Combined hot melt adhesive net film and preparing technology thereof
A preparation process, a technology of glued omentum, applied in adhesives, melt spinning, spinneret assemblies, etc., can solve problems such as poor adhesion of non-polar materials, achieve high bonding strength, high production efficiency, reduce The effect of production failure
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Embodiment 1
[0029] A composite hot-melt adhesive omentum, which is composed of polyamide hot-melt adhesive omentum and polyolefin hot-melt adhesive omentum. The DSC final melting point of the polyamide hot-melt adhesive used is 122°C, and the melt flow rate is 30g / 10min / 160°C; the composition and mass percentage of the polyolefin hot melt adhesive used are:
[0030] Maleic anhydride grafted high-density polyethylene (graft rate 1%) 8%;
[0031] High-density polyethylene (melt flow rate 0.9g / 10min / 190℃) 50%;
[0032] Ethylene-octene copolymer (melt flow rate 1.6g / 10min / 190℃) 10%;
[0033] Benzoyl Peroxide 0.2%;
[0034] Vinyltrimethoxysilane 1%;
[0035] Rosin 145 20%;
[0037] Antioxidant 1010 0.8%.
[0038] A preparation process of a composite hot-melt adhesive film, which melts the above-mentioned polyamide and polyolefin hot-melt adhesives and pumps them into the independent first spinneret and second spinneret; the distance between the two spinnerets i...
Embodiment 2
[0041] A composite hot-melt adhesive film, which is composed of polyamide hot-melt adhesive film and polyolefin hot-melt adhesive film. The DSC final melting point of the polyamide hot-melt adhesive used is 116°C, and the melt flow rate is 50g / 10min / 160°C; the composition and mass percentage of the polyolefin hot melt adhesive used are:
[0042] Maleic anhydride grafted low density polyethylene (graft rate 1.2%) 15%;
[0043] Linear low density polyethylene (melt flow rate 2g / 10min / 190℃) 60%;
[0044] Ethylene-octene copolymer (melt flow rate 3g / 10min / 190℃) 5%;
[0045]Di-tert-butyl peroxide 0.4%;
[0046] γ-Aminopropyltrimethoxysilane 1.3%;
[0047] Hydrogenated carbon five resin 10%;
[0048] Nano calcium carbonate 7.7%;
[0049] Antioxidant 1010 0.6%.
[0050] A preparation process of a composite hot-melt adhesive film, which melts the above-mentioned polyamide and polyolefin hot-melt adhesives and pumps them into the independent first spinneret and second spinneret;...
Embodiment 3
[0053] A composite hot-melt adhesive omentum, which is composed of polyamide hot-melt adhesive omentum and polyolefin hot-melt adhesive omentum. The DSC final melting point of the polyamide hot-melt adhesive used is 130°C, and the melt flow rate is 45g / 10min / 160°C; the composition and mass percentage of the polyolefin hot melt adhesive used are:
[0054] Maleic anhydride grafted linear low density polyethylene (graft rate 1%) 10%;
[0055] Low-density polyethylene (melt flow rate 7g / 10min / 190°C) 65%;
[0056] Polystyrene (melt flow rate 10g / 10min / 190°C) 3%;
[0057] Azobisisobutyronitrile 0.8%;
[0058] γ-Aminopropyltrimethoxysilane 0.7%;
[0059] Terpene resin 15%;
[0060] Kaolin 5%;
[0061] Antioxidant BHT 0.5%.
[0062] A preparation process of a composite hot-melt adhesive film, which melts the above-mentioned polyamide and polyolefin hot-melt adhesives and pumps them into the independent first spinneret and second spinneret; the distance between the two spinneret...
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