Diamond-doped aluminum-based composite heat radiation material and preparation method thereof

Abstract

The invention discloses a diamond-doped aluminum-based composite heat radiation material and a preparation method thereof. The heat radiation material is prepared from, by weight, 63-65 parts of aluminum, 2-5 parts of diamond nanopowder, 4-5 parts of aluminum nitride, 5-7 parts of ceramic powder, 4-8 parts of graphite powder, 1-4 parts of multi-walled carbon nano-tube, 5-8 parts of vanadium diboride, 1-2 parts of zirconium diboride, 8-10 parts of gold tailings, 1-3 parts of glycerol, 1-2 parts of triethanolamine, 0.4-0.8 parts of sodium borate, 1-5 parts of an assistant and 2-6 parts of a halogen-free fire retardant. Compared with traditional aluminum heat radiation materials, the material disclosed in the invention integrates the advantages of aluminum, aluminum nitride, diamond, the ceramic powder, the graphite powder and the multi-walled carbon nano-tube, and also has good heat conduction and insulating performances; the added assistant can enhance the compatibility among the above raw materials, and improves the sintering effect, so the material has the advantages of difficult generation of static electricity on the surface, solidness, corrosion resistance, durability, and good heat radiation capability, can well protect LED lights, and effectively prolongs the service life of the lights.

Description

technical field [0001] The invention relates to a heat dissipation material, in particular to a diamond-doped aluminum-based composite heat dissipation material and a preparation method thereof. Background technique [0002] The development of microelectronics technology has gradually increased the power of electronic products, followed by the heat dissipation problem of electronic products. The quality of heat dissipation performance affects the stability of the system and the life of the hardware. Taking LED as an example, if the temperature rises At 2°C, the performance of the chip will drop by 5%, and the service life will also drop by 10%. [0003] Existing LED heat dissipation materials mainly include metallic aluminum and aluminum alloys, alumina ceramics, thermally conductive plastics, and the like. Aluminum and aluminum alloys have high thermal conductivity, but the heat dissipation performance is not as good as that of alumina ceramics and heat-conducting plas...

AI Technical Summary

Problems solved by technology

Aluminum and aluminum alloys have high thermal conductivity, but the heat dissipation performance is not as good as that of alumina ceramics and heat-conducting plastics, and aluminum and aluminum alloys are good conductors of electricity, which have certain safety hazards as LED heat sinks; while ceramics and heat-conducting plastics have good heat dissipation performance and are insulated. Non-conductive, but the thermal conductivity is too low to meet the heat dissipation requirements of high-power LEDs. At the same time, both pure ceramic materials and aluminum alloy materials consume high energy consumption in the process of radiator preparation