A kind of preparation method of aligned carbon nanotube
A carbon nanotube, tube furnace technology, applied in nanotechnology and other directions, can solve the problems of carbon nanotube orientation is not particularly obvious, the preparation speed is slow, the sample is entangled, etc., to achieve fast preparation speed, good orientation, and directional growth. uniform effect
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Embodiment 1
[0022] The preparation method of the present embodiment comprises the following steps:
[0023] Step 1. Clean the silicon wafer with ethanol and dry it, then use a coating machine to coat the surface of the dried silicon wafer. The coating material is iron-nickel alloy powder. The temperature of the coating is 1000°C, and the pressure of the coating is 0.000001Pa. The coating time is 30min; the mass percentage of nickel in the iron-nickel alloy powder is 33.5%;
[0024] Step 2. Place the silicon wafer coated in step 1 in an oxidation furnace, and oxidize it for 30 minutes under the conditions of 300° C. and 1 Pa in an oxidizing atmosphere; the oxidizing atmosphere is a mixed gas of oxygen and nitrogen, Wherein the volume percentage of oxygen is 2%;
[0025] Step 3, place the silicon wafer after the oxidation treatment in step 2 in a tube furnace, feed nitrogen into the tube furnace and heat up the tube furnace at a rate of 5°C / min. When the furnace temperature of the tube fu...
Embodiment 2
[0028] The preparation method of the present embodiment comprises the following steps:
[0029] Step 1: Clean the silicon wafer with ethanol and dry it, then use a coating machine to coat the surface of the dried silicon wafer. The coating material is iron-nickel alloy powder. The temperature of the coating is 1050°C, and the pressure of the coating is 0.00001Pa. The coating time is 25min; the mass percentage of nickel in the iron-nickel alloy powder is 35%;
[0030] Step 2. Place the silicon wafer coated in step 1 in an oxidation furnace, and oxidize it for 35 minutes under the conditions of 320° C. and 2 Pa in an oxidizing atmosphere; the oxidizing atmosphere is a mixed gas of oxygen and nitrogen, Wherein the volume percentage of oxygen is 2%;
[0031] Step 3. Place the oxidized silicon wafer in step 2 in a tube furnace, feed nitrogen gas into the tube furnace and raise the temperature of the tube furnace at a rate of 10°C / min. When the furnace temperature of the tube furn...
Embodiment 3
[0034] The preparation method of the present embodiment comprises the following steps:
[0035]Step 1. Clean the silicon wafer with ethanol and dry it, and then use a coating machine to coat the surface of the dried silicon wafer. The coating material is iron-nickel alloy powder. The temperature of the coating is 1100°C, and the pressure of the coating is 0.0001Pa. The coating time is 20min; the mass percentage of nickel in the iron-nickel alloy powder is 39%;
[0036] Step 2. Place the silicon wafer coated in step 1 in an oxidation furnace, and oxidize it for 60 minutes under the conditions of 360° C. and 1 Pa in an oxidizing atmosphere; the oxidizing atmosphere is a mixed gas of oxygen and nitrogen, Wherein the volume percentage of oxygen is 2%;
[0037] Step 3. Place the silicon wafer after the oxidation treatment in step 2 in a tube furnace, feed nitrogen into the tube furnace and heat up the tube furnace at a rate of 8°C / min. When the furnace temperature of the tube fur...
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Abstract
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