Low-stress transparent epoxy resin adhesive capable of curing fast at room temperature

A technology of transparent epoxy resin and epoxy resin glue, which is applied in the direction of epoxy resin glue, adhesives, adhesive additives, etc., can solve the problems of electrical insulation performance decline, damage, and large curing stress, and achieve impact resistance and durability. Excellent aging performance, good maintainability, and good aging resistance

Active Publication Date: 2015-04-01
信泰永合(烟台)新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when polythiol reacts with epoxy resin, a large amount of heat is released, and the heat release will generate high curing stress, causing stress deformation, cracks and shrinkage, and the electrical insulation performance will decrease. The bonding of precision devices will be affected by high heat and stress. The deformation affects the installation accuracy, and the packaging of chips and components may even be deformed and damaged; compared with other types of elastic sealants, the cured product is hard and brittle, and cannot be repaired, which limits its application in chips, electronic components and precision devices. Applications in Manufacturing
[0003] In the prior art, modified epoxy resins such as carboxyl-terminated (hydroxyl)-based nitrile rubber, polyurethane, and acrylate, or inert substances such as dibutyl phthalat

Method used

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  • Low-stress transparent epoxy resin adhesive capable of curing fast at room temperature
  • Low-stress transparent epoxy resin adhesive capable of curing fast at room temperature
  • Low-stress transparent epoxy resin adhesive capable of curing fast at room temperature

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] A room-temperature fast-curing low-stress transparent epoxy resin adhesive, which is composed of a mixture of epoxy resin component A and curing agent B component; (each 1 part is calculated as 10g)

[0035] The epoxy resin A component described therein includes: 680g hydrogenated bisphenol A epoxy resin, 150g bisphenol A glycidyl ether epoxy resin, 100g poly(propylene glycol) 4-nonylphenylene ether acrylate, 30g1,4- Butanediol diacrylate, 30g three (2-hydroxyethyl) isocyanurate triacrylate and 10g KH560; 680g hydrogenated bisphenol A epoxy resin, 150g bisphenol A glycidyl ether epoxy resin, 100g poly (Ethylene glycol) phenyl ether acrylate and 30g of 1,4-butanediol diacrylate were placed in a 2L double star dynamic mixing kettle, stirred at high speed for 30 minutes, and then added 30g of tris (2-hydroxyethyl) isocyanuric acid Stir triacrylate and 10g KH560 for 30 minutes, stir at low speed and vacuumize for 30 minutes, decompress, filter, and discharge;

[0036] The ...

Embodiment 2

[0039] A room-temperature fast-curing low-stress transparent epoxy resin adhesive, which is composed of a mixture of epoxy resin component A and curing agent B component; (each 1 part is calculated as 10g)

[0040] The epoxy resin A component described therein comprises: 550g hydrogenated bisphenol A epoxy resin, 200g bisphenol A glycidyl ether epoxy resin, 150g poly(ethylene glycol) 4-nonylphenylene ether acrylate, 50g 1 , 6-hexanediol diacrylate, 35g tris(2-hydroxyethyl)isocyanurate triacrylate and 15g KH560; 550g hydrogenated bisphenol A epoxy resin, 200g bisphenol A glycidyl ether epoxy resin , 150g of poly(ethylene glycol) phenyl ether acrylate and 50g of 1,6-hexanediol diacrylate were placed in a 2L double-star dynamic mixing kettle, stirred at high speed for 30 minutes, and then added 35g of tris(2-hydroxyethyl) Stir isocyanurate triacrylate and 15g KH560 for 30 minutes, stir at low speed and vacuumize for 30 minutes, decompress, filter, and discharge;

[0041] The curin...

Embodiment 3

[0044] A room-temperature fast-curing low-stress transparent epoxy resin adhesive, which is composed of a mixture of epoxy resin component A and curing agent B component; (each 1 part is calculated as 10g)

[0045] The epoxy resin A component described therein includes: 700g hydrogenated bisphenol A epoxy resin, 100g bisphenol A glycidyl ether epoxy resin, 130g poly(propylene glycol) 4-nonylphenylene ether acrylate, 25g 1,4 -Butanediol diacrylate, 40g tris(2-hydroxyethyl)isocyanurate triacrylate and 5g KH560; mix 700g hydrogenated bisphenol A epoxy resin, 100g bisphenol A glycidyl ether epoxy resin, 130g Poly(ethylene glycol) phenyl ether acrylate and 25g 1,4-butanediol diacrylate were placed in a 2L double star dynamic mixing kettle, stirred at high speed for 30 minutes, and then 40g tris(2-hydroxyethyl)isocyanate was added Stir uric acid triacrylate and 5g KH560 for 30 minutes, stir at low speed and vacuumize for 30 minutes, decompress, filter, and discharge;

[0046] The c...

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Abstract

The invention belongs to the technical field of adhesives, and in particular relates to a low-stress transparent epoxy resin adhesive capable of curing fast at room temperature. The low-stress transparent epoxy resin adhesive is prepared by mixing an epoxy resin component A and a curing agent component B at the volume ratio of 1:1, wherein the epoxy resin component A comprises hydrogenated bisphenol A epoxy resin, bisphenol A glycidyl ether epoxy resin, functional acrylate monomer, an acrylate diluent, a tackifying accelerator and a silane coupling agent; the curing agent component B comprises polymercaptan, a tertiary amine accelerator, a vulcanizing accelerator, a stabilizer, a curing accelerator I and a curing accelerator II. While keeping 5-minute fast curing, high transparency and better bonding strength, the adhesive prepared by the invention has low exothermal temperature and small stress during curing, achieves better applicability in assembly of electronic devices, and has excellent electric insulativity, voltage breakdown resistance, shock resistance and aging resistance, and the application range of mercaptan-epoxy resin type adhesives in manufacturing of electronic devices is greatly expanded.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to a room-temperature fast-curing low-stress transparent epoxy resin adhesive. Background technique [0002] Due to its high cohesive strength and high crosslinking density, epoxy resin adhesives have excellent bonding performance, electrical insulation performance and chemical resistance to most rigid materials; 5-minute curing epoxy resin with polythiol as curing agent Adhesive, which can be quickly bonded and fixed at room temperature; because polythiol has a sulfur-containing flexible segment, it has high refractive index and light transmittance, and is suitable for fast bonding and fast bonding of transparent rigid plastics such as glass and PC and electronic components. Packaging, suitable for high-efficiency production line operations, is widely used in modern manufacturing. However, when polythiol reacts with epoxy resin, a large amount of heat is released, an...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J163/02C09J4/02C09J4/06C09J11/08C09J11/06
Inventor 刘铁钢林志秀林绍盛
Owner 信泰永合(烟台)新材料有限公司
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