Liquid photosensitive solder-resist resin for LED and preparation method thereof

Abstract

The invention discloses a liquid photosensitive solder-resist resin for LED and belongs to the technical field of resin materials. The resin comprises the following raw materials in parts by weight: 30 to 40 parts of methacrylic acid monomer, 1 to 5 parts of polymerization thermal initiator, 8 to 12 parts of acrylic acid, 12 to 15 parts of acid anhydride, 35 to 45 parts of solvent, 0.15 to 0.25 part of catalyst, and 0.01 to 0.02 part of polymerization inhibitor, wherein the solvent comprises one of diethylene glycol dimethyl ether and propylene glycol monomethyl ether; the catalyst is triphenyl phosphine, and the polymerization inhibitor is p-hydroxyanisole. The invention also provides a preparation method of the liquid photosensitive solder-resist resin for LED. The provided liquid photosensitive solder-resist resin has the advantages of simple technology, reasonable formula, and excellent yellowing resistant property and photosensitive performance, the service time of resin is prolonged, the using effect of resin is enhanced, and the resin can meet the production requirements.

Description

technical field [0001] The invention belongs to the technical field of resin materials, and in particular relates to a liquid photosensitive solder resist resin for LEDs and a preparation method thereof. Background technique [0002] With the continuous advancement and development of the modern electronics industry, my country's printed board solder resist resin began in the late 1970s. At that time, it was mainly heat-cured solder resist resin, which began to be transferred from imports to domestic production. Type character resin, due to the influence of precision, it finally develops into liquid photosensitive solder resist resin, which has both light curing and thermal curing resins. It is prepared by reacting with acid anhydride. The resin has excellent heat resistance after curing, but because of the large shrinkage after curing, the solder mask is easy to become brittle, and the scrap rate is high in the production process. In order to change the brittleness of photose...

AI Technical Summary

Problems solved by technology

[0002] With the continuous advancement and development of the modern electronics industry, my country's printed board solder resist resin began in the late 1970s. At that time, it was mainly heat-cured solder resist resin, which began to be transferred from imports to domestic production. Type character resin, due to the influence of precision, it finally develops into liquid photosensitive solder resist resin, which has both light curing and thermal curing resins. It is prepared by reacting with an acid anhydride. The resin has excellent heat resistance after curing, but because of the large shrinkage after curing, the solder mask is easy to become brittle, and the scrap rate is high in the production process.

In order to change the brittleness of photosensitive resins using novolac epoxy resins, bisphenol A epoxy resins, bisphenol F epoxy resins or methylol bisphenol A epoxy resins are used to completely replace novolac epoxy resins Or partially replaced products to synthesize photosensitive resin, which has indeed been greatly improved in terms of shrinkage after curing, but the heat resistance of bisphenol A or bisphenol F and its modified bisphenol A or bisphenol F epoxy resin It is difficult to meet the needs of users, and the novolac epoxy resin is also difficult to carry out when soldering pure tin or tin, which leads to an increase in scrap rate, and prevents wires or conductors from being soldered, anti-corrosion, moisture-proof and mildew-proof, etc. The function is to protect the surface of printed circuit boards from scratches and damage, especially for high-performance printed circuit boards with high density, fine wires and micro-hole structures. Only high-performance solder resist resins can meet the needs of use. Therefore, the quality of its products It is not only related to the external resistance of the finished printed circuit board, but also directly affects the usability, reliability and durability of the printed circuit board product. The existing photosensitive solder resist resin has poor yellowing resistance, which makes the product very easy Aging affects the use time of the product, and the photosensitiveness of the existing photosensitive solder resist resin is poor, which reduces the use efficiency and quality, and it is difficult to meet the needs of production and use