Method for rapidly preparing copper-molybdenum multi-layer composite material

Abstract

The invention discloses a method for rapidly preparing a copper-molybdenum multi-layer composite material. The method comprises the following steps that (1) the surfaces of copper pieces and the surfaces of molybdenum pieces are polished so that oxidation films can be removed, the polished copper pieces and the polished molybdenum pieces are washed through acetone, and the processed copper pieces and the processed molybdenum pieces are dried by cold air for later use; (2) the copper pieces and the molybdenum pieces are overlaid in an alternating mode so that a multi-layer structural plate can be formed and the multi-layer structural plate is placed in a combination mold; (3) the combination mold containing the multi-layer structural plate is placed in a plasma activation sintering furnace, demolding is conducted after sintering is conducted, and therefore the copper-molybdenum multi-layer composite material is obtained. Electrifying, heating and sintering are directly conducted on the multi-layer structural plate obtained by overlaying the copper pieces and the molybdenum pieces in the alternating mode by introducing a high-density current, rapid diffusion bonding of copper-molybdenum interfaces is achieved under the combination action of temperature and pressure, the copper-molybdenum multi-layer composite material prepared with the method is good in heat conductivity and thermal expansion coefficient, the bonding strength of the copper-molybdenum interfaces is high, the product consistency is good, and punch forming can be achieved.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging materials, and in particular relates to a method for rapidly preparing copper-molybdenum multilayer composite materials. Background technique [0002] With the rapid development of electronic information technology, semiconductor devices continue to develop in the direction of high power, high integration, and portability, and the operating temperature continues to rise. If the device cannot dissipate heat in time during operation, it will lead to performance degradation and shortened lifespan. Finding excellent electronic packaging materials is an important way to solve the heat dissipation problem of high-power devices, and it is of great significance to improve the performance, reliability and service life of devices. Electronic packaging and heat sink materials must not only have high thermal conductivity, but also need to have a thermal expansion coefficient that matches the chi...

AI Technical Summary

Problems solved by technology

The rolling method is the earliest reported preparation method. The U.S. Patent US4950554 first obtained the Cu / Mo / Cu layered composite material with a "sandwich" structure by welding and rolling; Chinese patents CN102357525 and CN1850436 respectively adopt hot rolling and cold rolling The Cu / Mo / Cu layered composite material was prepared by the rolling method; the main defect of the rolling method is that Cu and Mo are incompatible with each other, and the copper-molybdenum interface is mainly bonded by mechanical meshing after rolling and annealing, and the interface bonding strength is not high. To improve the interfacial bonding strength, the rolling force must be increased, but it is easy to cause cracking or delamination of the brittle Mo itself; in the patent CN102371719, the Cu / Mo / Cu layered composite material with a "sandwich" structure is prepared by explosive rolling. However, there are many process steps in the technical scheme of this patent, and the explosive composite method itself has high risk and noise pollution, and the shape control is difficult, which is not suitable for continuous production and product quality control; patent CN1850436 uses hot pressing method to prepare Cu / Mo layered composite material, first pre-plate Cu layer on the surface of Mo plate, then roll and shape the Cu-plated Mo plate, and then stack it with Cu plate for hot pressing and sintering. This method is cumbersome, and electroplating is easy to pollute. Environment; patent CN1408485 adopts the method of cladding Cu layer on Mo plate to prepare Cu / Mo / Cu layered composite material with "sandwich" structure, but after cooling Cu needs cold rolling and shaping, the surface quality and layer thickness are difficult to control, and Limited when preparing composite materials with large layer thickness ratio

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