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A kind of polyimide film and preparation method thereof

A polyimide film and release technology, which is applied in the field of polymer materials, can solve the problems of not being able to have transparency, adhesion, mechanical properties and thermal properties at the same time, and achieve excellent colorless transparency and good processing performance , the effect of good application prospects

Active Publication Date: 2018-01-05
NANJING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] For the introduction of fluorine-containing or silicon-containing groups in the prior art, although the transparency or adhesion performance of polyimide films can be improved, it cannot have excellent transparency and stronger adhesion at the same time, and the mechanical properties and thermal properties Performance is affected to a certain extent, the invention provides a polyimide film that is colorless and transparent, has high adhesion and maintains good thermal properties, mechanical properties, hydrophobic properties and solubility, and a preparation method thereof

Method used

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  • A kind of polyimide film and preparation method thereof
  • A kind of polyimide film and preparation method thereof
  • A kind of polyimide film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040](1) Add 9.2874g of 4,4'-diamino-2,2'-bistrifluoromethylbiphenyl and 70mL of N,N-dimethyl Acetamide (DMAC), stirred at 20-25°C for half an hour until completely dissolved, added 0.4216mL of 1,3-bis(3-aminopropyl)-1,1,3,3-tetramethyldisiloxane, Continue to stir for half an hour until the two diamines are evenly dispersed. The temperature of the system was lowered to 15°C, 4.6110g of 4,4-hexafluoroisopropylphthalic anhydride and 10mL of DMAC were added, and the reaction was continued for 1h. The temperature of the system was lowered to 8°C, and 4.6110g of 4,4-hexafluoroisopropylphthalic anhydride and 10mL of DMAC were added continuously, and the reaction was continued for 1h. Maintain the temperature of the system at 8°C, add the remaining 4.6110g of 4,4-hexafluoroisopropylphthalic anhydride and 10mL of DMAC, and continue the reaction for 15h to obtain a homogeneous, transparent, and viscous polyamic acid solution, as shown in The apparent viscosity is 1526.3cp.

[0041]...

Embodiment 2

[0043] (1) Add 4.4199g of 4,4'-diamino-2,2'-bistrifluoromethylbiphenyl and 35mL of DMAC to a four-necked flask with nitrogen gas, a thermometer and a stirrer. Stir for half an hour until completely dissolved, add 0.4234mL of 1,3-bis(3-aminopropyl)-1,1,3,3-tetramethyldisiloxane, continue stirring for half an hour until the two diamines are evenly dispersed . The temperature of the system was lowered to 15°C, 2.3163g of 4,4-hexafluoroisopropylphthalic anhydride and 5mL of DMAC were added, and the reaction was continued for 1h. The temperature of the system was lowered to 8°C, and 2.3163g of 4,4-hexafluoroisopropylphthalic anhydride and 5mL of DMAC were added continuously, and the reaction was continued for 1h. Maintain the system temperature at 8°C, add the remaining 2.3163g of 4,4-hexafluoroisopropylphthalic anhydride and 5mL of DMAC, and continue the reaction for 20h to obtain a homogeneous, transparent, and viscous polyamic acid solution. The viscosity is 1419.0.3cp.

[00...

Embodiment 3

[0046] Add 7.9318g of 4,4'-diamino-2,2'-bistrifluoromethylbiphenyl and 70mL of DMAC to a four-necked flask with nitrogen gas, a thermometer and a stirrer, and stir at 20-25°C for half After 1 hour until completely dissolved, add 1.7098mL of 1,3-bis(3-aminopropyl)-1,1,3,3-tetramethyldisiloxane, and continue to stir for half an hour until the two diamines are evenly dispersed. Lower the temperature of the system to 15°C, add 7.0147g of 4,4-hexafluoroisopropylphthalic anhydride and 5mL of DMAC, and continue the reaction for 1h; lower the temperature of the system to 8°C, and continue to add 3.5074g of 4,4-hexafluoroisopropyl 1.7537g of 4,4-hexafluoroisopropylphthalic anhydride and 5mL of DMAC were added to maintain the system temperature at 8°C; and 0.8768g4 was added to maintain the reaction temperature at 8°C. 4-Hexafluoroisopropylphthalic anhydride and 5mL DMAC, continue to react for 1h; maintain the reaction temperature at 8°C, add the remaining 0.8768g of 4,4-hexafluoroisopr...

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Abstract

The invention discloses a polyimide film. The polyimide film is prepared by the steps of copolymerizing fluorine-containing dianhydride, fluorine-containing diamine and silicon-containing diamine in the presence of an aprotic solvent to generate polyamide acid, and carrying out thermal imidization to obtain the polyimide film. The prepared polyimide film has excellent colourless transparency and high adhesion to various materials. The ultraviolet light cutoff wavelength of the polyimide film is 330nm-345nm, and the maximal transmittance of the polyimide film at 400nm reaches up to 96%; the adhesive force levels of the polyimide film with the surfaces of substrates including aluminum plates, copper foil, glass, ceramic and the like can all reach level 1 or above, the polyimide film does not fall at all after being boiled in water of 80 DEG C for 500 hours, and the lap shear strength exceeds 1.5MPa; meanwhile, the polyimide film preserves high heat resistance and mechanical strength, the tensile strength is 45MPa-83MPa, and the initial decomposition temperature is 483-532 DEG C; furthermore, the polyimide film can be dissolved in partial organic solvents, is good in machinability and has good application prospects in the photoelectric fields of flexible solar cell substrates, liquid crystal display oriented films, communication-linked optical waveguide materials, and the like.

Description

technical field [0001] The invention relates to a polyimide film, in particular to a colorless, transparent and high-adhesion polyimide film synthesized by a copolymerization reaction of a fluorine-containing monomer and a silicon-containing monomer and a preparation method thereof, belonging to polymer materials technology field. Background technique [0002] Polyimide (PI) is widely used in aerospace, microelectronics industry and other fields due to its outstanding heat resistance, mechanical properties, dielectric properties and other comprehensive properties. In the application of polyimide in optoelectronic materials, such as flexible solar cell bottom plate, liquid crystal display alignment film, optical waveguide material for communication connection, etc., high requirements are put forward for its transparency and heat resistance. Traditional polyimide films, such as the Kapton film produced by DuPont in the United States, due to the strong charge transfer complexa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10C08J5/18
CPCC08G73/1042C08G73/106C08G73/1075C08J5/18C08J2379/08
Inventor 徐勇李林霜杨宇张茜茜苏旭宋超然
Owner NANJING UNIV OF SCI & TECH
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