Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Browning treatment liquid for printed circuit board

A technology of printed circuit and treatment liquid, which is applied in the secondary treatment of printed circuit, printed circuit, printed circuit manufacturing, etc. High, not in line with green production and other issues, to achieve the effect of qualified thermal shock resistance, good tear strength, and less volatilization

Inactive Publication Date: 2016-06-29
WUHAN CHUANGXINTE TECH CO LTD
View PDF8 Cites 21 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the working temperature of the above browning solution is high, the working time is long, and the service life is short, and the bonding force between the copper surface of the inner layer of the circuit board and the polymer material is not good, resulting in poor tear strength, poor moisture resistance, and poor acid resistance; A large amount of waste liquid is unfavorable to the environment and does not conform to the modern concept of energy saving, emission reduction and green production

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A kind of printed circuit board browning treatment liquid, the composition of this browning treatment liquid is: H 2 SO 4 70g / L, H 2 o 2 20g / L, NaCl15mg / L, CuSO 4 ·5H 2 O30mg / L, water-soluble methoxylated polyethylene glycol 3g / L, tolyltriazole (TTA) 4g / L, 3,5-dimethyl-2-mercaptobenzimidazole 2g / L, polyquaternary Ammonium salt - 390.01g / L, deionized water added to 1L.

[0028] After testing, the density of the browning solution is 1.3g / mL; the copper loading capacity can reach 55g / L, and the micro-etching rate of the copper surface is 1.2μm / min; and the copper surface can obtain a uniform and rough surface after browning treatment, and It has stable bonding force and excellent heat resistance with the prepreg. Under the condition of 288 ° C for 10 seconds per impact, there is no delamination or bursting phenomenon after 7 impacts. The peel strength between the copper surface and the prepreg after lamination is 5.5 lb / in.

Embodiment 2

[0030] A kind of printed circuit board browning treatment liquid, the composition of this browning treatment liquid is: H 2 SO 4 100g / L,H 2 o 2 60g / L, NaCl100mg / L, CuSO 4 ·5H 2O200mg / L, water-soluble methoxylated polyethylene glycol 6g / L, 2-(5-pentylamine)-benzimidazole (PAB) 12g / L, 3,5-dimethyl-2-mercaptobenzene And imidazole 3g / L, polyquaternium-390.5g / L, add deionized water to 1L.

[0031] After testing, the density of the browning solution is 1.35g / mL; the copper loading capacity can reach 62g / L, and the micro-etch rate of the copper surface is 1.3μm / min; and the copper surface can obtain a uniform and rough surface after browning treatment, and It has stable bonding force and excellent heat resistance with the prepreg. Under the condition of 288 ° C for 10 seconds per impact, there is no delamination or cracking after 6 impacts. The peel strength between the copper surface and the prepreg after lamination is 5.61b / in.

Embodiment 3

[0033] A kind of printed circuit board browning treatment liquid, the composition of this browning treatment liquid is: H 2 SO 4 80g / L, H 2 o 2 40g / L, NaCl30mg / L, CuSO 4 ·5H 2 O70mg / L, water-soluble methoxylated polyethylene glycol 4g / L, benzotriazole (BTA) 7g / L, 3,5-dimethyl-2-mercaptobenzimidazole 2g / L, polyquaternium Salt - 390.3g / L, deionized water added to 1L.

[0034] After testing, the density of the browning solution is 1.4g / mL; the copper loading can reach 60g / L, and the micro-etching rate of the copper surface is 1.3μm / min; and the copper surface can be uniformly rough after browning treatment, and It has stable bonding force and excellent heat resistance with the prepreg. Under the condition of 288 ° C for 10 seconds per impact, there is no delamination or cracking after 9 impacts. The peel strength between the copper surface and the prepreg after lamination is 5.21b / in.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Densityaaaaaaaaaa
Densityaaaaaaaaaa
Densityaaaaaaaaaa
Login to View More

Abstract

The invention provides browning treatment liquid for a printed circuit board. 1 L of the browning treatment liquid is prepared from 70 g / L-100 g / L of H2SO4, 20 g / L-60 g / L of H2O2, 15 mg / L-100 mg / L of NaCl, 30 mg / L-200 mg / L of CusO4.5H2O, 3 g / L-6 g / L of water-soluble methoxy polyethylene glycol, 4 g / L-12 g / L of a corrosion inhibitor, 2 g / L-3 g / L of 3, 5-dimethyl-2-mercapto benzimidazole, 0.01 g / L-0.5 g / L of polyquaternium-39 and the balance deionized water. The browning treatment liquid has high copper loading capacity, no black brown sediment is generated in a solution, the reactivity of the solution can still be kept even under the discontinuous production condition, and the performance of the solution does not need to be replaced. In addition, the browning treatment liquid is low in work temperature, short in work time, long in service life and suitable for high temperature. The circuit board manufactured through the browning treatment liquid is good in tearing strength, wet resistance and acid resistance, and no pink ring is generated.

Description

technical field [0001] The invention belongs to the technical field of circuit board treatment liquid, and in particular relates to a browning treatment liquid for copper foil surface of printed circuit board. Background technique [0002] With the continuous improvement of thinner and lighter requirements of electronic products, High Density Interconnect-HDI technology of printed circuit boards has aroused great interest, especially the use of Any-layerHDI technology to manufacture electronic products has been recognized by the market. and consumer acceptance. HDI is one of the core technologies of printed circuits, which mainly uses micro-blind buried hole technology. The resulting high-density interconnect circuit board (HDI board) is a printed circuit board with a high circuit density distribution. Any-layer high-density connection board ((Any-layerHDI) is an upgrade of HDI technology, which is manufactured by sequential lamination and build-up (Sequential Buildup). Th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C23C22/52C23F1/18H05K3/38
CPCC23C22/52C23F1/18H05K3/383H05K3/385
Inventor 盛明经陈兵
Owner WUHAN CHUANGXINTE TECH CO LTD
Features
  • Generate Ideas
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com