The invention discloses a solder stripping agent, which is prepared from the following components: 500 to 650g / L of 70 percent nitric acid, 50 to 70g / L of hydrochloric acid, 4.3 to 8.6g / L of ferric nitrate or 2.9 to 5.8g / L of ferric trichloride or 4.8 to 9.7g / L of ferric chloride hexahydrate, 0.5 to 25g / L of organic acid complexing agent, 1 to 50g / L of water-soluble organic amine, 1 to 10g / L of organic corrosion inhibitor for copper, 1 to 2g / L of stabilizing agent, 1 to 5g / L of surfactant, and 0.1 to 1g / L of small molecular alcohol. The solder stripping agent can quickly strip solder or solder alloy layers thoroughly, basically cannot generate or generates little salt mist containing nitric oxides in the stripping process, and has the advantages of small silt amount, long service life of stripping solution, no strong corrosion on copper at a bottom layer, bright substrate and the like.