A kind of insulation-coated anti-corrosion alloy bonding wire and preparation method thereof

An alloy bonding and insulating coating technology, which is applied to insulated conductors, insulated cables, metal/alloy conductors, etc., can solve the problems of low production efficiency and uneven film coating, and achieve high production efficiency, low cost, and increased production. Effect of Bonding Density

Active Publication Date: 2018-10-23
YANTAI YINUO SEMICON MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In addition, there is currently no bonding wire coating and curing special device suitable for industrial use. The use of ordinary dipping and curing equipment to coat polymer films on the surface of bonding wires has problems such as low production efficiency and uneven film formation. technical problem

Method used

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  • A kind of insulation-coated anti-corrosion alloy bonding wire and preparation method thereof
  • A kind of insulation-coated anti-corrosion alloy bonding wire and preparation method thereof
  • A kind of insulation-coated anti-corrosion alloy bonding wire and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0034] Example 1: An insulating coated corrosion-resistant silver alloy bonding wire with a diameter of 25 μm (1.0 mil, not including the thickness of the insulating coating), the weight percentage of each component of the material constituting the bonding wire is:

[0035] The amount of Au (gold) is 9%, the amount of Pd (palladium) is 3%, the amount of Ce (cerium) is 5ppm, and the balance is Ag as the alloy substrate; the material of the outer insulating film is thermoplastic biphenyl polyimide resin.

[0036] Its preparation method comprises the following steps:

[0037] The first step is to select the alloy substrate: select silver metal raw materials with a high purity of more than 99.999%;

[0038] The second step, melting and casting: according to the percentage of alloy composition, use N at 1600°C 2 Blowing and stirring protection for pre-alloying and master alloying, continuous drawing casting process at 1250°C, melting and casting into silver alloy metal rods with ...

Embodiment 2

[0044] Example 2: A bonding wire with a diameter of 30 μm (1.2 mil, not including the thickness of the insulating coating) with an insulating coating and an anti-corrosion copper alloy. The weight percentages of the components of the bonding wire are:

[0045] The amount of Ag (silver) is 0.5%, and the balance is Cu (copper) as the alloy substrate; the material of the outer insulating film is thermoplastic polyphenylene polyimide resin.

[0046] Its preparation method comprises the following steps:

[0047] The first step is to select the alloy base material: select copper metal raw materials with a high purity of more than 99.999%;

[0048] The second step, melting and casting: according to the percentage of alloy composition, use N at 1300°C 2 Blowing and stirring protection for pre-alloying and master alloying, continuous drawing casting process at 1250°C, melting and casting into copper alloy metal rods with a diameter of 8±0.3mm;

[0049] The third step, wire drawing: t...

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Abstract

The invention discloses an insulating coated anti-corrosion alloy bonding wire and a preparation method thereof, which is composed of an inner alloy bonding wire and an outer insulating and anti-corrosion polymer coating layer; Materials include gold, silver, copper and aluminum, and other metals used in alloys include gold, silver, copper, aluminum, platinum, palladium, ruthenium, rhodium, osmium, iridium and all rare earth elements; the insulating coating anti-corrosion material is thermoplastic polymer imide resin. The coating material is used to isolate the contact between the metal and the external environment, which improves the reliability of the bonding; at the same time, the alloy doping method is used to reduce the diffusion speed of the atoms between the bonding wire and the substrate after welding, and improve the bonding performance of the two metals. The problem of brittle failure caused by inter-compound (IMC) further improves the reliability of the bonding wire.

Description

technical field [0001] The invention relates to an alloy bonding wire mainly used in a microelectronic packaging process, in particular to an insulating-coated anti-corrosion alloy bonding wire. The invention also relates to a preparation method of the insulating-coated anti-corrosion alloy bonding wire. Background technique [0002] With the rapid development of modern industrial technology, electronic products are becoming more and more portable, miniaturized, networked and multimedia-oriented. The packaging process has higher and higher requirements for bonding wire products. It is developing in the direction of multi-pin, small pitch and multi-row multi-layer stacking. Wire bonding is facing more and more challenges. In order to achieve higher packaging density in a smaller package volume and achieve multifunctional aggregation, it is necessary to reduce the lead pitch, increase the number of leads, and reduce the height of the wire arc. At the same time, in some preci...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/49H01B1/02H01B7/28
CPCH01B1/02H01B1/026H01B7/2806H01L24/42H01L24/43H01L24/45H01L2224/45691H01L2224/45565H01L24/745H01L2224/45124H01L2224/45139H01L2224/45144H01L2224/45147H01L2224/4569H01L2224/43H01L2224/45H01L2924/00011H01L2224/45015H01L2224/43848H01L2924/00012H01L2924/01005H01L2924/00014H01L2924/20752H01L2924/01049
Inventor 林良
Owner YANTAI YINUO SEMICON MATERIAL CO LTD
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