Ultraviolet light curing adhesive for printing and dyeing

Abstract

The invention discloses an ultraviolet light curing adhesive for printing and dyeing. The ultraviolet light curing adhesive comprises a component A and a component B, wherein the component A comprises 1-2 parts by weight of polyoxyethylene ester stearate, 2-5 parts by weight of calcium carbonate, 12-15 parts by weight of an anti-ageing agent, 30-35 parts by weight of water-soluble acrylic ester, 12-15 parts by weight of a defoaming agent, 10-12 parts by weight of a single-alkoxy pyrophosphate type coupling agent, 45-50 parts by weight of glycidyl ether epoxy resin, 5-10 parts by weight of pigments and 2-5 parts by weight of hydrophilic type gas phase silica; the component B comprises 2-3 parts by weight of sodium pyrophosphate, 40-45 parts by weight of sodium thiosulfate and 60-65 parts by weight of a polymer type thioxanthone photoinitiator; when the ultraviolet light curing adhesive is used, the component A is mixed with the component B according to the mass ratio of 7: 3. The ultraviolet light curing adhesive for printing and dyeing is high in photosensitivity to ultraviolet ray with a certain wave length, and can be rapidly cured, so that the plate making time and cost can be saved; before being cured at high temperature, the ultraviolet light curing adhesive can be cleaned by water, thus being convenient to use.

Description

technical field [0001] The invention relates to an ultraviolet light curing adhesive for printing and dyeing. Background technique [0002] In the printing and dyeing industry, in order to make printing patterns on circular nickel screens, flat screens or rollers for printing, the film method or inkjet or wax spray method is used. Because the sensitivity of the photosensitive adhesive used is not enough, the power of the ultraviolet lamp for exposure Large, long exposure curing time, with the improvement of the pattern making method, the power of the exposure light source is required to be smaller and smaller, and the exposure time is shorter and shorter, especially the recently developed semiconductor laser direct plate-making technology, the semiconductor laser used for the exposure light source, the power Only tens of milliwatts to more than one hundred milliwatts, and the exposure time is a few thousandths of a second, or even less. The original photosensitive adhesive o...

AI Technical Summary

Problems solved by technology

[0002] In the printing and dyeing industry, in order to make printing patterns on circular nickel screens, flat screens or rollers for printing, the film method or inkjet or wax spray method is used. Because the sensitivity of the photosensitive adhesive used is not enough, the power of the ultraviolet lamp for exposure Large, long exposure curing time, with the improvement of the pattern making method, the power of the exposure light source is required to be smaller and smaller, and the exposure time is shorter and shorter, especially the recently developed semiconductor laser direct plate-making technology, the semiconductor laser used for the exposure light source, the power Only a few tens of milliwatts to more than one hundred milliwatts, and the exposure time is a few thousandths of a second, or even less. The original photosensitive adhesive obviously cannot meet this requirement.