High-thermal-conductivity polymer composite and preparation method thereof
A composite material and polymer technology, applied in the field of high thermal conductivity polymer composite material and its preparation, can solve the problems of further improvement of thermal conductivity, loss of mechanical properties, high processing cost, and achieve suitable large-scale production, good mechanical properties, The effect of improving compatibility
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0026] The preparation method of high thermal conductivity polymer composite material includes the following steps:
[0027] 1) The coupling agent is formulated into a 1-3wt% ethanol solution;
[0028] 2) After the carbon fiber is etched, it is immersed in a proper amount of coupling agent ethanol solution, and then evaporated to remove the ethanol;
[0029] 3) Melt extrude and pelletize polyphenylene sulfide with a formula amount of 32-78% and the carbon fiber treated in step 2) through a twin-screw extruder to obtain polyphenylene sulfide / carbon fiber masterbatch;
[0030] 4) Melt extrude and pelletize nylon and glass fiber with a formula amount of 50-72% through a twin-screw extruder to obtain nylon / glass fiber masterbatch;
[0031] 5) The remaining nylon, remaining polyphenylene sulfide, elastomer, and compatibilizer are melt extruded and pelletized through a twin-screw extruder to obtain nylon / polyphenylene sulfide / elastomer masterbatch;
[0032] 6) Mix the large particle size therm...
Example Embodiment
[0038] Example 1
[0039] High thermal conductivity polymer composite material, including the following components: 22 parts of polyphenylene sulfide, 9.5 parts of nylon 66, 1 part of carbon fiber (average aspect ratio of 20, thermal conductivity of 500W / mk), and 56 parts of large particle size thermally conductive filler (23 parts of carbonyl iron powder with a particle size of 56 microns, 2.5 parts of copper powder with a particle size of 38 microns, 5 parts of aluminum powder with a particle size of 25 microns, 25.5 parts of graphite with a particle size of 75 microns), 4 parts of small particle size thermally conductive filler ( 1.3 parts of 70-nanometer multi-walled carbon nanotubes, 1.6 parts of 25-nanometer graphene, 1.1 parts of 105-nanometer diamond powder), 4 parts of glass fiber, 2 parts of POE, 1 part of POE-g-MAH , 0.2 parts of coupling agent KH560, 0.12 parts of antioxidant 445 and 0.18 parts of antioxidant 619.
[0040] The preparation process is as follows:
[0041]...
Example Embodiment
[0049] Example 2
[0050] High thermal conductivity polymer composite material, composed of the following components: 10.5 parts of polyphenylene sulfide, 25 parts of nylon 66, 5 parts of carbon fiber (average aspect ratio of 50, thermal conductivity of 600W / mk), large particle size thermally conductive filler 49 Parts (18 parts of carbonyl iron powder with a particle size of 35 microns, 2 parts of copper powder with a particle size of 46 microns, 5 parts of aluminum powder with a particle size of 68 microns, 24 parts of graphite with a particle size of 77 microns), 5 parts of small particle size thermally conductive filler (2.3 parts of 12-nanometer multi-walled carbon nanotubes, 1.6 parts of 88-nanometer graphene, 1.1 parts of 165-nanometer diamond powder), 3 parts of glass fiber, 1 part of POE, POE-g-MAH 1 Parts, 0.2 parts of coupling agent KH560, 0.12 parts of antioxidant 445 and 0.18 parts of antioxidant 619.
[0051] The preparation process is as follows:
[0052] (1) Prepar...
PUM
Property | Measurement | Unit |
Thermal conductivity | aaaaa | aaaaa |
Thermal conductivity | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information

- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2023 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap