A kind of heat-dissipating coating for LED lamp and preparation method thereof

Abstract

The invention discloses a cooling coating for a light-emitting diode (LED) lamp and a preparation method thereof. The coating comprises the following components by weight percent: 30-55% of acrylic resin, 10-20% of amino resin, 5-10% of aluminium nitride, 2-15% of carbon fiber, 3-8% of pigment, 5-15% of mica, 1-2% of anti-settling agent, 10-20% of solvent, 1-2% of dispersant and 0.5-2% of flatting agent. The preparation method comprises the following steps: during preparation, mixing and grinding raw materials, and then dispersing the raw materials by a disperser; controlling the fineness of the coating within 15-30mu m, filtering and removing impurities, thereby obtaining the cooling coating. The cooling coating for the LED lamp disclosed by the invention has high radioactivity and high heat conductivity, and is sprayed on the surface of an LED apparatus; the temperatures on the surfaces of the apparatuses such as an LED lamp aluminum substrate and a cooling shell can be greatly reduced by the formed coating; the coating has the characteristics of excellent mechanical property and protection function, good waterproofness and weather fastness, and the like.

Description

technical field [0001] The invention relates to a heat dissipation coating, in particular to a heat dissipation coating for LED lamps and a preparation method thereof. Background technique [0002] As a new type of solid-state cold light source, LED has the characteristics of high efficiency, energy saving, and environmental protection. However, due to the current low electro-optic conversion efficiency of LEDs, most of the electrical energy is converted into heat energy, and as the LED power continues to increase, the chip volume continues to decrease, resulting in a high heat flux density of the chip and a high junction temperature of the LED. The light decay and life of LED are directly related to its junction temperature. The higher the junction temperature, the lower the luminous efficiency and the shorter the service life. Heat dissipation is the bottleneck that limits the development of LEDs. [0003] In the existing LED heat dissipation technology, the purpose of h...

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Problems solved by technology

However, due to the low electro-optic conversion efficiency of LEDs, most of the electrical energy is converted into heat energy, and as the LED power continues to increase, the chip volume continues to decrease, resulting in a high heat flux density of the chip and a high LED junction temperature.

The light decay and life of LED are directly related to its junction temperature, the higher the junction temperature, the lower the light efficiency and the shorter the service life

Heat dissipation is the bottleneck limiting the development of LED

[0003] In the existing LED heat dissipation technology, the purpose of heat dissipation is often achieved by increasing the heat dissipation area of ​​the radiator or improving the structure of the radiator, which results in a large volume and heavy weight of the high-power LED radiator, which increases the cost of production and the cost of use. Insecurity

And out of consideration for the service life of the radiator, a layer of anti-corrosion coating is often applied on its surface, but the general anti-corrosion coating has a large thermal resistance, which hinders the conduction of heat and increases the heat dissipation load of the radiator.

Someone also designed a cooling coating, which uses the high emissivity of the coating to increase heat dissipation, but the cooling effect is not obvious, and the adhesion and weather resistance are very poor.

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