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Pressure sensitive element based on thermoplastic elastomers and surface load distribution measurement method

A technology of thermoplastic elastomers and pressure-sensitive components, applied in the direction of measuring force, measuring devices, instruments, etc., can solve problems such as poor repeatability, low measurement sensitivity, and high cost

Active Publication Date: 2014-08-20
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of piezoresistive material-based has the characteristics of simple structure, convenient preparation, and integration of materials and devices. The disadvantage is that its repeatability is poor, especially not suitable for long-term quantitative measurement applications.
Another type is based on the principle of measuring the planar capacitance of the elastic body deformation or making an organic electronic device based on the elastic body, which has the advantages of good repeatability and micro-processing, but currently has the disadvantages of low measurement sensitivity and high cost.

Method used

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  • Pressure sensitive element based on thermoplastic elastomers and surface load distribution measurement method
  • Pressure sensitive element based on thermoplastic elastomers and surface load distribution measurement method
  • Pressure sensitive element based on thermoplastic elastomers and surface load distribution measurement method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Prepare silicon wafer template:

[0046] The thickness of the silicon wafer is 3mm, and the surface thermally oxidized silicon wafer is used for the preparation of the template silicon wafer. The thickness of the oxide layer is 100 to 500nm, and the crystal orientation is . The ordinary negative photolithography method is used. Form a periodic square window on the silicon surface to remove the oxide layer, the window size is 100 μm, fully corrode the window area with tetramethylammonium hydroxide (20% mass ratio) aqueous solution in isopropanol (1:1 volume ratio) at 70 ° C Silicon layer, stop when the tip platform is less than 3μm, etch the cone pit array and use it as a mold.

[0047] Prepare periodic pyramid cones:

[0048] BASF thermoplastic polyurethane transparent prefabricated sheet is used, with a thickness of 1mm and a Shore hardness of A60. Cover the above-mentioned polyurethane prefabricated sheet on the surface of the silicon mold, use a flat pressurized fi...

Embodiment 2

[0058] A conductive polymer is used as a transparent conductive layer, and a polyaniline film with uniform thickness is deposited on the surface of a pyramidal cone array by an in-situ polymerization method.

[0059] Dissolve 4.7 grams of aniline and 3.8 grams of ammonium persulfate in 100 ml of 0.4M HCl solution, soak the polyurethane film with a pyramid structure on the surface for 2 hours, put it into the aniline solution after cleaning, and pour ammonium persulfate into it Solution, keep stirring, the above mixed solution is maintained at 4°C, take out the polyurethane film after stirring for 30 minutes, wash it with deionized water, put it in 1M HCl solution, take it out after 10 hours, and dry it.

[0060] The thickness of the polyaniline film prepared by the above method is about 80nm, the transmittance of visible light is greater than 70%, and the resistivity is about 500Ω·cm. The film is well combined with the polyurethane, and the repeated deformation durability is h...

Embodiment 3

[0063] The BASF thermoplastic polyaniline elastomer transparent prefabricated sheet is used, the thickness is 1mm, and the Shore hardness is A60. Cover the above-mentioned polyaniline prefabricated sheet on the surface of the silicon mold, use a flat pressurized fixture, press the thick film and the silicon mold to be bonded, the stress is 0.1 to 0.5MPa, vacuum heating, the vacuum degree is lower than 10torr, and the temperature is 150±3 ℃, keep it for 20 minutes, slowly cool down, demould, and make a pyramid-cone periodic structure on the surface of transparent polyaniline.

[0064] The template preparation method, the conductive film preparation method, the counter electrode preparation method, and the measurement method are the same as in Example 1.

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Abstract

The invention discloses principles and use methods of a pressure sensitive element based on thermoplastic elastomers and a surface load distribution measurement device. The pressure sensitive element is characterized in that a periodic pyramid structure negative form formed on a chemical etched silicon wafer is adopted for serving as a mold to form a periodic pyramid structure on the thermoplastic elastomer plane, a conducting layer is deposited, a circuit is etched, a gate of one or more conducting cones is formed, changes of capacitance between the conducting cones and a plane electrode during deformation are measured, and high-sensitivity measurement on loads applied to an array and the distribution of the loads is obtained.

Description

technical field [0001] The invention belongs to a highly repeatable and sensitive elastomer load sensing device. Background technique [0002] Flexible sensors for measuring the contact load and distribution of soft materials are widely used in biomechanics, robotics, consumer electronics and other fields. In recent years, different implementation methods have been designed to develop such sensors, for example; The polymer conductive material forms a flexible sensor with tensile and compressive deformation sensitivity, and its stretch-sensitive deformation range reaches 100%, and the compression-sensitive deformation range reaches 30%. This type of piezoresistive material-based has the characteristics of simple structure, convenient preparation, and integration of materials and devices. The disadvantage is that its repeatability is poor, and it is especially not suitable for long-term quantitative measurement applications. Another type is based on the principle of measuring...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L1/14
Inventor 张小祥巴龙
Owner SOUTHEAST UNIV
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