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Potting material of metallic film capacitor

A metallized film and capacitor technology, applied in the direction of fixed capacitor casing/packaging, fixed capacitor parts, etc., can solve the problems of high viscosity internal stress, poor temperature shock resistance, insufficient elasticity, etc., to achieve small linear expansion coefficient, Strong permeability and good elasticity

Inactive Publication Date: 2015-02-04
SUZHOU KEMAO ELECTRONICS MATERIALS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, there are still many shortcomings in the performance of epoxy potting materials for electronics at present, such as: insufficient elasticity, high viscosity, certain internal stress during curing, easy cracking, poor thermal shock resistance, etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Embodiment 1: Prepare metallized film capacitor potting compound, take 55 parts of E-51, 3 parts of benzyldiamine, 8 parts of liquid methyltetrahydrophthalic anhydride, 6 parts of anilinomethyltrimethoxysilane, It is prepared by mixing 1 part of n-butyl glycidyl ether, 25 parts of aluminum nitride, 1 part of emulsified silicone oil emulsifier and 1 part of active toughening agent and curing.

Embodiment 2

[0023] Embodiment 2: Prepare metallized film capacitor potting compound, take 58 parts of E-44, 4 parts of benzyldiamine, 6 parts of liquid methyltetrahydrophthalic anhydride, 7 parts of anilinomethyltrimethoxysilane, It is prepared by mixing 1 part of allyl glycidyl ether, 22 parts of aluminum nitride, 1 part of emulsified silicone oil emulsifier and 1 part of active toughening agent and then curing.

[0024] The invention discloses a metallized film capacitor potting compound, which is added with a reasonable ratio of accelerator, curing agent, coupling agent, diluent, filler, defoamer and Made of toughening agent, it has good electrical properties, heat resistance and aging stability. At the same time, it has the characteristics of good elasticity, low viscosity, strong permeability, small linear expansion coefficient and good thermal conductivity, which can improve the capacitance and thermal conductivity of capacitors. Electric strength, and can improve partial discharge ...

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PUM

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Abstract

The invention discloses a potting material of a metallic film capacitor. According to weight, the potting material contains 50-60 parts of epoxy resin base materials, 2-4 parts of accelerants, 5-8 parts of curing agents, 5-7 parts of coupling reagents, 1-2 parts of diluents, 20-25 parts of padding, 1-2 parts of defoaming agents and 1-2 parts of flexibilizers. The epoxy resin base materials are low-molecular-weight bisphenol A-type epoxy resin; the accelerants are benzyl diamine; the curing agents are anhydride curing agents; the coupling reagents are silane coupling agents; the diluents are reactive diluents; the padding is aluminium nitride; the defoaming agents are silicone emulsion emulgators; the flexibilizers are active flexibilizers. Therefore, the potting material of the metallic film capacitor has the advantages of good elasticity, small viscosity, strong permeability and good thermal conductivity; can improve the capacitor and electric strength of capacitors; can improve local discharge performance and heat resistance.

Description

technical field [0001] The invention relates to the field of electronic component materials, in particular to a potting material for metallized film capacitors. Background technique [0002] In the production of metallized film capacitors, the main dielectric and the pores between the plate and the main dielectric are usually potted with a material to improve capacitance and insulation performance, and improve partial discharge and heat resistance. There are many kinds of potting materials at present, but the most commonly used ones are various synthetic polymers, epoxy resin, silicone, silicone epoxy, polyimide, liquid crystal polymer, hydroxyl-terminated polybutadiene, Various types of polyurethane, etc., among which epoxy resin potting material is widely used because of its various excellent properties. [0003] However, there are many deficiencies in the performance of epoxy potting materials for electronics at present, such as: insufficient elasticity, high viscosi...

Claims

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Application Information

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IPC IPC(8): H01G4/224C08L63/00C08G59/42C08K3/28
Inventor 邹黎清
Owner SUZHOU KEMAO ELECTRONICS MATERIALS TECH