Solar photoelectric conversion coating for building and fabrication method for solar photoelectric conversion coating
A photoelectric conversion, solar energy technology, applied in conductive coatings, photovoltaic power generation, radiation-absorbing coatings, etc., can solve the problems of poor anti-fouling, poor conductivity, low efficiency, etc., achieve fast curing speed, maintain light transmittance and The effect of promotion
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Embodiment 1
[0036] 1) Take 30 parts by weight of phosphorus-doped silicon crystal, 25 parts by weight of epoxy acrylate resin, 4 parts by weight of conductive mica powder, 1 part by weight of 1-chloro-4-hydroxythioxanthone, and 0.2 parts by weight of hydroquinone , 0.2 parts by weight of polyacrylate, 0.2 parts by weight of n-butanol, 0.35 parts by weight of polyoxyethylene alkylphenyl ether, add 25 parts by weight of water, and press the preparation method step a to prepare II:N type semiconductor coatings.
[0037] 2) Get 30 parts by weight of boron-doped silicon crystals, 25 parts by weight of epoxy acrylate resin, 4 parts by weight of conductive mica powder, 1 part by weight of 1-chloro-4-hydroxythioxanthone, 0.2 parts by weight of hydroquinone , 0.2 parts by weight of polyacrylate, 0.2 parts by weight of n-butanol, 0.35 parts by weight of polyoxyethylene alkylphenyl ether, add 25 parts by weight of water, according to the preparation method step b, to obtain III: P type semiconducto...
Embodiment 2
[0043] 1) Take 35 parts by weight of gallium arsenide doped with selenium, 30 parts by weight of polyurethane acrylate resin, 5 parts by weight of conductive titanium dioxide, 1.5 parts by weight of 2-hydroxythioxanthone, 0.2 parts by weight of p-benzophenone, and 0.2 parts by weight of organic Silicone resin, 0.2 parts by weight of n-butanol, 0.4 parts by weight of sodium polymethacrylate, and 20 parts by weight of water are added, and according to step a of the preparation method, a II:N type semiconductor coating with uniformly dispersed components is prepared.
[0044] 2) Take 35 parts by weight of zinc-doped gallium arsenide, 30 parts by weight of polyurethane acrylate resin, 5 parts by weight of conductive titanium dioxide, 1.5 parts by weight of 2-hydroxythioxanthone, 0.2 parts by weight of p-benzophenone, and 0.2 parts by weight of organic Silicone resin, 0.2 parts by weight of n-butanol, 0.4 parts by weight of sodium polymethacrylate, and 30 parts by weight of water ar...
Embodiment 3
[0050] 1) Take 40 parts by weight of gallium arsenide doped with selenium, 35 parts by weight of polyurethane acrylate resin, 6 parts by weight of conductive titanium dioxide, 1.5 parts by weight of 1-chloro-4-hydroxythioxanthone, 0.2 parts by weight of p-benzophenone, 0.2 parts by weight of silicone resin, 0.2 parts by weight of tributyl phosphate, 0.5 parts by weight of sodium polymethacrylate, adding 30 parts by weight of water, according to step a of the preparation method, to prepare a II: N-type semiconductor coating with uniform dispersion of components .
[0051] 2) Take 40 parts by weight of zinc-doped gallium arsenide, 35 parts by weight of polyurethane acrylate resin, 6 parts by weight of conductive titanium dioxide, 1.5 parts by weight of 1-chloro-4-hydroxythioxanthone, 0.2 parts by weight of p-benzophenone, 0.2 parts by weight of silicone resin, 0.2 parts by weight of tributyl phosphate, 0.5 parts by weight of sodium polymethacrylate, and 30 parts by weight of wat...
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