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Curing agent for epoxy resin and epoxy adhesive used at ultralow temperature

A technology of epoxy adhesive and epoxy resin, which is applied in the direction of epoxy resin glue, adhesive additive, non-polymer adhesive additive, etc., which can solve the problem of bad smell, strong skin irritation, and blooming of cured products etc., to achieve the effects of reducing the curing temperature range, simple preparation process, and simple mixing process

Active Publication Date: 2015-12-30
HUBEI GREENHOME MATERIALS TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are many kinds of epoxy resin curing agents. At present, aliphatic polyamine curing agents are commonly used as low-temperature curing agents, which are highly toxic and irritating to human skin. When this type of curing agent reacts with epoxy resin, the system will generate a large amount of heat. , the pot life is short and the cured product is poor in flexibility. When stored in the air, the cured product will also appear to bloom or fog. This is due to the reaction of the primary amino group with the carbon dioxide / water vapor stored in the air. caused by salt
At present, polythiols and adducts of polyamines and thiourea are mostly used as ultra-low temperature curing agents. Polymercaptans and tertiary amines can be combined to obtain ultra-low temperature curing agents that can be cured at -20°C to 0°C. Mercaptan is viscous, has a very high viscosity, has an unpleasant smell, and is highly toxic, so polythiol series are not used

Method used

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  • Curing agent for epoxy resin and epoxy adhesive used at ultralow temperature
  • Curing agent for epoxy resin and epoxy adhesive used at ultralow temperature
  • Curing agent for epoxy resin and epoxy adhesive used at ultralow temperature

Examples

Experimental program
Comparison scheme
Effect test

Embodiment （1）

[0034] Weigh 95g bisphenol A type epoxy resin E-51 (epoxy value 0.48-0.54), 5g benzyl glycidyl ether, 120g silica powder, as component A;

[0035] Weigh 15g of ultra-low temperature curing agent, 35g of polyamide, 2g of 2,4,6-tris(dimethylaminomethyl)phenol, 2g of γ-aminopropyltriethoxysilane, 8g of epoxy group and terminal carboxyl group And BE of unsaturated double bond, 158g silica powder, as component B.

[0036] Put the two components A and B respectively at 0~-5°C for 2 hours, then mix A and B evenly at a ratio of 1:1 by weight, and use No. 45 steel sheet as the adhered material, according to GB7124- 86 standard to prepare steel sheet shear samples, prepare tensile strength samples according to GB / T699-1999 standard, prepare hardness test samples according to GB531-83 standard, put the samples in a refrigerator at -15 ° C, and record at the same time Gel time and initial solid time, test the mechanical properties after 10 days, the test results are listed in Table 1.

Embodiment （2）

[0038] Weigh 95g bisphenol A type epoxy resin E-51 (epoxy value 0.48-0.54), 5g benzyl glycidyl ether, 120g silica powder, as component A;

[0039] Weigh 25g of ultra-low temperature curing agent, 25g of polyamide, 2g of 2,4,6-tris(dimethylaminomethyl)phenol, 2g of γ-aminopropyl triethoxysilane, 8g of epoxy group and carboxyl terminal group And BE of unsaturated double bond, 158g silica powder, as component B.

[0040]Put the two components A and B respectively at 0~-5°C for 2 hours, then mix A and B evenly at a ratio of 1:1 by weight, and use No. 45 steel sheet as the adhered material, according to GB7124- 86 standard to prepare steel sheet shear samples, prepare tensile strength samples according to GB / T699-1999 standard, prepare hardness test samples according to GB531-83 standard, put the samples in a refrigerator at -15 ° C, and record at the same time Gel time and initial solid time, test the mechanical properties after 10 days, the test results are listed in Table 1.

Embodiment （3）

[0042] Weigh 95g bisphenol A type epoxy resin E-51 (epoxy value 0.48-0.54), 5g benzyl glycidyl ether, 120g silica powder, as component A;

[0043] Weigh 35g of ultra-low temperature curing agent, 15g of polyamide, 2g of 2,4,6-tris(dimethylaminomethyl)phenol, 2g of γ-aminopropyltriethoxysilane, 8g of epoxy group and terminal carboxyl group And BE of unsaturated double bond, 158g silica powder, as component B.

[0044] Put the two components A and B respectively at 0~-5°C for 2 hours, then mix A and B evenly at a ratio of 1:1 by weight, and use No. 45 steel sheet as the adhered material, according to GB7124- 86 standard to prepare steel sheet shear samples, prepare tensile strength samples according to GB / T699-1999 standard, prepare hardness test samples according to GB531-83 standard, put the samples in a refrigerator at -15 ° C, and record at the same time Gel time and initial solid time, test the mechanical properties after 10 days, the test results are listed in Table 1.

...

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Abstract

The invention relates to a curing agent for epoxy resin and an epoxy adhesive used at ultralow temperature and prepared from the curing agent. The curing agent is an oligomer prepared by decyclization and deamination of a molecular structure as shown in the description and condensation of FZ-201 compound alicyclic amine and thiourea under the action of diethylene glycol, wherein FZ-201 compound alicyclic amine is dimethylcyolohexlemine, dimethylcyclopentylamine and N-aminoethylpiperazine; the weight part ratio of FZ-201 compound alicyclic amine to thiourea to diethylene glycol is 100:25:20; the epoxy adhesive used at ultralow temperature comprises epoxy resin and the curing agent which are in the weight part ratio of 95:(15-35); and the epoxy resin is bisphenol A glycidyl ether epoxy resin E-51 with bifunctionality. The open-loop alicyclic amine with a molecular structure as shown in the description is used as the curing agent, the molecular structure not only contains amino groups, but also contains the molecular structure as shown in the description, and the crosslinking density of the epoxy adhesive is lower than that of an epoxy resin adhesive of an alicyclic fatty amine curing agent only containing amino groups, so that the defect of high brittleness of a cured product is overcome, and the epoxy adhesive is high in toughness, suitable for use in an ultralow-temperature environment, simple in preparation process as well as cheap and available in raw materials.

Description

technical field [0001] The invention relates to a curing agent and an epoxy resin adhesive, in particular to a curing agent for epoxy resin and an epoxy adhesive for ultra-low temperature prepared with the curing agent. Background technique [0002] As the matrix resin of high-performance composite materials, epoxy resin is widely used in machinery, electronics, aviation, etc. It is widely used in aerospace, shipbuilding industry and construction industry. [0003] In the application process of epoxy resin, curing agent occupies a very important position. There are many kinds of epoxy resin curing agents. At present, aliphatic polyamine curing agents are commonly used as low-temperature curing agents, which are highly toxic and irritating to human skin. When this type of curing agent reacts with epoxy resin, the system will generate a large amount of heat. , the pot life is short and the cured product is poor in flexibility. When stored in the air, the cured product will a...

Claims

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Application Information

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IPC IPC(8): C08G59/66C08G59/46C09J163/00C09J11/04C09J11/06
Inventor 李福志胡登华
Owner HUBEI GREENHOME MATERIALS TECH INC
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