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Liquid photo-imageable electrostatic-spraying solder mask and preparation and spraying methods thereof

An electrostatic spraying and solder resist technology, applied in the field of liquid photosensitive solder resist materials for PCB boards, can solve problems such as instability, inconsistency of screen printing production conditions, and environmental pollution, and achieve high insulation, excellent resolution, and wide The effect of operating range

Inactive Publication Date: 2015-12-09
江门市阪桥电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the continuous update of PCB manufacturing process at home and abroad, the traditional screen printing solder resist ink is printed on the PCB by screen printing, the production conditions of screen printing cannot be consistent, and the printing quality mainly depends on the experience and skill proficiency of workers, so it is relatively unstable. factor
The traditional screen printing method has brought serious environmental pollution problems

Method used

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  • Liquid photo-imageable electrostatic-spraying solder mask and preparation and spraying methods thereof
  • Liquid photo-imageable electrostatic-spraying solder mask and preparation and spraying methods thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Photosensitive resin preparation method is:

[0031] (1) Add 210 parts of o-cresol novolac epoxy resin into the reaction kettle, add 100 parts of dibasic ester solvent, and heat to dissolve at a temperature of 83-86°C;

[0032] (2) Add 0.1 part of p-hydroxyanisole, 1.5 parts of triphenylphosphine, slowly drop into 72 parts of refined acrylic acid, heat the mixture to 95-105°C, fully react for 8 hours, and cool the reactant to 90°C;

[0033] (3) Add 101 parts of tetrahydrophthalic anhydride, 110 parts of tetramethylbenzene, and 48 parts of dibasic acid ester, keep the temperature condition of 90-95°C for 4 hours, and obtain a polymer with a solid content of 60%, and the acid value formed by the solid content The temperature is 74mgKOH / g, the temperature of the reactant is lowered to 50°C, and the material is discharged to obtain the photosensitive resin.

Embodiment 2

[0035] The preparation process of the main ingredient: 420g of the photosensitive resin prepared in Example 1, 6g of phthalocyanine green, 16g of melamine (99.9% in content), 9g of photoinitiator (ITX3g, TPO3g, EDB3g), 35g of photosensitizer, silane coupling agent Mix 2g, curing accelerator 0.08g, surface treatment agent 18g, defoamer 6g, talcum powder 20g, barium sulfate 190g, divalent ester solvent 14g, tetramethylbenzene 14g, use a high-speed disperser at a speed of 500RPM, and stir for 40 minutes , and then use a three-roll mill to grind to a fineness of less than 15 μm, then filter to remove mechanical impurities, and finally adjust the viscosity to 180dpa.s, that is, the main agent. The photosensitizer is Irgacure907, the silane coupling agent is A-172, the curing accelerator is 2MA-OK, the defoamer is Shin-Etsu 750-S, and the surface treatment agent is mixed and dispersed with 12 parts of organosilicon bentonite and 6 parts of tetramethylbenzene Obtained after ripening....

Embodiment 3

[0037] The preparation process of the main agent: 450g of the photosensitive resin prepared in Example 1, 6g of phthalocyanine green, 16g of melamine, 9g of photoinitiator (ITX3g, TPO3g, EDB3g), 35g of photosensitizer, 2g of silane coupling agent, 0.08 of curing accelerator g. Mix 18g surface treatment agent, 6g defoamer, 20g talcum powder, 160g barium sulfate, 14g dibasic ester solvent, and 14g tetramethylbenzene, use a high-speed disperser at a speed of 500RPM, stir for 40 minutes, and then grind with three rollers Grind with a machine until the fineness is less than 15μm, then filter to remove mechanical impurities, and finally adjust the viscosity to 180dpa.s, which is the main agent. The photosensitizer is Irgacure907, the silane coupling agent is A-172, the curing accelerator is 2MA-OK, and the defoamer is Shin-Etsu KS-66.

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Abstract

The invention discloses a liquid photo-imageable electrostatic-spraying solder mask for a PCB. The liquid photo-imageable electrostatic-spraying solder mask consists of a main agent and a curing agent at the mass ratio of 3: 1, wherein the main agent consists of photosensitive resin, NA, melamine, a photoinitiator, a photosensitizer, an additive, talcum powder, barium sulfate, a dibasic ester solvent and tetramethylbenzene; the curing agent consists of novolac epoxy resin, light curing monomers, 1,3,5-triglycidyl isocyanurate, barium sulfate, dipropylene glycol monomethyl ether and a dibasic ester solvent. The liquid photo-imageable electrostatic-spraying solder mask is suitable for an automatic electrostatic spraying drying line, and has favorable resolution, excellent adhesion and extremely good solder coating resistance and chemical resistance, a liquid photo-imageable electrostatic-spraying solder mask film subjected to high-temperature hardening has high insulativity, high water resistance and gold and tin immersion resistance, and the liquid photo-imageable electrostatic-spraying solder mask is suitable for the conventional PCB solder mask operation procedure.

Description

technical field [0001] The invention relates to the technical field of circuit board inks, in particular to a liquid photosensitive solder resist material for PCB boards, a preparation method and a spraying method. Background technique [0002] Solder resist materials originated in the 1960s, while my country started in the 1970s. With the continuous update of PCB manufacturing process at home and abroad, the traditional screen printing solder resist ink is printed on the PCB by screen printing, the production conditions of screen printing cannot be consistent, and the printing quality mainly depends on the experience and skill proficiency of workers, so it is relatively unstable. factor. Cutting the traditional screen printing method has brought serious environmental pollution problems. With the implementation of energy saving and consumption reduction, some equipment manufacturers have taken the lead in updating the production process technology for solder resist green p...

Claims

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Application Information

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IPC IPC(8): C09D11/101C09D11/03G03F7/004G03F7/027C08G59/17B05D1/06B05D3/06B05D3/10
Inventor 周中涛
Owner 江门市阪桥电子材料有限公司
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