Pure tin electroplating solution for inhibiting growth of tin whiskers and application thereof

A tin electroplating and tin whisker technology, which is applied in the field of metal coating electrodeposition preparation, can solve the problems of easy Sn whisker growth, high welding temperature, coarse crystallization, etc., and achieve strong practical value, good flexibility and ductility, and good coating cracks Effect

Active Publication Date: 2014-09-24
JURONG BOYUAN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing lead-free electroplating alloys generally have problems such as

Method used

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  • Pure tin electroplating solution for inhibiting growth of tin whiskers and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] A pure tin electroplating solution that reduces the growth of tin whiskers, the specific formula is as follows, wherein the percentages are mass percentages:

[0019] 20% volume ratio is a mixed solution of methanesulfonic acid and sulfuric acid of 3:1;

[0020] The volume ratio of 40% is the mixed solution of tin methanesulfonate and hydrogen peroxide of 5:1;

[0021] 10% mixture of ascorbic acid and complex metal ion mass ratio of 2:1;

[0022] 1% 5-chlorouracil;

[0023] 5% brightener, the mass ratio is the mixture of 15g / L malic acid, 8mL / L lactic acid, 8g / L polyethylene glycol, boric acid, benzyldiacetone in a mass ratio of 1:1:2:2:1, wherein The mass ratio of polyethylene glycol, boric acid, and benzyldiacetone is 1:2:1;

[0024] 5% anionic wetting agent;

[0025] 5% sodium alkylaryl sulfonate;

[0026] water balance.

[0027] A kind of application of the above-mentioned pure tin electroplating solution that reduces the growth of tin whiskers is as follows: ...

Embodiment 2

[0029] A pure tin electroplating solution that reduces the growth of tin whiskers, the specific formula is as follows, wherein the percentages are mass percentages:

[0030] 50% volume ratio is a mixed solution of methanesulfonic acid and sulfuric acid of 3:1;

[0031] 10% volume ratio is a mixed solution of tin ethanesulfonate and hydrogen peroxide at a volume ratio of 7:1;

[0032] 10% citric acid and complex metal ion mass ratio is the mixture of 4:1;

[0033] 5% 4-acetylcytosine;

[0034] 1% brightener, the mass ratio is the mixture of 15g / L malic acid, 8mL / L lactic acid, 8g / L polyethylene glycol, boric acid, benzyldiacetone in mass ratio of 1:1:2:2:1, wherein The mass ratio of polyethylene glycol, boric acid, and benzyldiacetone is 1:2:1;

[0035] 1% anionic wetting agent;

[0036] 1% secondary alkyl sodium sulfate;

[0037] water balance.

[0038] A kind of application of the above-mentioned pure tin electroplating solution that reduces the growth of tin whiskers i...

Embodiment 3

[0040] A pure tin electroplating solution that reduces the growth of tin whiskers, the specific formula is as follows, wherein the percentages are mass percentages:

[0041] 35% volume ratio is a mixed solution of methanesulfonic acid and sulfuric acid of 3:1;

[0042] 25% mixed solution of tin 2-propanesulfonate and hydrogen peroxide;

[0043] 5% mixture of lactic acid and complexed metal ions with a mass ratio of 3:1;

[0044] 3% 2-aminoadenine;

[0045] 3% brightener, a mixture of 15g / L malic acid, 8mL / L lactic acid, 8g / L polyethylene glycol, boric acid, and benzyldiacetone in a mass ratio of 1:1:2:2:1, wherein The mass ratio of polyethylene glycol, boric acid, and benzyldiacetone is 1:2:1;

[0046] 3% anionic wetting agent;

[0047] 3% sodium alkyl sulfate;

[0048] water balance.

[0049] A kind of application of the above-mentioned pure tin electroplating solution that reduces the growth of tin whiskers is as follows: add half of the required amount of water in the...

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Abstract

The invention discloses a pure tin electroplating solution for inhibiting growth of tin whiskers and an application thereof. A mixed solution of methylsulphonic acid and sulfuric acid is adopted as an acidic plating solution, a mixed solution of alkyl sulfonic acid tin salt and hydrogen peroxide is adopted as tin salt, and antioxidants, adjuvants, brightening agents, wetting agents, surface-active agents and the like are added to the mixed solutions. In the application process, an unique electroplating solution preparing method and matters needing attention in use are adopted, and therefore the effect of inhibiting the growth of the tin whiskers is obvious compared with the application of a traditional electroplating solution; moreover, the growth speed of the tin whiskers is greatly reduced, and the growth of the tin whiskers on the surface of an electroplated part is reduced; moreover, plated layers electroplated through the method is good in flexibility and ductility, cracks of the plated layers can be well reduced, the ability to bear the temperature is flexible, and the practical value is high.

Description

technical field [0001] The invention relates to the field of electrodeposition preparation of metal coatings, in particular to a pure tin electroplating solution for reducing the growth of tin whiskers and an application thereof. Background technique [0002] In the production of electronics industry, a layer of tin-lead (Sn-Pb) alloy is usually plated on the surface of component pins to improve the wettability of soldering, but lead is a metal element with high biological toxicity, which is harmful to the human body. and the environment have great harm. Since the European Commission's electronic device waste regulations have stipulated that harmful substances such as lead Pb, cadmium Cd, mercury Hg and hexavalent chromium Cr(VI) are strictly prohibited in waste after 2004 , the development of lead-free soldering technology and the corresponding pure tin plating technology has become the main means of replacing Sn-Pb alloy plating. The existing lead-free electroplating allo...

Claims

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Application Information

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IPC IPC(8): C25D3/32
Inventor 王梅凤
Owner JURONG BOYUAN ELECTRONICS
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