Imidazole epoxy curing agent micro capsule and preparation method thereof

An epoxy curing agent and imidazole technology, applied in the field of imidazole epoxy curing agent microcapsules and their preparation, can solve the problems affecting the storage period of the curing agent, poor coating effect and thermal stability, etc. , convenient storage and transportation, easy-to-control effects

Inactive Publication Date: 2014-12-10
JIANGHAN UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, its coating effect and thermal stability are usually not good, so

Method used

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  • Imidazole epoxy curing agent micro capsule and preparation method thereof
  • Imidazole epoxy curing agent micro capsule and preparation method thereof
  • Imidazole epoxy curing agent micro capsule and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] (1) Weigh 1g of polysulfone and dissolve it in 30ml of dichloromethane, and add 1g of 1-benzyl-2-methylimidazole to it; (2) Use an ultrasonic oscillator to disperse it evenly and use it as the oil phase; (3) Add the obtained oil phase to 300ml aqueous solution containing 1wt% polyvinyl alcohol at 30°C and 750rpm, and then stir at 35°C for 5 hours to let the dichloromethane volatilize slowly to obtain polysulfone-coated imidazole solidified (4) After sieving, washing with water, suction filtration and drying, a light yellow microcapsule product can be obtained. refer to figure 1 , figure 1 Scanning electron micrographs of the microcapsules prepared for this example. The volume average particle diameter of the prepared microcapsules is analyzed to be about 110 μm, and the capsule core content is 25%.

Embodiment 2

[0028] (1) Weigh 2g of polysulfone and dissolve it in 50ml of dichloromethane, and add 1g of 1-benzyl-2-methylimidazole to it; (2) Use an ultrasonic oscillator to disperse it evenly and use it as the oil phase; (3) Add the obtained oil phase to 500ml aqueous solution containing 1wt% octylphenol polyoxyethylene ether at 30°C and a rotation speed of 1000rpm, then stir at 35°C for 7 hours, let the dichloromethane volatilize slowly, and obtain the polysulfone package Microcapsule suspension covered with imidazole curing agent; (4) light yellow microcapsule product can be obtained after sieving, washing with water, suction filtration and drying. refer to figure 2 , figure 2 Scanning electron micrographs of the microcapsules prepared for this example. The volume average particle diameter of the prepared microcapsules is analyzed to be about 140 μm, and the capsule core content is 23%.

Embodiment 3

[0030] (1) Weigh 1g of polysulfone and dissolve it in 30ml of dichloromethane, and add 2g of 1-benzyl-2-methylimidazole to it; (2) Use an ultrasonic oscillator to disperse it evenly and use it as the oil phase; (3) Add the obtained oil phase to 300ml of aqueous solution containing 1wt% Tween-80 at 30°C and 800rpm, and then stir at 40°C for 7 hours to allow the dichloromethane to volatilize slowly to obtain polysulfone-coated imidazoles Solidifying agent microcapsule suspension; (4) After sieving, washing with water, suction filtration and drying, a light yellow microcapsule product can be obtained. refer to image 3 , image 3 Scanning electron micrographs of the microcapsules prepared for this example. The volume average particle diameter of the prepared microcapsules is analyzed to be about 40 μm, and the capsule core content is 20%.

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Abstract

The invention relates to an imidazole epoxy curing agent micro capsule and a preparation method thereof, belonging to the technical field of latent epoxy curing agents. According to the curing agent micro capsule, polysulfone plastic is adopted as a wall raw material, an imidazole epoxy curing agent is adopted as a capsule core, and an emulsion-solvent evaporation method is adopted to prepare the polysulfone coated imidazole epoxy curing agent micro capsule. The preparation method of the micro capsule provided by the invention is simple in process and low in cost; the imidazole epoxy curing agent micro capsule is solid powder and has the characteristics of high coating rate and stability at normal temperature; as the imidazole curing agent is embedded into a container of a polysulfone polymer, the imidazole curing agent is not easy to release at normal temperature, is convenient to store and transport, can achieve the purpose of rapid curing by only being heated to be an appointed temperature when being used, and can be widely applied to the fields such as latent prepreg, self-repairing composite materials and semiconductor device packaging materials.

Description

technical field [0001] The invention belongs to the technical field of latent epoxy curing agents, in particular to an imidazole epoxy curing agent microcapsule and a preparation method thereof. Background technique [0002] Epoxy resin has the advantages of excellent physical, mechanical and electrical insulation properties, adhesion, corrosion resistance, easy processing and molding, and low cost. It is widely used in electronic appliances, aerospace, construction, machinery, transportation and other fields. The commonly used epoxy resin system is a two-component system, that is, the epoxy resin and the curing agent are stored separately. When used, on-site batching is required, which is likely to cause material loss and environmental pollution. In addition, the measurement error and mixing of the two-component batching Inhomogeneity can easily cause fluctuations in important properties such as product bonding strength. Therefore, the single-component epoxy resin system, ...

Claims

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Application Information

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IPC IPC(8): C08G59/40B01J13/02
Inventor 汪海平
Owner JIANGHAN UNIVERSITY
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