Room-temperature curing epoxy resin adhesive and preparation method thereof

An epoxy resin glue, room temperature curing technology, used in epoxy resin glue, adhesives, adhesive additives and other directions, can solve the problem of high curing temperature, achieve strong solubility, high electrochemical stability, excellent mechanical properties and thermal stability. performance effect

Active Publication Date: 2014-12-17
CHANGZHOU INST OF ENERGY STORAGE MATERIALS &DEVICES
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to provide a room temperature curing epoxy resin adhesive and a preparation method thereof in order to solve the problem that the existing epoxy resin adhesive has a higher curing temperature.

Method used

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  • Room-temperature curing epoxy resin adhesive and preparation method thereof
  • Room-temperature curing epoxy resin adhesive and preparation method thereof
  • Room-temperature curing epoxy resin adhesive and preparation method thereof

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preparation example Construction

[0032] The preparation method of magnetic ionic liquid of the present invention preferably comprises:

[0033] Step 1: dissolving 1-hydroimidazole and an iodine-containing alkyl compound in a solvent, and then adding potassium hydroxide to react to obtain the first mixed solution;

[0034] Step 2: reacting the first mixed solution with methyl iodide to obtain a second product;

[0035] Step 3: reacting the second product with ferric trichloride hexahydrate or ferric tribromide hexahydrate to obtain a magnetic ionic liquid.

[0036] According to the present invention, the solvent in Step 1 is not particularly limited, as long as it can dissolve 1-hydroimidazole and an iodine-containing alkyl compound, preferably toluene, the reaction temperature in Step 1 is preferably 45-55°C, and the reaction time is preferably 3 to 5 hours. The general structural formula of the iodine-containing alkyl compound is CH 3 (CH 2 ) n CH 2 I, where n=1-15, the molar ratio of the 1-hydroimidaz...

Embodiment 1

[0044] Dissolve 1mol 1-hydroimidazole and 1mol methyl iodide in toluene, add 1mol KOH, stir at 45°C for 5 hours, add 1mol methyl iodide, heat up to 55°C and continue stirring for 3 hours, cool to room temperature, distill off the solvent under reduced pressure, and dry , to obtain the product, the product was stirred with 1mol ferric chloride hexahydrate at 25°C for 5 hours, after the reaction was completed, it was left to stand for 24 hours, vacuum-dried for 2 hours after vacuum distillation, and the magnetic ionic liquid 1,3-dimethyl Imidazolium tetrachloride salt.

Embodiment 2

[0046] Dissolve 1 mol of 1-hydroimidazole and 1 mol of iodobutane in toluene, add 1 mol of KOH and stir at 55°C for 3 hours, then add 1 mol of methyl iodide, heat up to 65°C and continue stirring for 1 hour, cool to room temperature, and distill off the solvent under reduced pressure. Dry to obtain the product. Stir the product with 1mol ferric chloride hexahydrate at 25°C for 7 hours. After the reaction is completed, let it stand for 24 hours, vacuum-dry it for 2 hours after vacuum distillation, and obtain the magnetic ionic liquid 1-butyl-3 - methylimidazolium tetrachloride ferric salt.

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Abstract

The invention provides a room-temperature curing epoxy resin adhesive and a preparation method thereof and belongs to the technical field of adhesives, solving the problem of relatively high curing temperature of an existing epoxy resin adhesive. The room-temperature curing epoxy resin adhesive comprises the following raw materials in parts by weight: 100 parts of epoxy resin, 20 parts of an aromatic amine epoxy curing agent, 2-10 parts of magnetic ion liquid, 5 parts of a diluent and 5 parts of a filling agent. According to the room-temperature curing epoxy resin adhesive, the structure of the magnetic ion liquid in the room-temperature curing epoxy resin adhesive comprises tertiary amine and quaternary ammonium salt structures due to the existence of the magnetic ion liquid, so that epoxy groups can be cured and catalyzed; when the magnetic ion liquid cooperates with the aromatic amine epoxy curing agent to cure the epoxy resin, the defect of high-temperature use under the high-temperature curing condition in a conventional curing process of the aromatic amine curing agent can be effectively overcome, the epoxy resin can be quickly cured at the room temperature, and a cured material is excellent in mechanical property and heat performance.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to a room temperature curing epoxy resin adhesive and a preparation method thereof. Background technique [0002] As a high-performance resin, epoxy resin has excellent bonding properties, mechanical properties, electrical insulation properties, chemical stability and other advantages, so it is widely used in adhesives, coatings, functional materials and other industries. As a kind of epoxy adhesive, room temperature curing epoxy adhesive has a series of advantages such as time saving, labor saving, energy saving, and convenient use. It has become one of the important varieties with wide application and large quantity in the field of adhesives. In terms of "room temperature vulcanization and high temperature use" curing agent, no obvious breakthrough has been made at home and abroad. This is reflected in the fact that the room temperature vulcanization system is mainly...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J11/04C09J11/06C08G59/56
Inventor 魏巍郑昌梅郑春柏尹园柳美华邓鹏飏
Owner CHANGZHOU INST OF ENERGY STORAGE MATERIALS &DEVICES
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