Adhesive tape film, and adhesive tape

A technology of adhesive tape and film, applied in the direction of adhesive type, nitrile copolymer adhesive, film/sheet adhesive, etc., which can solve the problem of cracking of the treatment layer, small elongation, and inability to follow the treatment layer Stretch and other problems, to achieve the effect of inhibiting adhesion, good fusion, and good followability

Active Publication Date: 2014-11-12
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the surface state of such a substrate film is easily affected by temperature
Therefore, even if the centerline surface roughness Ra of the surface of the substrate film is controlled to a predetermined value as reported in Patent Document 1, there is a problem that the surface roughness Ra is controlled to a predetermined value due to changes in air temperature and process equipment temperature. The surface roughness Ra of the center line of the large and small varies greatly, and the effect of the invention described in Patent Document 1 cannot be exhibited
However, in this technology, the silicone release agent has a low chemical affinity with the back of the film due to its surface tension, and there is a problem that it is difficult to fuse to the back of the film.
In addition, when applying a film coated with a silicone release agent on the back to an adhesive tape, if the adhesive tape is stretched such as expansion, the treated layer treated with a silicone release agent may not follow the Stretching, there may be problems with the treatment layer breaking and causing contamination
It should be noted that in order to improve the chemical affinity between the polysiloxane release agent and the back of the film, although there is also a technology of coating a cross-linked polysiloxane release agent, the cross-linked polysiloxane is usually stretched. The elongation is very small, so when applying a film coated with a cross-linked polysiloxane release agent on the back to an adhesive tape, if the adhesive tape is stretched such as expansion, it is possible to use the cross-linked polysiloxane. The treatment layer treated with alkane release agent cannot follow the stretch and cannot maintain anchorage

Method used

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  • Adhesive tape film, and adhesive tape
  • Adhesive tape film, and adhesive tape
  • Adhesive tape film, and adhesive tape

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0111] Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited by these examples. Parts are by weight. In addition, the amount of the reagent supplied in the form of a solution is represented by the amount of solid content remaining after volatilizing the solution (solid content conversion amount).

[0112]

[0113] The maximum elongation was measured with an INSTRON type tensile tester (manufactured by Shimadzu Corporation, Autograph) in accordance with JIS-K-7127. Specifically, after placing a sample having a width of 20 mm x a length of 100 mm at a distance between chucks of 50 mm, it was stretched at a tensile speed of 0.3 m / min, and the value at breakage was measured.

[0114]

[0115] The elastic modulus was measured in accordance with JIS-K-7127.

[0116]

[0117] (Observation by SEM)

[0118] After processing so that the cross-section of the non-adhesive layer can be observed, the morpholog...

manufacture example 1

[0154] [Manufacturing example 1]: Manufacture of plastic film

[0155] Manufactured by calendaring method Contains 27 parts by weight of DOP plasticizer (bis(2-ethylhexyl phthalate), manufactured by J-PLUS Co., Ltd.) with respect to 100 parts by weight of polyvinyl chloride with a degree of polymerization P=1050 soft polyvinyl chloride film. The flexible polyvinyl chloride film had a thickness of 70 µm, an elastic modulus (MD) measured in accordance with JIS-K-7127 of 250 MPa, and a maximum elongation (MD) measured in accordance with JIS-K-7127 of 400%. In addition, the surface roughness (arithmetic mean surface roughness Ra) immediately after production was 0.1 μm.

Embodiment 1

[0157] 60 parts by weight of polysiloxane resin (KS-723A, manufactured by Shin-Etsu Chemical Industry), 40 parts by weight of polysiloxane resin (KS-723B, manufactured by Shin-Etsu Chemical Industry), acrylic copolymer (methyl methacrylate (MMA) / butyl acrylate (BA) / hydroxyethyl acrylate (HEA)=90 / 10 / 10) 50 parts by weight, tin-based catalyst (Cat-PS3, manufactured by Shin-Etsu Chemical Co., Ltd.) 10 parts by weight were mixed in a solution state , to obtain the mixed solution (1). The mixing ratio of the polysiloxane in the mixed solution (1) and the (meth)acrylic polymer is polysiloxane:(meth)acrylic polymer=2:1 by weight ratio. In addition, the calculated Tg of the acrylic copolymer is 67.8°C, and the SP value is 10.7 (cal / cm3)0.5

[0158] .

[0159] The above-mentioned mixed solution (1) was coated on one side of the flexible polyvinyl chloride film produced in Production Example 1 to form a non-adhesive layer having a thickness of 1.0 μm and an arithmetic mean surface rou...

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Abstract

Provided is an adhesive tape film comprising a non-adhesive layer provided on a substrate film. This adhesive tape film effectively prevents over-adhesion due to heat of a fixing base (when performing dicing by attachment to the base by negative pressure suction), effectively suppresses blocking in the roll form by providing the non-adhesive layer on the substrate film, does not exhibit tearing or splitting when unwinding out of the roll form, exhibits good affinity between the non-adhesive layer and the substrate film, and has good conformability to deformations such as stretching. Further disclosed is an adhesive tape including such an adhesive tape film. This adhesive tape film is provided with a non-adhesive layer on one surface of a plastic film, wherein, measured by differential scanning calorimetry, the glass transition temperature Tg of said non-adhesive layer is 20°C or greater.

Description

technical field [0001] The present invention relates to a film for an adhesive tape and an adhesive tape. Background technique [0002] In the adhesive tape used for dicing of semiconductors, in order to fix the wafer during dicing, it is necessary to fix the surface opposite to the bonding surface of the wafer to the base. Such fixation is usually performed by negative pressure such as vacuum suction. [0003] When such fixing by negative pressure is performed, the pressure-sensitive adhesive tape may be excessively adhered to the base due to the state where the negative pressure is excessively applied or the adhesive tape is melted due to heat generated during cutting. If such excessive adhesion occurs, the handleability at the time of releasing the fixation from the base will be deteriorated, and there will be a problem that, for example, the semiconductor manufacturing process including dicing cannot be carried out smoothly. [0004] In order to solve this problem of e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/00C09J7/02C09J133/00H01L21/301C09J7/22
CPCC09J2427/006C09J133/00C08L83/04C09J2433/00C09J2203/326H01L2221/68327C09J2433/005C09J7/0253H01L21/6836C09J2483/005B32B27/00C09D183/04C09J133/20H01L33/0095B32B27/08B32B27/283B32B27/304B32B27/308B32B2270/00B32B2307/51B32B2405/00C09J7/22C09J7/203C08L33/08C08L33/10
Inventor 由藤拓三铃木俊隆白井稚人安藤雅彦关口裕香浅井量子远藤明日香林内梨惠
Owner NITTO DENKO CORP
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