High-temperature-resistant high-thermal-conductivity boron-dopedorganosilicon epoxy pouring sealant as well as preparation method and application thereof

A silicone epoxy, high thermal conductivity technology, applied in the direction of epoxy resin glue, adhesives, other chemical processes, etc., can solve the problems of poor compatibility, difficulty, and affecting the overall performance of packaging materials, and achieve excellent moisture resistance and high humidity resistance. Effect of thermal conductivity and excellent high temperature resistance

Active Publication Date: 2015-04-01
GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, ordinary organosiloxane or polysiloxane has poor compatibility with epoxy resin, and it is difficult to form a uniform mixture before curing, which will inevitably affect the overall performance of the encapsulation material

Method used

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  • High-temperature-resistant high-thermal-conductivity boron-dopedorganosilicon epoxy pouring sealant as well as preparation method and application thereof
  • High-temperature-resistant high-thermal-conductivity boron-dopedorganosilicon epoxy pouring sealant as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Preparation of diphenylsilanediol modified epoxy resin:

[0036] (1) Referring to the method in the document [1], the diphenylsilanediol modified epoxy resin SE0 was prepared using stannous octoate as a catalyst.

[0037] Document 1: Wu Wanyao, Yu Moufa, Lin Guoliang. Study on Heat Resistance of Diphenylsilanediol Modified Epoxy Resin[J]. Journal of Xiamen University (Natural Science Edition), 2009,48(2):251-254

[0038] (2) Add 600g of epoxy resin E-51 into a 1000mL three-necked flask, add 7.7g of catalyst aluminum acetylacetonate, heat up to 110°C, slowly add 162g of diphenylsilanediol three times within 1 hour under stirring, Continue to react for 4 hours, cool to obtain viscous liquid 769.7g, which is diphenylsilanediol modified epoxy resin SE1 containing aluminum acetylacetonate (the aluminum acetylacetonate content is 1.00wt% in SE1, diphenylsilanediol Alcohol-modified epoxy resin content is 99.00wt%), sealed preservation, standby.

[0039] (3) Add 504.6g of cyc...

Embodiment 2

[0041] Preparation of boron-modified methyl MQ silicone resin:

[0042] (1) In a 1000mL three-necked flask, add 60wt% xylene solution of methyl MQ silicone resin (product of Guangzhou Delta Organic Silicon Technology Development Co., Ltd., hydroxyl content 2.0wt%) 500g, add boric acid 21g and 79g of absolute ethanol was heated to 90°C for 8 hours to react, and cooled to obtain 600g of boron-modified methyl MQ silicone resin BMQ1 solution.

[0043] (2) In a 1000mL three-necked flask, add 500g of 60wt% xylene solution of methyl MQ silicone resin (product of Guangzhou Delta Organosilicon Technology Development Co., Ltd., hydroxyl content 2.0wt%), and add trimethyl borate under stirring 18g of ester was heated up to 70°C to react for 4 hours, then cooled to obtain 518g of boron-modified methyl MQ silicone resin BMQ2 solution.

[0044] (3) In a 1000mL three-necked flask, add 500g of 60wt% xylene solution of methyl MQ silicone resin (product of Guangzhou Delta Organic Silicon Techn...

Embodiment 3

[0047] A preparation method of high temperature resistant and high thermal conductivity bora silicone epoxy potting glue, comprising the following steps:

[0048] (1) Get 100g of the diphenylsilanediol-modified epoxy resin SE0 prepared in Example 1, heat up to 60°C, add 1g of aluminum acetylacetonate and 40g of boron-modified methyl MQ silicon prepared in Example 2 Resin BMQ1 solution, after stirring evenly, remove the organic solvent under reduced pressure to obtain component A;

[0049] (2) Add 60 g of 300-mesh boron nitride, 35 g of 1250-mesh boron nitride and 5 g of 9000-mesh boron nitride into 100 g of methyl hexahydrophthalic anhydride, and mix well to obtain component B;

[0050] (3) Take 100g of components A and B and mix them evenly to obtain the potting glue, place them in an oven at 110°C for 4 hours to cure, and obtain a cured high-temperature-resistant and high-thermal-conductivity bora silicone epoxy potting glue. It was tested for performance, and the results a...

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Abstract

The invention discloses a high-temperature-resistant high-thermal-conductivity boron-doped organosilicon epoxy pouring sealant as well as a preparation method and an application thereof. The pouring sealant comprises a component A and a component B, wherein the component A comprises 100 parts of diphenylsilanediol modified epoxy resin, 1-5 parts of anacetylacetone metal complex and 20-100 parts of boron-modified methyl MQ silicon resin; the component B comprises 100 parts of liquid anhydride and 50-100 parts of boron nitride heat-conducting ceramic powder. The prepared boron-doped organosilicon epoxy composite material has excellent moistureresistance and heat resistance, high mechanical strength and the high heat-conducting property and is suitable to be used as a high-temperature-resistant high-thermal-conductivity insulating moisture-resistant packaging protection material.

Description

technical field [0001] The invention belongs to the field of adhesives, and in particular relates to a high-temperature-resistant and high-thermal-conductivity bora organosilicon epoxy potting adhesive and its preparation method and application. Background technique [0002] With the rapid development of electronics, communications, semiconductor components integration, power and miniaturization, heat dissipation has become a key factor restricting the stability and durability of components. A large number of experiments have proved that for every 18°C ​​increase in temperature, the possibility of component failure increases by 2 to 3 times. In order to greatly improve the heat dissipation performance of the packaging system, people have designed a printed circuit board (PCB) with high thermal conductivity insulating alumina ceramic base, aluminum nitride ceramic base and boron nitride ceramic base as the bottom layer, such as Chinese patent (ZL200710019440 .1 "High thermal...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J183/04C09J11/04C08G59/42C08G77/398C09K3/10H05K1/03
Inventor 黄月文王斌
Owner GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI
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