61results about How to "Narrow kerf" patented technology

A method for using laser to premachine the cracking slots before dividing connecting rods from each other includes such steps as fixing the laser cutting head above the position to be machined, which is near the hole on big end of connecting rod, regulating the incident angle of laser beam to 0-70 deg.C, turning on laser device, vertically moving the laser cutting head to machine the cracking slot to predefined depth, and repeating said steps to machine another cracking slot at another end of aconnecting rod.

The invention discloses a laser continuous cutting device used for cutting a saw belt and a cutting method. The laser continuous cutting device aims to solve the problems that continuous cutting and forming of sawteeth can not be achieved, tool auxiliary time accounts for a high percentage, and cutting efficiency is low in the prior art. The laser continuous cutting device comprises a base which is sequentially provided with a driving friction roller used for regulating feeding speed of the saw belt, a pressing wheel set used for pressing the saw belt, a work platform and a driving wheel set driven by a driving device; a laser head which is arranged on a Z shaft for cutting the saw belt is arranged above the work platform; the work platform is provided with a feeler block and a transverse locating mechanism used for locating the saw belt; during cutting work, the speed of a sliding platform X1 is the same as the feeding speed of the saw belt. The laser cutting sawtooth continuous forming technique does not need a milling cutter, and the sawteeth in any two-dimensional shapes can be correspondingly manufactured very rapidly.

The invention belongs to the technical field of glass wafer machining, and in particular, discloses a machining method for microcrystal glass wafers, and aims to solve the problems of lower utilization rate of raw materials in traditional microcrystal glass wafer machining methods and incapability of effectively improving the defects generated in the slicing process. The machining method for the microcrystal glass wafers comprises a strip shaping step, a dicing step, a block shaping step and a trimming step, and further comprises a slicing step, a finish grinding step and a polishing step. Linear cutting equipment is adopted for cutting, and can directly cut blocks to flaky blanks with a thickness below 1 mm; the diameter of steel wires is only about 0.13 mm; cutting gaps generated by slicing are narrow; and generated destruction layers are shallow. Compared with the traditional machining methods, the machining method increases the material utilization rate by about 80%, reduces the edge breakage width of the flaky blanks from initial more than 3 mm to below 0.15 mm, and can effectively improves the defects generated in the slicing process through finish grinding and polishing of the flaky blanks.

The invention discloses an identifying and trimming device for the two-dimensional irregular outer shape of a soft material. According to the device, the trimmed material can be flattened on a machineconveying belt, the shape contour and the surface condition of the trimmed material are subjected to two-dimensional visual identification, the material appearance is automatically trimmed by a waterjet scalpel, and the trimmed material is automatically returned to the position near the feeding position; and a machine is configured with an independently developed special-purpose program for control to replace human eyes and human hands, and all the processes of acquiring edge information such as the shape, holes and surface scars, calculating a cutting path, conducting visual identification,determining a trimming track, conducting trimming machining and returning to a feeding position are automatically completed. Moreover, in the same time period during which the previous piece of material is machined, the visual identification and processing track online calculation of a last piece of material are conducted in parallel, and the efficiency is improved.

The invention provides a cutting torch for cutting an ultrahigh-thickness 2000-3500 mm low-carbon and low-alloy steel ingot and belongs to the technical field of the ultrahigh-thickness low-carbon steel ingot oxygen cutting device. The invention aims to solve the technical problem in the background art that the 2000-3500 mm ultrahigh-thickness low-carbon and low-alloy steel ingot cannot be cut at high efficiency and good quality. The cutting torch is mainly characterized in that preheating oxygen and propane gas are not mixed inside the cutting tip of the cutting torch at first, and mixed and burnt in atmosphere after being jet out of the cutting torch instead, a preheating oxygen duct (5) and a gas duct (6) both are inclined toward the axis of the cutting torch, the diameter of the throat part of a large-flow cutting oxygen cutting tip (7) is 17-22 mm, each gas duct (6) is designed into a structure with the lower part thereof slightly spread, and the diameter of the inlet thereof is 4.5 mm, the spreading taper angle is 1.146% and the length of the spreading section is 8 mm. The cutting torch provided by the invention is suitable for good-quality and high-efficiency cutting of the ultrahigh-thickness 2000-3500 mm low-carbon and low-alloy steel ingot.

The invention discloses a processing method for processing a rectangular photovoltaic cell silicon wafer by using a primary single crystal silicon rod. The method comprises the following steps of step 1, determining eight longitudinal tangent lines formed by four straight lines shaped like a Chinese character "jing" and four edge straight lines on a cross section plane of the primary single crystal silicon rod; step 2, longitudinally cutting the primary single crystal silicon rod to obtain rectangular silicon ingots; step 3, splicing the rectangular silicon ingots to obtain a spliced silicon ingot; and step 4, cutting the spliced silicon ingot by using multiple planes to obtain the silicon wafer of a single crystal silicon photovoltaic cell. Compared with the prior art, the processing method is favorable for using a large-diameter single crystal silicon rod, is favorable for improving the distribution uniformity and symmetry of impurities doped in the silicon wafer, is favorable for improving the working production efficiency, and is favorable for reducing the head and tail slice loss; and in the slicing process, cutting silicon powder can be discharged, the cutting environment is improved, the production efficiency is improved, and the product quality is improved.

The invention discloses a double-wire annular diamond fretsaw horizontal cutting method and a numerical control jade fretsaw machine. The numerical control jade fretsaw machine is provided with a first cutting loop wire and a second cutting loop wire to conduct feeding simultaneously to cut a to-be-cut workpiece fixed to a rotating platform, two annular diamond fretsaws in the numerical control jade fretsaw machine are driven by a first cutting driving wheel train and a second cutting driving wheel train correspondingly, and the two annular diamond fretsaws control cutting tension force through tension adjusting devices correspondingly, the first cutting driving wheel train and the second cutting driving wheel train are arranged on a Z-axis lifting adjusting platform capable of being controlled through a numerical control program, and the parallel distance between the two annular diamond wires in the vertical direction can be adjusted through a distance adjusting platform arranged on the Z-axis lifting adjusting platform. According to the method and the fretsaw machine, the cutting efficiency can be greatly improved, the wire diameter of the annular diamond fretsaw is small, the workpiece cutting loss is small, and the risk that a workpiece is collided to be damaged during cutting machining is greatly reduced through a horizontal cutting method, which is particularly suitable for cutting precious crisp and hard materials.

The invention discloses a laser cutting method for glass. The laser cutting method comprises the following steps: finding out a to-be-cut position of a glass plate; coating the to-be-cut part of the glass plate with a layer of non-volatile light-shading substance; and moving a laser beam along the to-be-cut part to cut. The laser cutting method for glass disclosed by the invention adopts the shading layer to prevent the laser from penetrating through the glass and absorbing heat on the shaded part, so that the cutting efficiency is improved.

The invention discloses a production method of a continuous long-distance resin diamond wire saw, which comprises the steps of raw material selection, resin mixture preparation, core wire treatment, wire preparation, pre-curing, secondary curing and the like. The present invention effectively controls the final stage of line production by selecting thermoplastic resins and thermosetting resins with molecular weights within a suitable range; selecting suitable fillers, coupling agents, polymerization inhibitors, and dispersants; and controlling the appropriate initial viscosity of the resin mixture. The increase in the viscosity of the mixed liquid can effectively prevent the diameter of the diamond wire saw from becoming larger in the later stage of wire production, avoid the problem of local light caused by the gel particles of the mixed liquid blocking the drawing die, control the increase in the number of diamond micropowders, and ensure the quality of the product consistency. Ultimately solve the key technical problems in the continuous long-distance production of more than 70km.

The invention discloses a large-size cutting device applied to leather production. The large-size cutting device comprises a cutting device main body, a control cabinet and a motor cabinet; the control cabinet is positioned at the outer surface of one side of the cutting device main body; the motor cabinet is positioned at the outer surface of the rear end of the control cabinet and is also positioned at the outer surface of one side of the cutting device main body; the outer surface of the upper end of the control cabinet is provided with a control panel and a display screen; and the controlpanel is positioned at the outer surface of one side of the display screen. The large-size cutting device applied to leather production disclosed by the invention is provided with a laser cutting head, a radial guide rail, a meridional guide rail, a zonal guide rail and a length measurement sensor; kerfs generated in cutting are narrow; leather deformation is small; untrimmed materials and flyingdust are not generated in cutting; cutting of leather in random sizes and specifications can be realized; the length of processed leather can also be measured; the cutting length is recorded as well;the yield can be conveniently counted; and the large-size cutting device has certain practicability and brings better application prospects.

The invention discloses a high-strength saw blade production technology. The high-strength saw blade production technology sequentially comprises the steps of material selecting, primary processing, heat treatment and surface finishing. Surface finishing comprises the step of sand blasting treatment, specifically, a dry blasting technology is adopted for sand blasting treatment, after sand blasting treatment, smooth tooth tips are formed, grinding is not needed in the sawing process, and the tooth breakage probability of tooth parts is decreased; impact force of cutting and vibrating can be borne, uniform force bearing of a cutting tool is ensured, and the cutting life of the tooth parts of the cutting tool is prolonged; and after sand blasting, the fatigue life of a backing material is prolonged, the fatigue performance of the back of a saw blade in the working condition of cutting ordinary carbon steel is greatly exerted, and the service life of the saw blade is prolonged.

The invention discloses a preparation process of a laser welding saw blade, and belongs to the technical field of preparation of material cutting machining tools. The laser welding saw blade comprisesa saw blade base body and a plurality of diamond tool bits evenly distributed on the outer edge of the saw blade base body; each diamond tool bit is composed of a tool bit base body on the inner sideand a tool bit brazing layer on the outer side; a concave notch groove is formed in each of the two sides of each diamond tool bit in the radial direction of the saw blade base body so that chip removal can be facilitated during cutting machining; each diamond tool bit of the saw blade is formed by brazing and sintering a metal bonding agent and diamond particles under the vacuum condition; and then a laser welding method is adopted to weld the diamond tool bits with the saw blade base body. The laser welding saw blade prepared through the method has the advantages that the diamond particlesand the tool bit base bodies are firmly combined, the tool bits and the saw blade base body are reliably connected, the process is simple, and the cost is low.

The invention belongs to the field of tool design, and relates to a tool for three-dimensional laser trimming of an L-shaped stretch-bending part. The tool is composed of an edge cutting die body, an edge pressing device, a jacking device, a supporting device and a laser edge cutting assembly. The trimming die body is of a platform structure, and the edge of the platform structure is matched with the shape of an L-shaped stretch bending piece to be trimmed; the supporting device is used for supporting the trimming die body, and an arc-shaped supporting plate is further arranged on the side face, close to the edge of the trimming die body, of the upper end of the supporting device. The support is used for mounting the jacking device; the edge pressing device, the jacking device and the edge of the platform structure which are mounted on the edge cutting die body jointly define the overall appearance of the L-shaped stretch bending part to be subjected to edge cutting; a certain gap is reserved between the lower end face of the L-shaped stretch-bending piece to be trimmed and the arc-shaped supporting plate, and an upper end flange is pressed and fixed through the edge pressing device. During edge cutting, after the L-shaped stretch bending part to be subjected to edge cutting is positioned, edge cutting is conducted through the laser edge cutting assembly.

A full-automatic fixed-length cable taking machine system realizes a one-stop mode of cable taking and cable splitting, reduces labor intensity of operators, reduces uncertain factors in operation links, and improves operation safety. Data transmission read/write operation is carried out through the wireless touch screen and a background program of the industrial personal computer, and safety and stability are achieved; a full-disc cable is transported to the position below the paying-off gantry through the trolley, a PLC controls the gantry to ascend, descend and be clamped, a disc is loaded into the gantry, and operation is easy and convenient. Cables with different diameters are pulled and conveyed from the pay-off end to the take-up end, and the length can be accurately measured according to the perimeter of the roller and the number of rotation turns; during take-up and pay-off, the PLC outputs a control signal to the take-up and pay-off gantry after operation, and the take-up and pay-off gantry further realizes constant tension control; a cutting-off device is suitable for cutting off cables of various specifications and has the advantages of being high in cutting efficiency, capable of saving energy, narrow in saw bite and easy to operate. The fixed-length cable taking control system fully meets various requirements of customers, and the performance of electrical system elements is stable and reliable.