Plating solution formula of chemical nickel-phosphate plating alloy

An electroless nickel-plating phosphorus and plating solution technology, which is applied in the field of metal surface treatment, can solve the problems that phosphorus cannot be recycled and the utilization rate of phosphorus is not high, and achieve good promotion and application value, improve self-catalysis activity, and simple implementation

Inactive Publication Date: 2014-06-18
ZHEJIANG OCEAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] What the present invention aims to solve is that the utilization rate of phosphorus in hypophosphorous acid is not high in the existing situation, and there will be a large amount of phosphorous acid by-products in the reaction process, and this part of phosphorus cannot be recycled.

Method used

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  • Plating solution formula of chemical nickel-phosphate plating alloy
  • Plating solution formula of chemical nickel-phosphate plating alloy
  • Plating solution formula of chemical nickel-phosphate plating alloy

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Prepare a kind of nickel-phosphorus electroless plating solution of novel additive according to following formula:

[0020] Nickel sulfate hexahydrate 20g

[0021] Sodium hypophosphite 15g

[0022] Polyvinylpyrrolidone (PVP) 100g

[0023] Sodium Lactate Buffer (PH4.5) 7mg

[0024] Lactic acid 4mg

[0025] Glycine 1.5g

[0026] Sodium thiosulfate 30μg

[0027] Thiourea 10μg

[0028] The balance is water.

[0029] After preparing the solutions in proportion, measure the pH value, and adjust the pH to 4.7 with dilute sulfuric acid and potassium bicarbonate solution, and the plating temperature is 75°C.

[0030] The obtained nickel-phosphorus alloy coating performance index:

[0031] Corrosion potential 535mV vs SCE

[0032] Neutral salt spray test (25μm) 2000~2500h

[0033] Deposition rate 20μm / h

[0034] Microhardness 1850HV

[0035] Porosity None

[0036] The microhardness adopts HXR-1000TM digital microhardness tester, and the neutral salt spray adopts Shan...

Embodiment 2

[0038] Prepare a kind of nickel-phosphorus electroless plating solution of novel additive according to following formula:

[0039] Nickel sulfate hexahydrate 25g

[0040] Sodium hypophosphite 20g

[0041] Polyvinylpyrrolidone (PVP) 100g

[0042] Sodium Lactate Buffer (PH4.5) 7mg

[0043] Lactic acid 4mg

[0044] Glycine 2g

[0045] Sodium thiosulfate 30μg

[0046] Thiourea 10μg

[0047] The balance is water.

[0048] After preparing the solutions in proportion, measure the pH value, and adjust the pH to 4.7 with dilute sulfuric acid and potassium bicarbonate solution, and the plating temperature is 75°C.

[0049] The obtained nickel-phosphorus alloy coating performance index:

[0050] Corrosion potential 405mV vs SCE

[0051] Neutral salt spray test (25μm) 1200~2500h

[0052] Deposition rate 22μm / h

[0053] Microhardness 2500HV

[0054] Porosity None

[0055] The microhardness adopts HXR-1000TM digital microhardness tester, and the neutral salt spray adopts Shangh...

Embodiment 3

[0057] Prepare a kind of nickel-phosphorus electroless plating solution of novel additive according to following formula:

[0058] Nickel sulfate hexahydrate 40g

[0059] Sodium hypophosphite 30g

[0060] Polyvinylpyrrolidone (PVP) 120g

[0061] Sodium Lactate Buffer (PH4.5) 5mg

[0062]Lactic acid 2mg

[0063] Glycine 3g

[0064] Sodium thiosulfate 30μg

[0065] Thiourea 20μg

[0066] The balance is water.

[0067] After preparing the solutions in proportion, measure the pH value, and adjust the pH to 4.7 with dilute sulfuric acid and potassium bicarbonate solution, and the plating temperature is 75°C.

[0068] The obtained nickel-phosphorus alloy coating performance index:

[0069] Corrosion potential 375mV vs SCE

[0070] Neutral salt spray test (25μm) 1800~3000h

[0071] Deposition rate 17μm / h

[0072] Microhardness 2000HV

[0073] Porosity None

[0074] The microhardness adopts HXR-1000TM digital microhardness tester, and the neutral salt spray adopts Shangha...

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Abstract

The invention discloses a plating solution formula of a chemical nickel-phosphate plating alloy. The plating solution formula consists of a pre-treatment solution and an after-treatment solution, wherein the pre-treatment solution is prepared from the following raw materials in percentage by weight: 20-30% of dimethylamine, 20-30% of ammonia water and 40-60% of a formaldehyde solution; the after-treatment solution is prepared from the following raw materials in percentage by weight: 20-25% of fly ash and 70-80% of polyacrylamide water. The content of polyacrylamide in the polyacrylamide water is 3-4%; the weight ratio of the pre-treatment solution and to the after-treatment solution is (1:44)-(1:42). A method for preparing a formula of cationic polyacrylamide modified fly ash comprises the steps of preparing the pre-treatment solution by fully mixing dimethylamine and water in proportion; adding the formaldehyde solution in proportion, heating, reacting, and then cooling for later use; preparing the after-treatment solution by stirring and mixing the fly ash and the polyacrylamide aqueous solution in proportion. The plating solution formula disclosed by the invention uses the fly ash as the raw material, is low in energy consumption and environment-friendly, and can effectively improve the coagulation decolorization effect of the printing and dyeing wastewater.

Description

technical field [0001] The invention relates to a chemical nickel-phosphorus alloy plating solution formula, which belongs to the technical field of metal surface treatment. Background technique [0002] Electroless nickel plating, also known as electroless nickel plating, is a new film-forming technology that deposits a metal coating on the metal surface by means of a self-catalyzed chemical reaction in a solution where a metal salt and a reducing agent coexist. Because the formed coating metal can improve the wear resistance, corrosion resistance and electrochemical protection performance of the substrate, it is widely used in aviation, automobile, electronics, petroleum and many other commercial fields. [0003] Compared with electroplating, electroplating can only plate some workpieces with simple shapes and consumes a lot of electric energy. However, as long as electroless plating can be soaked in the plating solution and fully exchanges solute with the substrate, the c...

Claims

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Application Information

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IPC IPC(8): C23C18/36
Inventor 赵晓栋
Owner ZHEJIANG OCEAN UNIV
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