Low-silver copper-base conductive ink and preparation method thereof

A conductive ink, copper-based technology, used in inks, household appliances, applications, etc., can solve the problems of restricting the application of silver conductive ink, increasing the manufacturing cost of silver conductive ink, and non-conductive ink, achieving great application value and good conductivity. good performance and stability

Inactive Publication Date: 2016-06-22
SUZHOU JIEDERUI PRECISION MACHINERY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with the increasing market demand for conductive inks and the high price of precious metal silver, the silver content in silver conductive inks is usually higher than 50%, and in the field of electronic product applications, the silver content in conductive inks used Up to more than 80%, which increases the manufacturing cost of silver conductive ink and greatly restricts the application of silver conductive ink
[0004] Copper-based conductive ink is cost-effective, and its conductivity is equivalent to that of silver-based conductive ink. It has a good potential to replace silver-based conductive ink, but metal copper is easily oxidized and the ink is not conductive. If the problem of easy oxidation of metal copper is overcome, Prepare a copper-based conductive ink with low silver, oxidation resistance, good conductivity, heat resistance and good stability, which will produce good economic value

Method used

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  • Low-silver copper-base conductive ink and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A preparation method of the above-mentioned low-silver copper-based conductive ink, comprising the following steps:

[0024] (1) Weigh each component according to the proportion by weight: 7 parts of nano copper wire, 0.1 part of silver nitrate, 2 parts of indium powder, 3 parts of titanium dioxide powder, 2 parts of bismuth tungstate powder, 2 parts of 500 mesh tourmaline powder, acidification 1 part of carbon fiber, 10 parts of epoxy resin, 2 parts of sodium hypophosphite, 1 part of trimethylamine borane, 1.2 parts of polyoxypropylene glyceryl ether, 4 parts of diphenyl phosphite, 3.5 parts of ethylene bis stearamide, 2 parts of sodium methylene dinaphthalene sulfonate, 0.5 parts of polydimethylsiloxane, 40 parts of dipropylene glycol, 6-18 parts of isopropanol, and 32 parts of acetone; wherein, the diameter of the nano copper wire is 50-100nm, length 10-40um;

[0025] (2) Add sodium hypophosphite and trimethylamine borane into acetone and mix evenly, then add nano-c...

Embodiment 2

[0030] A preparation method of the above-mentioned low-silver copper-based conductive ink, comprising the following steps:

[0031] (1) Weigh each component according to the proportion by weight: 16 parts of nano copper wire, 0.9 part of silver nitrate, 10 parts of indium powder, 8 parts of titanium dioxide powder, 7 parts of bismuth tungstate powder, 6 parts of 500 mesh tourmaline powder, acidification 5 parts of carbon fiber, 22 parts of epoxy resin, 11 parts of sodium hypophosphite, 6 parts of trimethylamine borane, 5 parts of polyoxypropylene glyceryl ether, 10 parts of diphenyl phosphite, 9 parts of ethylene bis stearamide, 4 parts of sodium methylene dinaphthalene sulfonate, 3 parts of polydimethylsiloxane, 55 parts of dipropylene glycol, 6-18 parts of isopropanol, and 48 parts of acetone; wherein, the diameter of the nano copper wire is 50-100nm, length 10-40um;

[0032] (2) Add sodium hypophosphite and trimethylamine borane to acetone and mix evenly, then add nano-cop...

Embodiment 3

[0037] A preparation method of the above-mentioned low-silver copper-based conductive ink, comprising the following steps:

[0038] (1) Weigh each component according to the proportion by weight: 12 parts of nano copper wire, 0.5 parts of silver nitrate, 6 parts of indium powder, 5 parts of titanium dioxide powder, 4.5 parts of bismuth tungstate powder, 4 parts of 500 mesh tourmaline powder, acidification 3 parts of carbon fiber, 16 parts of epoxy resin, 6.5 parts of sodium hypophosphite, 3.5 parts of trimethylamine borane, 3.1 parts of polyoxypropylene glyceryl ether, 7 parts of diphenyl phosphite, 6.2 parts of ethylene bis stearamide, 3 parts of sodium methylene dinaphthalene sulfonate, 1.7 parts of polydimethylsiloxane, 47 parts of dipropylene glycol, 12 parts of isopropanol, and 40 parts of acetone; wherein, the diameter of the nano copper wire is 50- 100nm, length 10-40um;

[0039] (2) Add sodium hypophosphite and trimethylamine borane into acetone and mix evenly, then a...

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Abstract

The invention discloses a low-silver copper-base conductive ink and a preparation method thereof. The conductive ink is prepared from the following components in parts by weight: nano copper wires, silver nitrate, indium powder, titanium dioxide powder, bismuth tungstate powder, 500-mesh tourmaline powder acidified carbon fibers, an epoxy resin, sodium hypophosphite, trimethylamine borane, polyoxypropylene glycerol ether, diphenyl phosphite, ethylene bis stearamide, sodium methylene bis-naphthalene sulfonate, polydimethylsiloxane, dipropylene glycol, isopropanol and acetone. The conductive ink has low silver content, thereby greatly lowering the manufacturing and use cost; the conductive ink has the advantages of favorable conductivity and favorable adhesive force, and thus, can be widely used in solar electromagnetic devices, thin film switches, flexible printed circuits and other electronic devices; and therefore, the conductive ink has huge use and application values.

Description

technical field [0001] The invention belongs to the technical field of polymer conductive materials, and in particular relates to a low-silver copper-based conductive ink and a preparation method thereof. Background technique [0002] Conductive ink, a paste ink made of conductive material dispersed in a binder, commonly known as paste ink. Conductive inks are usually composed of conductive fillers, binders, solvents and additives. According to different conductive fillers, conductive ink can be divided into gold-based conductive ink, silver-based conductive ink and copper-based conductive ink. [0003] Among them, silver-based conductive inks are widely used in the fields of printed circuit boards, OLEDs, touch screens, radio frequency identification, electrode sensors, electromagnetic shielding, and organic solar cells due to their good conductivity and stable performance. However, with the increasing market demand for conductive inks and the high price of precious metal...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/52C09D11/102C09D11/03
CPCC09D11/03C09D11/102C09D11/52
Inventor 姚振红
Owner SUZHOU JIEDERUI PRECISION MACHINERY
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