Saw-tooth double-faced concave U sharp type concrete laser welding cutting disk preparation method

Abstract

The invention relates to a saw-tooth double-faced concave U sharp type concrete laser welding cutting disk preparation method and belongs to the technical field of diamond machining tools. The preparation method is implemented through the following working procedures that a metallic bond and diamond are subjected to material preparation, granulation, cold pressing, hot pressed sintering, laser welding, first edge forming, polishing, painting, checking packaging storage in sequence. According to the saw-tooth double-faced concave U sharp type concrete laser welding cutting disk preparation method, a diamond tool bit is formed by the procedures that the metallic bond and diamond are subjected to the hot pressed sintering under vacuum conditions. By means of the saw-tooth double-faced concave U sharp type concrete laser welding cutting disk preparation method, the prepared cutting disk has the advantages that the cutting seam is narrow, the consumable items are less, the cutting deflection is small, the cut edge is neat, the cutting sharpness is good, and the cutting disk is particularly suitable for the cutting of hard materials including building materials, wall bodies, cement concrete, solidified concrete, reinforced concrete, hard concrete bricks, concrete piles and the like.

Description

technical field

[0001] The invention relates to the technical field of superhard abrasive products, more specifically, the invention relates to a preparation method of a serrated double-sided concave U-sharp concrete laser welding cutting blade. Background technique

[0002] In today's market, diamond cutting discs have been widely used in the cutting and processing of marble, granite, concrete, asphalt, ceramics, glass, jewelry and jade, semiconductors and other materials, continuously improving product efficiency and reducing material loss, especially in the processing of precious stone, jade and glass products When it comes to semiconductor materials, reducing material loss and improving economic benefits are the common pursuit of the market. The diamond cutting blade is composed of two aspects: the diamond blade and the central substrate of the cutting disk. The thickness of the central substrate of the cutting disk determines the thickness of the diamond blade. The thic...

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