High-thermal-conductivity polymer composite and preparation method thereof

Abstract

The invention discloses a high-thermal-conductivity polymer composite and a preparation method thereof. The high-thermal-conductivity polymer composite comprises the following components: 25-60 parts of matrix resin, 0.5-10 parts of carbon fiber, 30-60 parts of large-particle size heat conducting filler with particle size of 10-150 microns, 3-10 parts of small-particle size heat conducting filler with particle size of 1-500nm, 3-8 parts of glass fiber, 1-5 parts of elastomer, 1-5 parts of compatilizer, 0.2-0.4 parts of coupling agent KH560 and 0.2-0.4 part of antioxidant. In the invention, the raw materials are reasonably matched, and the synergistic effect among the fiber, large-particle size heat conducting filler and small-particle size heat conducting filler is fully played; by virtue of surface treatment on the heat conducting filler and the preparation process of masterbatch, the compatibility between the heat conducting filler and the matrix is effectively improved, and the prepared polymer composite has good mechanical property and high thermal conductivity.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a high thermal conductivity polymer composite material and a preparation method thereof. Background technique [0002] Thermally conductive materials are widely used in various sectors of the national economy and industrial fields. Traditional thermal conductive materials are mainly metal materials and inorganic materials, such as Al, Cu, Ag, etc., and inorganic materials such as graphite, carbon black, SiC, AlN, etc. With the advancement of industrial development and technology, people put forward more new requirements for thermal conductive materials, such as electrical insulation, corrosion resistance, light weight, easy processing and molding, etc., and high-tech electronic products are developing in the direction of small, light and thin , the number of internal integration of electronic components is increasing, and its heat dissipation problem needs ...

AI Technical Summary

Problems solved by technology

Traditional materials can no longer solve the above problems. This is because although metal materials have good heat dissipation, they are good conductors of electricity, which will affect the operation of circuits. The emergence of polymer materials that have both thermal conductivity and insulation can well solve the above problems

Moreover, the electrolysis and electroplating processes of aluminum, the most widely used heat dissipation material, cause environmental pollution, and the metal density is high, the processing cost is high, and the degree of freedom in design is low.

However, the existing polymer materials have low thermal conductivity and cannot be a good substitute for aluminum as a heat dissipation material.

At present, technicians mainly increase the thermal conductivity of polymer materials by adding nitrides, carbides, metal powders, graphite, etc. The disadvantages of this method are that the addition amount is large, the compatibility with the matrix is ​​poor, the mechanical properties are seriously The performance is not ideal, and the thermal conductivity needs to be further improved

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