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Preparation method of high-thermal-conductivity graphite whisker-oriented and reinforced metal-based composite material

A technology of high thermal conductivity graphite and copper-based composite materials, applied in the field of electronic packaging composite materials, can solve the problem of insufficient thermal conductivity, and achieve the effects of low cost, high degree of directional distribution, and improved thermal conductivity

Active Publication Date: 2014-07-09
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the thermal conductivity in the direction perpendicular to the pressing plane is limited by the low thermal conductivity in the radial direction of the whiskers and cannot be fully exploited.

Method used

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  • Preparation method of high-thermal-conductivity graphite whisker-oriented and reinforced metal-based composite material
  • Preparation method of high-thermal-conductivity graphite whisker-oriented and reinforced metal-based composite material
  • Preparation method of high-thermal-conductivity graphite whisker-oriented and reinforced metal-based composite material

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Experimental program
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Effect test

Embodiment 1

[0026] The graphite whiskers in this embodiment have a diameter of 10 microns and an average length of 300 microns. The matrix powder used is electrolytic copper powder with a mixed particle size of 400 mesh and 2000 mesh, with a purity of 99.99%, wherein the mass ratio of 400 mesh copper powder to 2000 mesh copper powder is 3:1.

[0027] Mix graphite whiskers, copper powder, and lactic acid evenly in a volume ratio of 24:16:60, add a small amount of polyvinyl alcohol solution with a mass concentration of 4% to the composite powder slurry, and add 2ml per 100ml of composite powder slurry solution of polyvinyl alcohol. Then put the composite powder slurry into a directional extrusion die for directional extrusion. The extrusion port of the die is a gap with an opening width of 0.3 mm, and the extrusion pressure is 2 MPa to obtain a flaky sintered precursor with a thickness of 0.3 mm. Subsequently, the sintered precursor was dried in a tube furnace to remove the liquid medium, ...

Embodiment 2

[0029] The graphite whiskers in this embodiment have a diameter of 10 microns and an average length of 200 microns. The matrix powder used is 400 mesh CuCr 0.08 Alloy powder.

[0030] Mix graphite whiskers, copper powder, and lactic acid in a volume ratio of 20:20:60 evenly. Then put the composite powder slurry into a directional extrusion die for directional extrusion. The extrusion port of the die is a nozzle with an inner diameter of 0.5 mm, and the extrusion pressure is 2 MPa to obtain a strip-shaped sintered precursor with a diameter of 0.5 mm. Subsequently, the sintered precursor was dried in a tube furnace to remove the liquid medium, and the drying temperature was 130° C. for 3 hours. The dried sintered precursors are laminated into a mold, followed by vacuum hot pressing and sintering. The sintering temperature is 980°C, the pressure is 40MPa, and the graphite whisker / copper composite material is obtained after holding the heat for 30 minutes and then cooling with ...

Embodiment 3

[0032] The graphite whiskers in this embodiment have a diameter of 10 microns and an average length of 200 microns. The matrix powder used is electrolytic copper powder with a mixed particle size of 400 mesh and 2000 mesh, with a purity of 99.99%, wherein the mass ratio of 400 mesh copper powder to 2000 mesh copper powder is 3:1.

[0033] A layer of titanium carbide with a thickness of 0.5 microns is plated on the surface of the graphite whisker by means of salt bath plating. Graphite whiskers and the NaCl / KCl mixed salt that adds a certain amount of titanium powder (purity 99%) are put into ball mill and mix 30 minutes, and the mol ratio of NaCl and KCl in the mixed salt is 1:1, and the ratio of titanium powder in the mixed salt The mass fraction is 10%. After mixing evenly, put it into a tube furnace with a protective atmosphere and heat it to 800°C, keep it warm for 60 minutes and then cool it with the furnace. The coated whiskers are washed with water and sieved to remov...

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Abstract

The invention belongs to the technical field of electronic encapsulating composite materials, and relates to a preparation method of a composite material of high-thermal-conductivity graphite whisker-oriented and reinforced metal. The composite material contains high-thermal-conductivity graphite whiskers of which the volume fraction is 20-80 percent. The preparation method of the composite material comprises the following production process steps: uniformly mixing metal powder, whiskers and paste comprising a bonding agent, a plasticizer and a solvent; pouring the mixture into a one-way extruding mold and extruding in an oriented manner to obtain strip-shaped or laminar sintered precursors; and removing the paste from the sintered precursors, putting the sintered precursors into a mold in an overlaying manner, sintering and curing to obtain the composite material. The one-dimensional oriented distribution degree of the whiskers in the composite material produced by adopting the method is high, and axial thermal conduction of the whiskers is facilitated. The obtained composite material has relatively high thermal conductivity and an adjustable thermal expansion coefficient, and is an ideal electronic encapsulating material.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging composite materials, and relates to a preparation method of a composite material of high thermal conductivity graphite whisker directionally reinforced metal. Background technique [0002] With the rapid development of electronic information technology, the integration level of integrated circuits has increased rapidly, which inevitably leads to an increase in the heating rate of the chip, and the performance of the chip will be unstable or even invalid due to excessive operating temperature. In order to ensure the stable operation of the equipment, the generated heat needs to be exported in a timely manner, so high requirements are placed on the thermal conductivity of electronic packaging materials. At the same time, due to the miniaturization of electronic components and equipment, the trend of densification is becoming more and more obvious. The heat released by each independent e...

Claims

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Application Information

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IPC IPC(8): C22C47/04C22C47/14C22C49/06C22C49/02C22C101/10C22C121/02
Inventor 何新波刘骞章晨刘婷婷任淑彬吴茂曲选辉
Owner UNIV OF SCI & TECH BEIJING
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