Semitransparent fluorescent powder/glass composite luminescent ceramic wafer and preparation method thereof
A technology for luminescent ceramics and phosphors, applied in the field of ceramic manufacturing technology, can solve problems such as affecting the service life of devices and easy aging, and achieve the effects of reducing equipment investment, improving lighting time and brightness, and reducing process difficulty.
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[0069] Example one
[0070] The low-melting glass is made up according to the following table 1, mixed evenly and then melted at a temperature of 1000°C, kept for 120 minutes, and crushed with a ball mill after melting. The refractive index of low-melting glass powder made according to the formula of Table 1(1) is 1.8, figure 1 The percentage of thermal expansion system and the temperature chart measured the softening temperature of 413℃.
[0071] Table 1 Low melting point glass ratio (Wt.%)
[0072]
Example Embodiment
[0073] Example two
[0074] The 85wt.% YAG: Ce phosphor (Y 3 Al 5 O 12 : Ce, model PAM YY4425, D 50 =20μm) and 15wt.% low melting glass powder (D 50 =10μm) After mixing uniformly, 5wt.% PVB binder is added to make granulated powder of 80-60 mesh, and a luminescent ceramic chip body with corresponding shape is made by a press.
[0075] Put the luminescent ceramic chip body into a sintering furnace, set the debinding zone (300-350°C) to run for 3-4 hours and the sintering zone (400°C) to run for 1.5 hours to make the luminescent ceramic chip.
[0076] Under 365nm excitation light, its emission spectrum is as figure 2 (Set the YAG phosphor content 85wt.% and the intensity of the luminescent film made of epoxy resin to 1); the thickness of the luminescent ceramic sheet is 0.6mm, and the transmittance> 20%.
Example Embodiment
[0077] Example three
[0078] Add 50wt.% long afterglow phosphor (SrAl 2 O 4 :Eu) and 50wt.% low melting glass powder (D 50 =10μm)) After mixing uniformly, 0.5wt.% PVB binder is added to make granulated powder of 80-100 mesh, which is pressed into a luminescent ceramic chip body with corresponding shape by using a press.
[0079] Put the luminescent ceramic chip body into a sintering furnace, set the debinding zone (350-395℃) to run for 2-3 hours, and the sintering zone (410°C) to run for 1 hour to make a long afterglow luminescent ceramic chip. Under 450nm excitation light, Its emission spectrum is as image 3 .
[0080] Expose the long afterglow luminescent ceramic sheet to sunlight for 5 minutes, and test its attenuation within 30 minutes to obtain Figure 4 The curve shown.
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