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Organic light-emitting device packaging structure and packaging method thereof

A technology of electroluminescent devices and packaging structures, which is applied in organic light-emitting device structures, organic light-emitting devices, organic semiconductor devices, etc., and can solve the problem that the barrier performance of plastic substrates cannot meet the requirements of OLED packaging, and the life of flexible organic electroluminescent devices is short , There are many defects in the film structure of the device, etc., to achieve excellent packaging effect, benefit the life of the device, and reduce the effect of erosion

Inactive Publication Date: 2015-04-15
OCEANS KING LIGHTING SCI&TECH CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Flexible products are the development trend of organic electroluminescent devices. The difference between flexible organic electroluminescent devices and ordinary organic electroluminescent devices is that plastics are used as substrates, and the flatness of plastic substrates is poor, resulting in many structural defects in the device film layer, causing The device is damaged; moreover, the barrier properties of commonly used plastic substrates cannot meet the requirements of OLED packaging, so flexible organic electroluminescent devices generally have the problem of short life
At present, it has been reported that SiN x or SiO x Inorganic materials, such as magnetron sputtering, are placed on the surface of the metal cathode by methods such as magnetron sputtering, and are used as the packaging layer of organic electroluminescent devices. However, under the high temperature operating conditions of magnetron sputtering, the surface of the metal cathode is easily damaged.

Method used

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  • Organic light-emitting device packaging structure and packaging method thereof
  • Organic light-emitting device packaging structure and packaging method thereof
  • Organic light-emitting device packaging structure and packaging method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] figure 1 It is a schematic diagram of the packaging structure of an organic electroluminescent device provided in this embodiment. Such as figure 1 As shown, the packaging structure of the organic electroluminescent device is sequentially stacked with a conductive glass substrate 10 , an organic light-emitting functional layer 20 , a metal cathode 30 and a packaging layer 40 . Wherein, the organic light-emitting functional layer 20 includes a hole injection layer 21 , a hole transport layer 22 , a light-emitting layer 23 , an electron transport layer 24 and an electron injection layer 25 stacked sequentially from bottom to top. figure 2 yes figure 1 Schematic diagram of the component structure of the encapsulation layer, such as figure 2 As shown, the encapsulation layer 40 includes a germanium oxycarbide layer 41 , a first barrier layer 42 and a second barrier layer 43 sequentially stacked on the metal cathode 30 . More specifically, the encapsulation layer 40 in...

Embodiment 2

[0056] A packaging structure of an organic electroluminescence device, which sequentially includes a conductive glass substrate, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, a metal cathode and a packaging layer from bottom to top. The encapsulation layer is made of 4 layers of germanium oxycarbide / Al 2 o 3 :Cl layer / ZrO 2 : Multilayer composite film structure composed of Cl layer. Its preparation method is as follows:

[0057] (1) Pre-treatment of ITO glass substrates: ITO glass substrates are cleaned with acetone, ethanol, deionized water, and ethanol, all of which are cleaned with an ultrasonic cleaner. The single washing is cleaned for 5 minutes, then blown dry with nitrogen, and dried in an oven Standby; the cleaned ITO glass also needs surface activation treatment to increase the oxygen content of the conductive surface layer and improve the work function of the conductive layer surfa...

Embodiment 3

[0071] A packaging structure of an organic electroluminescent device, which sequentially includes a conductive glass substrate, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, a metal cathode and a packaging layer from bottom to top. The encapsulation layer is composed of 3 layers of germanium oxycarbide / Ga 2 o 3 :Cl layer / HfO 2 : Multilayer composite film structure composed of Cl layer. Its preparation method is as follows:

[0072] (1) Pre-treatment of ITO glass substrates: ITO glass substrates are cleaned with acetone, ethanol, deionized water, and ethanol, all of which are cleaned with an ultrasonic cleaner. The single washing is cleaned for 5 minutes, then blown dry with nitrogen, and dried in an oven Standby; the cleaned ITO glass also needs surface activation treatment to increase the oxygen content of the conductive surface layer and improve the work function of the conductive layer su...

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Abstract

The invention discloses an organic light-emitting device packaging structure comprising an anode conductive substrate, and an organic light-emitting functional layer, a metal cathode and a packaging layer which are sequentially stacked on the anode conductive substrate. The packaging layer comprises a germanium oxycarbide layer, a first barrier layer and a second barrier layer, which are sequentially stacked on the metal cathode. The first barrier layer is made of chlorine-doped R2O3, wherein R is an element in the group IIIA. The second barrier layer is made of chlorine-doped titanium oxide, chlorine-doped zirconium oxide or chlorine-doped hafnium oxide. The packaging structure has excellent performance in oxygen and moisture barrier, and can effectively release the film stress and significantly improve the service life of organic light-emitting devices. The invention further provides an organic light-emitting device packaging method which is applicable to the packaging of organic light-emitting devices prepared with a conductive glass substrate, and especially applicable to the packaging of flexible organic light-emitting devices packaged with a plastic or metal substrate.

Description

technical field [0001] The invention belongs to the packaging field of organic electroluminescent devices, and in particular relates to a packaging structure and a packaging method of organic electroluminescent devices. Background technique [0002] Organic electroluminescent device (OLED) is a current-mode semiconductor light-emitting device based on organic materials. Its typical structure is to prepare a layer of tens of nanometers thick organic light-emitting material on the ITO glass as the light-emitting layer, and the top of the light-emitting layer is a metal electrode. When a voltage is applied to the electrodes, the light-emitting layer produces light radiation. [0003] Organic electroluminescent materials are particularly sensitive to the intrusion of oxygen and water vapor. On the one hand, because oxygen is a quencher, the quantum efficiency of light emission will be significantly reduced, and the oxidation of oxygen to the hole transport layer will also reduc...

Claims

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Application Information

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IPC IPC(8): H01L51/52H01L51/54H01L51/56
CPCH10K50/8445H10K50/84H10K2102/00H10K2102/302H10K71/00
Inventor 周明杰钟铁涛王平张振华
Owner OCEANS KING LIGHTING SCI&TECH CO LTD
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