Wear-resistant LED heat dispersion coating and preparation method thereof

A kind of technology of heat dissipation coating and raw material

Inactive Publication Date: 2014-06-25
程实
View PDF1 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, heat conduction adhesive is used to solve the heat dissipation problem of LED lamps, but the materials used have poor temperature resistance and aging resistance, low adhesion to the substrate, poor heat dissipation effect, and inconvenient construction. It is difficult to meet people's expectations for LED lamps. Cooling Requirements

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0010] A wear-resistant LED heat dissipation coating made of the following parts by weight (kg) of raw materials: acrylic resin 43, polyoxamide resin 8, methyl methacrylate 14,4-cyclohexane dimethanol 12, fatty amine 5 , Allyl glycidyl ether 2, polytetrafluoroethylene powder 7, crosslinking agent TAIC1.6, tributyltin trichloride 2.5, ethylene glycol 17, tungsten carbide powder 5, dimolybdenum boride 4, silicon dioxide Powder 12, film forming aid 4.5.

[0011] The said film-forming aid is prepared from the following parts by weight (kg) of raw materials: ethylene glycol ethyl ether acetate 8, 2-oxoacetoxybutyric acid 3, acrylic acid 4, polyvinyl butyral 3, hexamethyl Phosphorus triamide 4, geranyl acetate 4, isopropyl tris(dioctyl pyrophosphate acyloxy) titanate 0.7, hydroxymethyl propyl cellulose 2.5, nano chitin 0.4, plastic starch 1.5, Acetyl peroxide 0.3, propylene glycol monomethyl ether acetate 17; the preparation method is: ethylene glycol ethyl ether acetate, hexamethylph...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thermal conductivityaaaaaaaaaa
Login to view more

Abstract

The invention discloses a wear-resistant LED heat dispersion coating which is prepared from the following raw materials in parts by weight: 40-45 parts of acrylic resin, 7-10 parts of polyoxamide resin, 12-17 parts of methyl methacrylate, 10-14 parts of 4-cyclohexanedimethanol, 4-6 parts of fatty amine, 1-3 parts of allyl glycidyl ether, 5-8 parts of teflon powder, 1-2 parts of cross-linking agent TAIC, 2-3 parts of tributyl tin chloride, 15-18 parts of ethylene glycol, 4-6 parts of tungsten carbide powder, 3-5 parts of molybdenum diboride, 10-14 parts of silicon dioxide powder and 4-5 parts of film-forming aid. As teflon powder is added into the coating, the coating surface has good lubricating property, the wear resistance is improved, the surface tension is low and the coating has antifouling and dustproof effects; as tungsten carbide powder, molybdenum diboride and silicon dioxide powder are added into the coating, the wear resistance of the coating is improved, the heat dispersion effect is enhanced and the coating is ageing-resistant; due to the film-forming aid, the coating has good film-forming property and is easy to coat.

Description

Technical field [0001] The invention belongs to the technical field of coatings, and particularly relates to a wear-resistant LED heat dissipation coating and a preparation method thereof. Background technique [0002] With the rapid expansion of the scope of use of LED lights, extending the service life of LED lights has become an urgent problem to be solved. With the increase of LED power, the heat dissipation problem has been paid more and more attention. At present, thermal conductive glue is used to solve the heat dissipation problem of LED lights, but the materials used have poor temperature resistance and aging resistance, low adhesion to the substrate, poor heat dissipation, and inconvenient construction. It is difficult to meet people's technical problems with LED lights. Heat dissipation requirements. Summary of the invention [0003] The purpose of the present invention is to provide a wear-resistant LED heat dissipation coating and a preparation method thereof. The co...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C09D4/02C09D4/06C09D7/12
Inventor 程实
Owner 程实
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products