Preparation method of high-thermal-conductivity graphite whisker-oriented and reinforced metal-based composite material

A technology of high thermal conductivity graphite and copper-based composite materials, applied in the field of electronic packaging composite materials, can solve the problem of insufficient thermal conductivity, and achieve the effects of low cost, high degree of directional distribution, and improved thermal conductivity

Active Publication Date: 2014-07-09
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the thermal conductivity in the direction perpendicular to the pressing plane is limited b

Method used

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  • Preparation method of high-thermal-conductivity graphite whisker-oriented and reinforced metal-based composite material
  • Preparation method of high-thermal-conductivity graphite whisker-oriented and reinforced metal-based composite material
  • Preparation method of high-thermal-conductivity graphite whisker-oriented and reinforced metal-based composite material

Examples

Experimental program
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Effect test

Example Embodiment

[0025] Example 1

[0026] In this embodiment, the diameter of the graphite whiskers is 10 microns, and the average length is 300 microns. The matrix powder used is electrolytic copper powder with a mixed particle size of 400 mesh and 2000 mesh, with a purity of 99.99%, and the mass ratio of 400 mesh copper powder to 2000 mesh copper powder is 3:1.

[0027] Mix graphite whiskers, copper powder, and lactic acid in a volume ratio of 24:16:60, and add a small amount of 4% polyvinyl alcohol solution to the composite powder slurry, and add 2ml per 100ml composite powder slurry Solution of polyvinyl alcohol. Then, the composite powder slurry is put into a directional extrusion die for directional extrusion. The die has a slit with an opening width of 0.3 mm and an extrusion pressure of 2 MPa to obtain a flaky sintered precursor with a thickness of 0.3 mm. Subsequently, the sintered precursor was dried in a tube furnace to remove the liquid medium, and the drying temperature was 130° C. ...

Example Embodiment

[0028] Example 2

[0029] In this embodiment, the diameter of the graphite whiskers is 10 microns, and the average length is 200 microns. The base powder used is 400 mesh CuCr 0.08 Alloy powder.

[0030] Mix graphite whiskers, copper powder, and lactic acid in a volume ratio of 20:20:60. Then the composite powder slurry is put into a directional extrusion die for directional extrusion. The die extrusion port is a nozzle with an inner diameter of 0.5 mm and an extrusion pressure of 2 MPa to obtain a strip-shaped sintered precursor with a diameter of 0.5 mm. Subsequently, the sintered precursor was dried in a tube furnace to remove the liquid medium, and the drying temperature was 130° C. and the temperature was kept for 3 hours. The dried sintering precursor is laminated and put into the mold, and then vacuum hot-press sintering is performed. The sintering temperature is 980°C, the pressure is 40 MPa, and the furnace is cooled after holding for 30 minutes to obtain the graphite w...

Example Embodiment

[0031] Example 3

[0032] In this embodiment, the diameter of the graphite whiskers is 10 microns, and the average length is 200 microns. The base powder used is electrolytic copper powder with a mixed particle size of 400 mesh and 2000 mesh, with a purity of 99.99%, and the mass ratio of 400 mesh copper powder to 2000 mesh copper powder is 3:1.

[0033] A layer of titanium carbide with a thickness of 0.5 microns is plated on the surface of the graphite whiskers by salt bath plating. Put graphite whiskers and NaCl / KCl mixed salt with a certain amount of titanium powder (purity 99%) in a ball mill and mix for 30 minutes. The molar ratio of NaCl to KCl in the mixed salt is 1:1. The mass fraction is 10%. After mixing uniformly, put it into a tube furnace with protective atmosphere and heat to 800°C, keep it for 60 minutes, and then cool down with the furnace. The coated whiskers are washed with water and sieved to remove excess impurities to obtain graphite whiskers coated with tit...

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Abstract

The invention belongs to the technical field of electronic encapsulating composite materials, and relates to a preparation method of a composite material of high-thermal-conductivity graphite whisker-oriented and reinforced metal. The composite material contains high-thermal-conductivity graphite whiskers of which the volume fraction is 20-80 percent. The preparation method of the composite material comprises the following production process steps: uniformly mixing metal powder, whiskers and paste comprising a bonding agent, a plasticizer and a solvent; pouring the mixture into a one-way extruding mold and extruding in an oriented manner to obtain strip-shaped or laminar sintered precursors; and removing the paste from the sintered precursors, putting the sintered precursors into a mold in an overlaying manner, sintering and curing to obtain the composite material. The one-dimensional oriented distribution degree of the whiskers in the composite material produced by adopting the method is high, and axial thermal conduction of the whiskers is facilitated. The obtained composite material has relatively high thermal conductivity and an adjustable thermal expansion coefficient, and is an ideal electronic encapsulating material.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging composite materials, and relates to a preparation method of a composite material of high thermal conductivity graphite whisker directionally reinforced metal. Background technique [0002] With the rapid development of electronic information technology, the integration level of integrated circuits has increased rapidly, which inevitably leads to an increase in the heating rate of the chip, and the performance of the chip will be unstable or even invalid due to excessive operating temperature. In order to ensure the stable operation of the equipment, the generated heat needs to be exported in a timely manner, so high requirements are placed on the thermal conductivity of electronic packaging materials. At the same time, due to the miniaturization of electronic components and equipment, the trend of densification is becoming more and more obvious. The heat released by each independent e...

Claims

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Application Information

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IPC IPC(8): C22C47/04C22C47/14C22C49/06C22C49/02C22C101/10C22C121/02
Inventor 何新波刘骞章晨刘婷婷任淑彬吴茂曲选辉
Owner UNIV OF SCI & TECH BEIJING
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