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Photo-cured adhesive composition capable of adsorbing micro dust

A light-curing, adhesive technology, applied in the direction of adhesives, adhesive types, polyurea/polyurethane adhesives, etc., can solve the problems of inability to coat, poor wettability, low surface tension, etc. Good aging resistance and the effect of increasing the bonding performance

Active Publication Date: 2016-07-06
上海昀通电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Chinese Patent No. CN104830263A discloses "solvent-free polyurethane adhesive for flexible packaging". Group, the B component contains a sulfonated polyimide prepolymer, and the functional group molar ratio NCO / OH=(1.1-2.0):1.0, which has the characteristics of fast curing and high peel strength, and is used for flexible packaging. However, it is a two-component, inconvenient to use, and there is a sharp increase in the viscosity of A and B after the two components are mixed, resulting in uneven coating or even coating failure; in addition, the molecular weight of the solvent-free adhesive is much smaller than that of the solvent Type adhesive, there are many problems such as low surface tension and poor wettability

Method used

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  • Photo-cured adhesive composition capable of adsorbing micro dust

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preparation example Construction

[0041] A preparation method for a photocurable adhesive composition capable of absorbing dust, comprising the following steps:

[0042] According to the ratio requirements. The adhesive composition of the present invention can be prepared by putting each raw material of the adhesive composition into the mixing tank in turn, and stirring according to a certain speed and time. The preparation process is carried out at normal temperature and pressure, and needs to be protected from light.

Embodiment 1

[0044]In the first step, weigh 45kg of urethane acrylate oligomer with a surface tension of 48dyne / cm and a viscosity of 8000mPa.s, 20kg of isodecyl acrylate and 30kg of isooctyl acrylate and put them into the mixing tank for stirring. The stirring speed is set to About 60-120rpm, stirring for about 10 minutes; the second step, weigh 3kg 1-hydroxycyclohexyl phenyl ketone and 1kg 2,4,6-trimethylbenzoyl-diphenylphosphine oxide or put it into the mixing tank Stir in the middle, the stirring speed is set at about 100-120rpm, and the stirring time is about 20 minutes; the third step, put 1kg of carbon black into the mixing tank and stir, the stirring speed is set at about 15-30rpm, the stirring time is 25 minutes, and finally the mixture Filter packs.

[0045] In this embodiment, the mass ratio of isodecyl acrylate to isooctyl acrylate is 2:3. The combined use of these two acrylates is beneficial to increase the elasticity of the adhesive composition and further enhance the adsorpt...

Embodiment 2

[0048] In the first step, 35kg of polyurethane acrylate oligomer with a surface tension of 48dyne / cm and a viscosity of 10000mPa.s, 18kg of isodecyl acrylate, 25kg of hydroxyethyl acrylate and 13kg of hydroxypropyl acrylate were weighed and put into the mixing tank for Stirring, the stirring speed is set at about 60-120rpm, stirring for about 10 minutes; the second step, 1kg2-methyl-1-(4-methylthiophenyl)-2-morpholino-1-propanone, 0.5 kg isopropylthioxanthone (2,4 isomer mixture), 1kg p-N,N-dimethylaminobenzoic acid isooctyl ester, 2.5kg o-benzoylbenzoic acid methyl ester and 4-(N,N -Dimethylamino) ethyl benzoate is weighed or dropped into the stirring tank and stirred, and the stirring speed is set at about 100-120rpm, and the stirring time is about 20 minutes; the third step, 4kg carbon black is dropped into the stirring tank and stirred, and the stirring speed is set at It is about 15-30rpm, the stirring time is 25 minutes, and finally the mixture is filtered and packaged. ...

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Abstract

The invention discloses a photo-cured adhesive composition capable of adsorbing micro dust. The photo-cured adhesive composition comprises the following components in percentage by mass: 30-70% of polyurethane acrylate oligomer, 20-60% of an acrylate monomer, 1-6% of a photo-initiator, and 0.1-5% of carbon black, wherein the surface tension of the polyurethane acrylate oligomer is 48dyne / cm or above, and the viscosity of the polyurethane acrylate oligomer at 25 DEG C is 8000-10000mPa.s. The photo-cured adhesive composition capable of adsorbing micro dust, disclosed by the invention, adopts polyurethane as a base adhesive, is relatively good in aging resistance, is cured by UV light, cannot be influenced by the environment temperature, and avoids the problem of damage to non-temperature-resistant parts in a camera module due to heating for shortening the curing time; meanwhile, the acrylate monomer is introduced, so that the adhesive property of the polyurethane material is improved, and the adhesive is a solvent-free adhesive which is pollution-free and is high in safety.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to a photocurable adhesive composition capable of absorbing fine dust; and relates to their preparation method and their application. Background technique [0002] Polyurethane (PU) adhesives are a class of high polymers polymerized from isocyanates and oligomer polyols. Because its main chain contains a large number of carbamate groups, it endows polyurethane materials with the advantages of high strength, high wear resistance, high elasticity and excellent low temperature resistance, and its hardness can be adjusted in a wide range , so it is widely used in many fields such as adhesives, coatings and composite materials. [0003] Modern life has continuously improved the imaging definition requirements of cameras, and camera manufacturers have continuously improved the lens pixels to meet consumers' requirements for clarity. The existing camera modules of mobile ph...

Claims

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Application Information

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IPC IPC(8): C09J175/14C09J11/04
CPCC08K3/04C09J11/04C09J175/14
Inventor 温万忠
Owner 上海昀通电子科技有限公司
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