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Substitution and chemistry deposition compound preparation method for nano silver coated copper powder

A chemical deposition and nano-silver technology, which is applied in the field of nano-silver-coated copper powder, can solve problems such as complex processes, and achieve the effect of simplifying the synthesis process and reducing costs.

Inactive Publication Date: 2014-04-30
NANJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The reduction method needs to pickle the copper powder, put it into the reducing agent solution after sensitization and activation, and the process is complicated

Method used

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  • Substitution and chemistry deposition compound preparation method for nano silver coated copper powder
  • Substitution and chemistry deposition compound preparation method for nano silver coated copper powder

Examples

Experimental program
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Effect test

Embodiment 1

[0027] Polyvinylpyrrolidone (5g) and copper sulfate (0.8g, 5mmol) were dissolved in 500ml of deionized water, adjusted to pH=12 with concentrated ammonia water to obtain solution I, polyvinylpyrrolidone (5g) and 80% hydrazine hydrate (3.125g , 0.05mol) was dissolved in 500ml deionized water to obtain solution II, and solution II was slowly added dropwise to solution I under anaerobic conditions, the reaction temperature was 15°C, magnetic stirring, 1h dropwise addition was completed, and the reaction was continued for 3h to obtain purple-red copper powder suspension. Dissolve polyvinylpyrrolidone (25g) and silver nitrate (1.7g, 0.01mol) in 500ml deionized water, adjust pH=10 with concentrated ammonia water to obtain silver ammonia solution III, and slowly drop solution III into the above copper under anaerobic conditions In the powder suspension, inject 30% formaldehyde (0.5g, 5mmol) into the reaction system after reacting for 2h, continue reacting for 2h, the solution turns f...

Embodiment 2

[0029] Hexadecyltrimethylammonium bromide (15g) and cupric chloride (1.35g, 0.01mol) were dissolved in 500ml deionized water, and adjusted to pH=9 with concentrated ammonia water to obtain cuproammonia solution I. Alkyltrimethylammonium bromide (15g) and 80% hydrazine hydrate (12.5g, 0.2mol) were dissolved in 500ml deionized water to obtain reducing solution II, and solution II was slowly added dropwise to solution I under anaerobic conditions, The reaction temperature was 45° C., magnetic stirring was performed, and the dropwise addition was completed after 2 hours, and the reaction was continued for 2 hours to obtain a purple-red copper powder suspension. Add cetyltrimethylammonium bromide (15g) and silver oxide (2.32g, 0.01mol) into 500ml deionized water, adjust pH=11 with concentrated ammonia water to obtain silver ammonia solution III, and dissolve the solution under anaerobic conditions III was slowly dropped into the above-mentioned copper powder suspension, and after 1...

Embodiment 3

[0031]Sodium dodecylsulfonate (15g) and copper nitrate (1.88g, 0.01mol) were dissolved in 500ml of deionized water, adjusted to pH=10 with concentrated ammonia water to obtain cuproammonia solution I, and sodium dodecylsulfonate (15g) and 80% hydrazine hydrate (18.75g, 0.3mol) were dissolved in 500ml deionized water to obtain reducing solution II, and solution II was slowly added dropwise to solution I under anaerobic conditions, the reaction temperature was 35 ° C, magnetic stirring, After 2 hours of dropwise addition, the reaction was continued for another 2 hours to obtain a purple red copper powder suspension. Add sodium dodecylsulfonate (15g) and silver oxide (4.64g, 0.02mol) into 500ml of deionized water, adjust the pH=11.5 with concentrated ammonia water to obtain silver ammonia solution III, slowly drop solution III under anaerobic conditions into the above-mentioned copper powder suspension, react for 2 hours, inject 30% formaldehyde (5 g, 0.05 mol) into the reaction ...

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Abstract

The invention discloses a method for preparing nano silver coated copper powder for conductive filler through reduction for a plurality of components; the method comprises the steps of preparing nano-copper powder through hydrate reduction method, adding Tollens' reagent and formaldehyde into the reaction system without separation and purification, and plating the silver on the surface of copper for preparing silver coated copper powder for electrocondution slurry through substitution-chemistry reduction compound method. The copper powder prepared by the invention can be plated with silver without separation and purification condition, so the pickling and sensitization process can be saved, the ammonium hydroxide is used for adjusting the pH of the solution as well as chelating agent for fitting the copper and silver, and the second type chelating agent is not needed, so the synthetic process is simplified and the cost is reduced. The silver coated copper powder is good in dispersibility, oxidation resistance and thermal stability, the electrical resistivity is 1*10<6> to 1*10<4>ohm*m, the nano silver coated copper powder is the spherical particle with core / shell structure, the core is copper and the shell is silver, the grain size is 20-100nm, the plating layer is even and compact and the silver content is 25-60%.

Description

technical field [0001] The invention relates to a method for preparing nano silver-coated copper powder for conductive fillers by using multi-component reduction. Background technique [0002] The development of nanotechnology has realized the uniform dispersion of conductive metals in polymer resins to form conductive fillers, which can be made into conductive adhesives, conductive coatings, conductive rubber, etc., which are widely used in electronics, electromechanical, communications, printing, aerospace , weapons and other sectors of conduction, electromagnetic shielding and other fields. Most of the conductive phases are based on noble metal powders such as platinum, palladium, gold, and silver. Among them, nano-silver has been studied most deeply, but its high price and its own defects in silver migration limit its application in some fields. In response to this problem, people have developed conductive nano-copper powder, but its anti-oxidation performance is poor, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/24
Inventor 关建宁孙枭斐孟晓冬韩博王癸月高铁正
Owner NANJING UNIV OF TECH
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