivity of the composite material.

Method used

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  • Preparation method of flexible thermal interface material of epoxy resin compounded carbon nanotube array
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  • Preparation method of flexible thermal interface material of epoxy resin compounded carbon nanotube array

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Embodiment 1

[0025] As a first step, the first will have SiO 2 The Si substrate of the oxide layer was cut into 3×3cm, and high-purity N 2 Blow clean the surface. With toluene as the carbon source and ferrocene as the catalyst, configure 4% ferrocene / toluene solution, take 10ml of the solution and put it into the syringe. In the furnace, Ar was used as the carrier, and the carbon nanotube array was grown at 740 °C for 2~3 hours by means of floating assisted catalysis. After the reaction, the carbon nanotube array was obtained with a diameter of about 80nm, a height of about 400μm~1mm, and a density of 5.97×10 9 ~6.89×10 9 tubes / cm 3 .

[0026] In the second step, take epoxy resin (E44) and polyamide-650 (curing agent), the curing agent is 80wt%-120wt% of the epoxy resin, and then add two Butyl ester (toughening agent), stir evenly to make a polymer system, preheat and dilute the polymer system at 40-60°C during the stirring process, heating time 5-10min, so that the bubbles gradually ...

Embodiment 2

[0029] As a first step, the first will have SiO 2 The Si substrate of the oxide layer was cut into 3×3cm, and high-purity N 2 Blow clean the surface. With toluene as the carbon source and ferrocene as the catalyst, configure 4% ferrocene / toluene solution, take 10ml of the solution and put it into the syringe. In the furnace, Ar was used as the carrier, and the carbon nanotube array was grown at 740 °C for 2~3 hours by means of floating assisted catalysis. After the reaction, the carbon nanotube array was obtained with a diameter of about 80nm, a height of about 400μm~1mm, and a density of 5.97×10 9 ~6.89×10 9 tubes / cm 3 .

[0030] In the second step, take epoxy resin (E44) and polyamide-650 (curing agent), the curing agent is 80wt%-120wt% of the epoxy resin, and then add two Butyl ester (toughening agent), stir evenly to make a polymer system, preheat and dilute the polymer system at 40-60°C during the stirring process, heating time 5-10min, so that the bubbles gradually ...

Embodiment 3

[0033] As a first step, the first will have SiO 2 The Si substrate of the oxide layer was cut into 3×3cm, and high-purity N 2 Blow clean the surface. With toluene as the carbon source and ferrocene as the catalyst, configure 4% ferrocene / toluene solution, take 10ml of the solution and put it into the syringe. In the furnace, Ar was used as the carrier, and the carbon nanotube array was grown at 740 °C for 2~3 hours by means of floating assisted catalysis. After the reaction, the carbon nanotube array was obtained with a diameter of about 80nm, a height of about 400μm~1mm, and a density of 5.97×10 9 ~6.89×10 9 tubes / cm 3 .

[0034] In the second step, take epoxy resin (E44) and polyamide-650 (curing agent), the curing agent is 80wt%-120wt% of the epoxy resin, and then add two Butyl ester (toughening agent), stir evenly to make a polymer system, preheat and dilute the polymer system at 40-60°C during the stirring process, heating time 5-10min, so that the bubbles gradually ...

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Abstract

The invention belongs to a preparation method of a flexible thermal interface material of an epoxy resin compounded carbon nanotube array. A carbon nanotube array is used as a heat conducting framework of the composite material and is compounded with epoxy resin, a toughening agent is added to improve the stretching toughness, and the surface of the composite material is ground to expose a carbon nanotube end which is used as a thermal interface contact layer. The preparation method comprises the steps of firstly, preparing the carbon nanotube array on a Si substrate by using a CVD (Chemical Vapor Deposition)-flotation assisted catalysis method; then, compounding the carbon nanotube array with an epoxy resin system, wherein dibutyl ester used as the toughening agent is added into the epoxy resin system; curing in vacuum and at constant temperature, and then, thinning a sample through a thinning machine to expose the tube end; polishing the surface to obtain the flexible thermal interface material of the epoxy resin compounded carbon nanotube array. The thermal interface material prepared by the invention has favorable heat conducting performance and certain flexible stretching toughness, and can be jointed with a thermal interface to help the interface radiate heat.

Description

technical field [0001] The invention belongs to a preparation technology of a thermal interface material, in particular to a method for preparing a flexible thermal interface material with a toughening agent-modified epoxy resin composite carbon nanotube array. Background technique [0002] With the rapid increase in integration, packaging density and operating frequency of electronic chips, the heat flux density of chips increases rapidly, which brings great challenges to chip heat dissipation. Among them, contact thermal resistance is one of the main factors affecting chip heat dissipation. It is urgent to develop high thermal conductivity performance of thermal interface materials, and research on methods for enhancing interfacial heat transfer. Existing thermal interface materials (TIM), in addition to low-melting point solders and silver pastes composed of precious metals In, Au, Ag, and harmful metals Pb, are more commonly used in polymers with thermally conductive fil...

Claims

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Application Information

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IPC IPC(8): C08L63/02C08K7/00C08K3/04C08K5/10
Inventor 李强宣益民王苗
Owner NANJING UNIV OF SCI & TECH