Efficient and environment-friendly film-stripping solution capable of keeping copper surface bright and concentrated solution of film-stripping solution

A technology of concentrated liquid and copper surface, which is applied in the field of film stripping liquid and its concentrate, can solve the problems of difficult to achieve high film stripping at the same time, reduce the reoxygenation capacity of natural water bodies, and destroy water ecosystems, so as to improve the quality of film stripping, Improve the fading rate and reduce the production cost

Inactive Publication Date: 2016-05-11
叶旖婷
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, not only the production cost of the organic defilming solution is relatively high, but also the organic components in the defilming waste liquid are likely to cause the chemical oxygen demand (COD) of the defilming waste liquid to be too high even after sewage treatment; if it is directly discharged into natural water bodies In the middle, it will greatly reduce the reoxygenation

Method used

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  • Efficient and environment-friendly film-stripping solution capable of keeping copper surface bright and concentrated solution of film-stripping solution
  • Efficient and environment-friendly film-stripping solution capable of keeping copper surface bright and concentrated solution of film-stripping solution
  • Efficient and environment-friendly film-stripping solution capable of keeping copper surface bright and concentrated solution of film-stripping solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0080] Step 1: Under normal temperature and normal pressure, dissolve the raw materials in water to prepare the stripping solution according to the composition and proportion of the stripping solution specified in Table 1;

[0081] Step 2: Pour the stripping solution obtained in step 1 into the stripping solution cylinder on the printed circuit board stripping machine; set the temperature of the stripping cylinder to the value specified in Table 1, and set the pressure of the stripping solution nozzle to Set to 1.5kg / cm 2 , start the stripping operation.

[0082] According to the method described above, measure the time when the resist layer is completely peeled off when using the film stripping solution to strip the film, observe the state of the copper surface after stripping the film completely, measure twice the COD of the film stripping waste liquid, and corresponding The results are recorded in Table 3.

Embodiment 2～20

[0084] Following the specified stripping solution components and proportions in Table 1, repeat the method of Example 1 to prepare the stripping solution. After the preparation is completed, according to the method described above, measure the time when the resist layer is completely peeled off when using the stripping solution to strip the film, observe the state of the copper surface after stripping the film completely, and measure the COD of the stripping waste liquid twice , and record the corresponding results in Table 3.

Embodiment 21

[0086] Step 1: Under normal temperature and pressure, dissolve the raw materials in water to prepare the film-removing concentrate according to the composition and proportion of the film-removing concentrated solution specified in Table 2;

[0087] Step 2: Dissolve the stripping concentrate in water to prepare the stripping solution at normal temperature and pressure, according to the dilution ratio of the stripping concentrate specified in Table 2;

[0088] Step 3: Pour the stripping solution obtained in step 2 into the stripping solution cylinder on the printed circuit board stripping machine, set the temperature of the stripping cylinder to the value specified in Table 2, and set the pressure of the stripping solution nozzle to Set at 1.5kg / cm 2 .

[0089] According to the method described above, measure the time when the resist layer is completely peeled off when using the film stripping solution to strip the film, observe the state of the copper surface after stripping t...

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PUM

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Abstract

The invention discloses an efficient and environment-friendly film-stripping solution capable of keeping a copper surface bright. The film-stripping solution comprises sodium hydroxide and/or potassium hydroxide; the film-stripping solution is characterized by comprising the following components in percentage by weight: 1-25% of sodium hydroxide and/or potassium hydroxide, 0.01-12% of a component which is selected from one or more of hydrazine hydrate, hydroxylamine hydrochloride, hydroxylamine sulphate, sodium sulfite, sodium thiosulfate or potassium iodide, and the balance of water; and the film-stripping solution also can be prepared into a film-stripping condensated solution, including the following components in percentage by weight: 25-40% of sodium hydroxide and/or potassium hydroxide, 0.02-20% of a component which is selected from one or more of hydrazine hydrate, hydroxylamine hydrochloride, hydroxylamine sulphate, sodium sulfite, sodium thiosulfate or potassium iodide, and the balance of water. The film-stripping solution is high in film-stripping speed and capable of preventing from blackening the copper surface in the film-stripping process, without etching the copper surface; and in addition, the film-stripping solution can reach the standard for emission without causing pollution to the natural water body.

Description

technical field [0001] The invention relates to a stripping solution, in particular to a stripping solution and a concentrated solution thereof which are highly efficient, can keep the copper surface bright and are environmentally friendly. Background technique [0002] Photoresist is a corrosion-resistant film material commonly used in the production process of printed circuit boards, and its main components are photopolymers and adhesive polymers. In the manufacture of printed circuit boards, the photoresist is usually covered on the treated copper clad board, and then cured and developed by exposure reaction to form a certain circuit image, and etching is carried out according to the circuit image. The curing imaging process of photoresist is subdivided into positive film and negative film process according to the specific production requirements, and the film stripping process before etching and the film stripping process after etching are taken accordingly. The princip...

Claims

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Application Information

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IPC IPC(8): G03F7/42
CPCG03F7/425
Inventor 叶旖婷
Owner 叶旖婷
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