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Scaling powder used for high-precision nanometer soldering paste

A nano-welding and flux technology, applied in welding media, welding equipment, welding/cutting media/materials, etc., can solve the problems of not meeting the requirements, not fully adapting to new needs, etc., to improve printing life, improve welding Efficiency, friction reduction effect

Active Publication Date: 2016-02-24
江苏广昇新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The printing of ultra-fine pads has very strict requirements on the release performance of solder paste. The traditional method of relying on thixotropic agents to improve solder paste printing and release can no longer fully meet the new needs.
In the prior art, the rheological and anti-settling effects of polyamide resin are used to make the solder paste have excellent thixotropic properties, which can meet the printing performance of solder paste. However, with the decreasing size of pads and spacing, the market uses The diameter of the polyamide resin particles is generally 20 μm, and the polyamide resin is stirred at the active temperature below the melting point to produce a reticular thixotropic structure. As far as the ointment is concerned, it has completely failed to meet the requirements

Method used

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  • Scaling powder used for high-precision nanometer soldering paste
  • Scaling powder used for high-precision nanometer soldering paste
  • Scaling powder used for high-precision nanometer soldering paste

Examples

Experimental program
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Effect test

Embodiment 1

[0035] 1. Take 4g of polyamide resin, 10g of ethanol, and 0.14g of hydroxyethyl cellulose into the autoclave, heat to 150~170°C while stirring continuously until the polyamide resin is completely dissolved; Cool down to 70°C at a min speed, stop stirring and cool down to room temperature, take out the materials in the autoclave, separate the powder and solvent, and obtain 4g of pure polyamide resin nanoparticles after drying;

[0036] 2. Add 28.5g of diethylene glycol monooctyl ether, 35g of perhydrorosin, and 15g of disproportionated rosin into the reaction vessel, heat to 115°C and stir until the rosin is completely dissolved in diethylene glycol monooctyl ether; cool down to 75°C , add 3g of 16 acid, 2.5g of 24 acid, 2g of triethanolamine, 3.5g of benzotriazole, stir well until mixed evenly; cool to 20°C, add 5.5g of polyoxyethylene glyceryl ether, 4g of polyamide resin nanopowder, Stir and evacuate until it is uniformly mixed, and grind the solid particles in the uniformly...

Embodiment 2

[0038] 1. Take 5g of polyamide resin, 11.7g of ethanol, and 0.17g of hydroxyethyl cellulose into the autoclave, heat to 150~170°C while stirring continuously until the polyamide resin is completely dissolved; continue to stir and heat at 2°C Cool down to 70°C at a speed of / min, stop stirring and cool down to room temperature, take out the materials in the autoclave, separate the powder and solvent, and obtain 5g of pure polyamide resin nanoparticles after drying;

[0039] 2. Add 30g of triethylene glycol monobutyl ether, 34g of perhydrorosin, and 13g of maleic rosin into the reaction vessel, heat to 117°C and stir until the rosin is completely dissolved in the solvent; cool down to 77°C, and add salicylic acid 4g, 24 acid 3g, triethanolamine 2g, benzotriazole 2.5g, stir well until mixed; cool to 22°C, add polyoxyethylene glyceryl ether 6.5g, hydrogenated castor oil 5g, stir and vacuum until mixed Uniformly, use a three-roll mill to grind the solid particles in the uniformly m...

Embodiment 3

[0041] 1. Take 5g of polyamide resin, 11.7g of ethanol, and 0.17g of hydroxyethyl cellulose into the autoclave, heat to 150~170°C while stirring continuously until the polyamide resin is completely dissolved; continue to stir and heat at 2°C Cool down to 70°C at a speed of / min, stop stirring and cool down to room temperature, take out the materials in the autoclave, separate the powder and solvent, and obtain 5g of pure polyamide resin nanoparticles after drying;

[0042]2. Add 28g of triethylene glycol monobutyl ether, 30g of perhydrorosin, 13g of disproportionated rosin, and 5g of maleic rosin into the reaction vessel, heat to 119°C and stir until the rosin is completely dissolved in the solvent; cool down to 79°C, add 7g of 24 acid, 2g of diethanolamine, 3.5g of benzotriazole, fully stirred until mixed evenly; cooled to 22°C, added 6.5g of polyoxyethylene glyceryl ether, 5g of polyamide resin, stirred and vacuumed until mixed evenly, Grinding the solid particles in the hom...

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Abstract

The invention discloses scaling powder used for high-precision nanometer soldering paste. The raw materials of the scaling powder comprise, by mass, 20%-30% of solvent, 30%-50% of rosin, 3%-8% of surfactant, 2%-5% of thixotropic agents, 5%-10% of organic acid, 2%-5% of organic amine and 2%-5% of inhibiter. Compared with the prior art, the scaling powder used for the high-precision nanometer soldering tin paste has the advantages that 1, each grain of tin powder is wrapped in the scaling powder and makes entire contact with the scaling powder, the tin powder cannot adhere to a net or a scraper in the printing process, and the defects of skipping printing and lessening soldering paste are decreased; 2, the friction among the tin powder is reduced through nanometer particles on the surface of the tin powder, and the printing service life of the soldering paste is prolonged; 3, the thixotropic agents forme a fine anti-setting net-shaped structure, and big crystals cannot be separated out to cause the phenomenon of false thickening; and 4, each grain of the tin powder in the soldering paste keeps in good contact with the scaling powder by adding polyamide resin nanometer powder, and the soldering efficiency of the scaling powder is improved.

Description

technical field [0001] The invention relates to the technical field of welding materials, in particular to a flux for high-precision nano solder paste. Background technique [0002] With the miniaturization of electronic information products, the assembly density of components on the PCB is getting higher and higher, and the pad spacing is getting smaller and smaller, which makes the quality requirements of solder paste in various countries more and more stringent. Ultra-fine pitch pad spacing And in the replacement of semiconductor crystal-bonding conductive silver glue, high-precision solder paste is getting more and more attention. [0003] The range of tin powder particle size is selected according to the size of the pad. As the distance between the pad sizes becomes smaller and smaller, the problem cannot be completely solved by only reducing the particle size of the tin powder. The smaller the particle size of the tin powder, the larger the surface area and the greate...

Claims

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Application Information

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IPC IPC(8): B23K35/363B23K35/40
CPCB23K35/3612B23K35/40
Inventor 戴爱斌徐成群邓勇
Owner 江苏广昇新材料有限公司
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