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Negative photosensitive resin composition

A technology of photosensitive resin and composition, which is applied in the field of cured film and negative photosensitive resin composition, which can solve the problems of poor pattern formation and development, lower storage stability, etc., and achieve the effect of high sensitivity and small shrinkage

Active Publication Date: 2015-05-20
NISSAN CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, when a thermal radical initiator is added to the conventional system, it is expected that the storage stability will decrease, or development failure will occur during pattern formation.

Method used

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  • Negative photosensitive resin composition
  • Negative photosensitive resin composition
  • Negative photosensitive resin composition

Examples

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Embodiment

[0135] Hereafter, although an Example is given and this invention is demonstrated in more detail, this invention is not limited to these Examples.

[0136] [Abbreviated symbols used in Examples]

[0137] The meanings of the abbreviations used in the following examples are as follows.

[0138] MAA: methacrylic acid

[0139] MI: maleimide

[0140] MMA: methyl methacrylate

[0141] BMAA: N-Butoxymethacrylamide

[0142] HEMA: 2-Hydroxyethyl methacrylate

[0143] ST: Styrene

[0144] AIBN: Azobisisobutyronitrile

[0145] PRG1: 1-(4-phenylthiophenyl)-1,2-octanedione-2-(O-benzoyl oxime)

[0146] PRG2: Diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide

[0147] HPC: Hydroxypropyl Cellulose

[0148] DPHA: dipentaerythritol penta / hexaacrylate

[0149] PETA: pentaerythritol triacrylate

[0150] PTSM: Morpholinate p-toluenesulfonate

[0151] PGME: Propylene Glycol Monomethyl Ether

[0152] PGMEA: Propylene Glycol Monomethyl Ether Acetate

[0153] CYM: Cymel 303 (manufactured by...

Synthetic example 1

[0157] As monomer components constituting the copolymer, MI (20.0g), BMAA (34.6g), ST (22.3g) were used, AIBN (4g) was used as a radical polymerization initiator, and they were carried out in a solvent PGME (150g). A polymerization reaction was carried out to obtain a copolymer solution (copolymer concentration: 35% by mass) of Mn5,200 and Mw12,000 (P1). In addition, the polymerization temperature is adjusted to a temperature of 60°C to 90°C.

Synthetic example 2

[0159] As the monomer components constituting the copolymer, use MAA (6.5g), BMAA (16.3g), ST (9.8g), use AIBN (1.8g) as a radical polymerization initiator, and make them in the solvent PGME (64g) A polymerization reaction was performed to obtain a copolymer solution (copolymer concentration: 30% by mass) of Mn6,000 and Mw12,000 (P2). In addition, the polymerization temperature is adjusted to a temperature of 60°C to 90°C.

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PUM

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Abstract

[Problem] To provide a negative photosensitive resin composition which can form a thick film even if the composition is in the form of a solution having a low viscosity, and which is free from tack before exposure, is capable of forming a high-resolution pattern by alkali development, and provides a coating film that has high transparency and undergoes small shrinkage after post-bake. [Solution] A photosensitive resin composition which contains the components (A), (B), (C), (D) and (E) described below; a cured film which is obtained using the resin composition; a interlayer insulating film for liquid crystal displays, which is formed of the cured film; and an optical filter which is formed of the cured film. Component (A): a copolymer which is obtained by copolymerizing a monomer mixture that contains at least (i) N-alkoxymethyl (meth)acrylamide and (ii) a monomer having an alkali-soluble group Component (B): a compound having two or more polymerizable groups Component (C): a photopolymerization initiator Component (D): a polymer having a hydroxy group Component (E): a solvent

Description

technical field [0001] The present invention relates to a negative photosensitive resin composition and a cured film obtained from the negative photosensitive resin composition. More specifically, the present invention relates to a photosensitive resin composition suitable for use as a display material, a cured film thereof, and various materials using the cured film. Background technique [0002] It is known that an epoxy cationic polymerization-based UV curable resin containing an epoxy compound and a photoacid generator has high transparency, and that a photosensitive resin composition containing this resin can increase the sensitivity of exposure, so it can be used in thick-film photosensitive resins. In other words, the thickness of the photosensitive resin composition layer obtained by applying the photosensitive resin composition can be increased (for example, Patent Document 1). However, since the coating film is sticky after application and before exposure, the han...

Claims

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Application Information

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IPC IPC(8): G03F7/033G02B5/20G03F7/004H01L51/50H05B33/22
CPCG02B5/20G03F7/0007G03F7/033H05B33/22
Inventor 内山芽育畑中真
Owner NISSAN CHEM IND LTD
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