Method for manufacturing copper-magnesium alloy stranded wire for cold tinned railway
A copper-magnesium alloy and cold tin-plating technology, applied in the field of railway stranded wires, can solve the problems of paralysis of the catenary system, high temperature of the contact point, deterioration of the connection quality, etc. The effect of prolonged rust time
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Embodiment 1
[0023] A preparation method of copper-magnesium alloy stranded wire for cold-tinning railway, comprising the following steps:
[0024] (1) Connecting and extruding the copper-magnesium alloy rod and repeatedly drawing it to form a copper-magnesium alloy monofilament blank;
[0025] (2) surface-treating the copper-magnesium alloy monofilament blank; adopting a mixed solution of imidazole compound and sugar alcohol as the surface treatment liquid;
[0026] (3) The copper-magnesium alloy monofilament billet processed by the surface treatment liquid is repeatedly blown and washed;
[0027] (4) pickling the copper-magnesium alloy monofilament blank that step (3) obtains;
[0028] (5) the copper-magnesium alloy monofilament billet that pickling is blown dry is placed in the electroplating bath and carries out electroplating tin;
[0029] (6) Using a wire drawing machine to draw the copper-magnesium alloy monofilament blank multiple times to make a copper-magnesium alloy monofilame...
Embodiment 2
[0039] The difference with embodiment 1 is:
[0040] The concentration of the imidazole compound described in step (2) is 5% by mass.
[0041] The sugar alcohol described in step (2) is sorbitol.
[0042] The concentration of the sugar alcohol described in step (2) is 7% by mass.
[0043] The concentration of the acid described in step (4) is 80% by mass.
[0044] Electroplating solution described in step (5) comprises 170g / L stannous sulfate, 20g / L potassium citrate, 20g / L amphoteric surfactant and 10g / L alkalized tetraisopropylammonium, the pH of described electroplating solution for 8.
[0045] The process of electroplating tin described in step (5) is carried out under the following conditions: the electroplating bath temperature is 30 ℃, and the cathode current density is 20A / dm 2 , Plating time is 20min.
Embodiment 3
[0047] The difference with embodiment 1 is:
[0048] The concentration of the imidazole compound in the step (2) is 2% by mass.
[0049] The sugar alcohol described in step (2) is xylitol.
[0050] The concentration of the sugar alcohol described in step (2) is 4% by mass.
[0051] The concentration of the acid described in step (4) is 40% by mass.
[0052] Electroplating solution described in step (5) comprises 165g / L stannous sulfate, 18g / L potassium citrate, 18g / L amphoteric surfactant and 6g / L alkalized tetraisopropylammonium, the pH of described electroplating solution for 5.
[0053] The process of electroplating tin described in step (5) is carried out under the following conditions: the electroplating bath temperature is 25 ℃, and the cathode current density is 16A / dm 2 , Plating time is 18min.
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