Copper cleaning agent and preparation method thereof

A technology of cleaning agent and emulsifier, which is applied in the field of copper cleaning agent and its preparation, can solve the problems of over-corrosion, reduce the consumption of industrial three-strong acid, etc., and achieve the effect of easy cleaning, avoiding poisoning and failure, and no oil residue

Active Publication Date: 2015-03-04
PINGGAO GRP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The first object of the present invention is to provide a copper cleaning agent, which solves the technical problems of reducing the usage of industrial three strong acids, reducing the health hazards of the cleaning agent to operators, and avoiding the excessive corrosion of the cleaning agent on the copper substrate

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The weight percentage composition of copper cleaning agent in the present embodiment is composed of: inorganic acid 20%, organic acid 10.5%, surfactant 14%, penetrating agent 8%, emulsifier 7%, defoamer 4%, complexing agent 5%, the balance is water.

[0028] The inorganic acid is a mixture of sulfuric acid and hydrofluoric acid, and the mass ratio of the two acids is sulfuric acid:hydrofluoric acid=9:1;

[0029] The organic acid is a mixture of malic acid, phytic acid and succinic acid, and the mass ratio of the three acids is malic acid:phytic acid:succinic acid=1:1.25:3;

[0030] The surfactant is a mixture of nonylphenol polyoxyethylene ether-9 and dodecyldimethylbetaine, wherein the mass ratio of the two surfactants is 3:2;

[0031] The penetrating agent is propylene glycol butyl ether; the emulsifier is OP-10; the defoamer is butyl ether;

[0032] The complexing agent is a mixture of trisodium citrate, tetrasodium ethylenediaminetetraacetic acid, and humic acid. ...

Embodiment 2

[0041] The weight percentage composition of cleaning agent in the present embodiment consists of: inorganic acid 15%, organic acid 20%, surfactant 18%, penetrant 5%, emulsifier 15%, defoamer 2%, complexing agent 2% %, the balance is water.

[0042] The inorganic acid is a mixture of sulfuric acid and hydrochloric acid, and the mass ratio of the two acids is sulfuric acid:hydrochloric acid=2:1;

[0043] The organic acid is a mixture of phytic acid and succinic acid, and the mass ratio of the two acids is 3:2;

[0044] The surfactant is a mixture of nonylphenol polyoxyethylene ether-9 and imidazoline laurate betaine amphoteric surfactant, wherein the mass ratio of the two surfactants is 5:1;

[0045] The penetrating agent is ethylene glycol butyl ether; the emulsifier is OP-10; the defoamer is butyl ether;

[0046] The complexing agent is a mixture of trisodium citrate and humic acid, and the mass ratio of the two complexing agents is 1:1.

[0047] The preparation method of p...

Embodiment 3

[0055] The weight percentage composition of cleaning agent in the present embodiment consists of: inorganic acid 30%, organic acid 10%, surfactant 10%, penetrant 12%, emulsifier 6%, defoamer 6%, complexing agent 8% %, the balance is water.

[0056] Among them, the inorganic acid is a mixture of sulfuric acid, hydrofluoric acid and nitric acid, and the mass ratio of the three acids is sulfuric acid: hydrofluoric acid: nitric acid = 6:5:4;

[0057] The organic acid is a mixture of malic acid and phytic acid, and the mass ratio of the two acids is malic acid:phytic acid=1:3;

[0058] Surfactant is nonylphenol polyoxyethylene ether-9;

[0059] The penetrating agent is a mixture of propylene glycol butyl ether and ethylene glycol butyl ether, and the mass ratio of the two penetrating agents is propylene glycol butyl ether: ethylene glycol butyl ether=2:1;

[0060] The emulsifier is OP-10; the defoamer is butyl ether; the complexing agent is humic acid.

[0061] The preparation m...

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PUM

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Abstract

The invention discloses a copper cleaning agent and a preparation method thereof. The copper cleaning agent disclosed by the invention consists of an inorganic acid, an organic acid, a surfactant, a penetrating agent, an emulsifier, a defoaming agent, a complexing agent and water. The inorganic acid and the organic acid are compounded, the hazards to health of cleaning workers caused by individual use of the inorganic acid in the traditional cleaning agent are avoided, over etching of a copper workpiece is also avoided, the copper cleaning agent is an environmental-friendly cleaning agent and has a certain oiliness, an effect of cleaning dirt such as oil attached to the surface of a copper part is improved by using the cleaning agent, the cleaning agent solution is acidic, and the oxide skin on the surface of the copper part can be well removed. The cleaning agent prepared by the invention is simple in using method, the copper part only needs to be soaked at normal temperature for 2-5 minutes so as to be cleaned, no greasy dirt residue is left on the cleaned copper part, the color of the surface of the copper part is the copper base color, and the cleaning effect is obvious. The copper cleaning agent disclosed by the invention is simple in preparation method, low in cost and obvious in effect and is suitable for industrial production and application.

Description

technical field [0001] The invention relates to the field of chemical cleaning agents, in particular to a copper cleaning agent and a preparation method thereof. Background technique [0002] Copper and its alloys are widely used in material engineering due to their excellent electrical conductivity, thermal conductivity and ductility, especially in the high-voltage electrical industry as conductive contact surfaces. During the use of copper alloys, different use environments such as alkaline, acidic, neutral solutions and marine environments can cause corrosion of copper alloys, thereby affecting their electrical conductivity; in the electrical industry, copper is used as a conductive contact surface , before assembly or electroplating, it is necessary to ensure that the surface is clean. The surface of the copper part must be cleaned. The quality of the cleaning directly affects the performance and quality of the subsequent film layer. [0003] At present, the research on...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23G1/10
CPCC23G1/103
Inventor 易传贵刘永史鸿威陈东风
Owner PINGGAO GRP
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