Solvent-free UV (ultraviolet) curing glue for optical transparent adhesive tape and preparation method and application thereof

Abstract

The invention belongs to the technical field of UV (ultraviolet) curing glue, and discloses solvent-free UV curing glue for an optical transparent adhesive tape and a preparation method and application thereof. The glue comprises the following components in parts by mass: 20-60 parts of aliphatic polyurethane acrylate, 5-15 parts of hyperbranched polyester acrylate, 10-25 parts of acrylate monomer, 1-10 parts of thiol, 1-10 parts of tackifying resin, 0.1-1 part of leveling agent, 0.5-2 parts of antifoaming agent and 0.5-2 parts of photoinitiator. In the invention, the colloid crosslinking density and colloid strength are improved by preferentially adopting aliphatic polyurethane acrylate with low functionality degree and adding hyperbranched polyester acrylate; the acrylate monomer adjusts the viscosity and enhances the colloid strength; the caking property is improved by adding the thiol containing an ether structure; the prepared non-solvent UV curing glue for an optical transparent adhesive tape has high toughness, high light transmittance, low haze, high colloid strength, high viscosity, high thickness and low VOC (volatile organic compound) content.

Description

technical field [0001] The invention belongs to the technical field of UV curable glue, in particular to a solvent-free UV curable glue for optical scotch tape and its preparation method and application. Background technique [0002] Optical Transparent Tape (OCA) is a double-sided adhesive tape with optical properties and no matrix material. Optically transparent tape (OCA) is used in a wide variety of applications. At present, it is mainly used in the bonding of materials in three types of fields, including: thin film (TP) materials for touch screens, protective films, and materials for liquid crystal displays (LCD). [0003] At present, the curing method of optical transparent tape is mainly heat curing. OCA products produced by thermal curing are limited by the activation period of the glue, with high volatile organic compound (VOC) content and long production cycle. The sub-stability is difficult to control, and it is impossible to produce thick OCA (thick OCA genera...

AI Technical Summary

Problems solved by technology

OCA products produced by thermal curing are limited by the activation period of glue, with high volatile organic compound (VOC) content and long production cycle. Sub-stability is not easy to control, and it is impossible to produce thick OCA (thick OCA generally refers to the effective adhesive layer thickness ≧ 175um) products. At the same time, there are defects such as high production energy consumption, which seriously restricts the development of related domestic industries.

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