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Preparation method of IGZO (Indium Gallium Zinc Oxide) target

A target, press molding technology, applied in the field of high-performance IGZO target preparation, can solve the problems of insufficient precipitation, improper composition ratio, unstable powder characteristics, etc.

Active Publication Date: 2014-05-28
洛阳晶联光电材料有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing IGZO target preparation method is mainly to prepare IGZO powder by co-precipitation method, and then granulate, press and sinter to obtain IGZO target material. When the precipitation cannot be carried out at the same time, sufficient precipitation cannot be guaranteed, resulting in an improper proportion of ingredients, resulting in unstable characteristics of the powder and low activity of the powder. Therefore, the target fired from the IGZO powder obtained by this method The relative density is low, basically 90-95%, and it is impossible to obtain high relative density IGZO targets (relative density>98%)

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Embodiment 1: the Ga 2 o 3 (Gallium oxide) nanopowder, ZnO (zinc oxide) nanopowder and In 2 o 3 (indium oxide with a specific surface area of ​​25m 2 / g) The nano-powder is placed in a ball mill according to the atomic ratio In:Ga:Zn=1: 1: 1, and is evenly ball-milled to obtain IGZO (indium gallium zinc oxide) powder, and then add 2% of the mass of IGZO powder as a binder PVA (polyvinyl alcohol) is sprayed and granulated; the IGZO granulated powder is put into the mold and pressed in a hydraulic press with 50MPa, and the biscuit formed for the first time is subjected to a second pass in a cold isostatic press with 270MPa. Forming, after the cold isostatic pressing is completed, the pressure relief operation is performed, and the pressure relief is carried out slowly at 5MPa / min, and finally to normal pressure, and the formed green body is taken out to obtain high density (relative density 55%-60 %) IGZO green body. Then put the pressed green body in an oxygen atmos...

Embodiment 2

[0017] Embodiment 2: the Ga 2 o 3 (Gallium oxide) nanopowder, ZnO (zinc oxide) nanopowder and In 2 o 3 (Indium oxide) nano-powders are put into a ball mill according to the atomic ratio In:Ga:Zn=1: 1: 2 and mixed uniformly to obtain IGZO (indium gallium zinc oxide) powder, and then add 4% of IGZO powder mass to bond The agent PVA (polyvinyl alcohol) is sprayed and granulated; the IGZO granulated powder is put into the mold and pressed in a hydraulic press with 70MPa, and the green body formed for the first time is subjected to a second cold isostatic press with 250MPa. After the first molding, after the cold isostatic pressing is completed, the pressure relief operation is performed. During the pressure relief, the pressure relief is carried out slowly at 8MPa / min, and finally to normal pressure, and the formed green body is taken out to obtain high density (relative density 55%- 60%) IGZO bisque. Then put the pressed green body in an oxygen atmospheric pressure sintering ...

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Abstract

The invention relates to a preparation method of a target, in particular to a preparation method of a high-performance IGZO (Indium Gallium Zinc Oxide) target. The method comprises the following steps of: (1) uniformly ball-milling and mixing Ga2O3 nano-powder, ZnO nano-powder and In2O3 nano-powder at an atomic ratio In:Ga:Zn of 1:(1-5):(1-5) to form IGZO powder, adding PVA (Polyvinyl Acetate) accounting for 1-5% of the mass of the IGZO powder for granulation, (2) loading the IGZO powder into a mold for compression molding at 40-80MPa, performing secondary moulding on a biscuit moulded for the first time at 200-300 MPa, releasing pressure at 4-8MPa / min to the ordinary pressure, then taking out a moulded biscuit, and (3) putting the biscuit in a sintering furnace for sintering: heating to 1300-1550 DEG C at a heating rate of less than 1 DEG C / min, holding, and sintering for 4-10h, then cooling to 950-1050 DEG C at a cooling rate of 0.5-1 DEG C / min, then naturally cooling, and obtaining the IGZO target. The method can prepare the high-performance IGZO target (high density, relative density greater than 98%, and high conductivity), and fills in the blank of producing and fabricating the high-performance IGZO target domestically.

Description

technical field [0001] The invention relates to a method for preparing a target, in particular to a method for preparing a high-performance IGZO target. Background technique [0002] Semiconductor materials composed of In (indium), Ga (gallium), Zn (zinc), and O (oxygen) are used in transistors (TFT: thin-film transistors) for driving pixels in liquid crystal displays and organic EL displays, which can greatly reduce the cost of these displays. power consumption. Traditional polysilicon thin film transistors have poor uniformity and complex manufacturing process; metal oxide IGZO TFT has high mobility, good uniformity, transparency, and simple manufacturing process, which can better meet the needs of large-size liquid crystal displays and active organic electroluminescence. . Since the electron mobility of IGZO is about 20 to 50 times that of a-Si TFT, the utilization rate of backlight is improved, so the resolution can be more than 2 times that of ordinary TFT screens. I...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/01C04B35/453C04B35/622
Inventor 何建进黄誓成陆映东
Owner 洛阳晶联光电材料有限责任公司
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